Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/05/2010US20100193921 Semiconductor die package and method for making the same
08/05/2010US20100193920 Semiconductor device, leadframe and method of encapsulating
08/05/2010US20100193919 Method of forming openings in a semiconductor device and semiconductor device
08/05/2010US20100193918 Embedded scribe lane crack arrest structure for improved ic package reliability of plastic flip chip devices
08/05/2010US20100193914 Semiconductor device, method of manufacturing the same, and electronic apparatus
08/05/2010US20100193903 Three dimensional semiconductor device, method of manufacturing the same and electrical cutoff method for using fuse pattern of the same
08/05/2010US20100193902 Semiconductor device including fuse
08/05/2010US20100193901 Semiconductor device and method for fabricating the same
08/05/2010US20100193894 Semiconductor device
08/05/2010US20100193880 Semiconductor device and method of forming the same
08/05/2010US20100193868 High-voltage variable breakdown voltage (bv) diode for electrostatic discharge (esd) applications
08/05/2010US20100193831 Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
08/05/2010US20100193801 Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same
08/05/2010US20100193800 Semiconductor device
08/05/2010US20100193787 Semiconductor device
08/05/2010US20100193786 Structures for measuring misalignment of patterns
08/05/2010US20100193468 Method for edge sealing barrier films
08/05/2010US20100193240 Device
08/05/2010US20100193173 Heat sinks and method of formation
08/05/2010DE202010006879U1 Vorrichtung zum Verbinden von Bauelementen mit Solarzellen A device for connecting construction elements with solar cells
08/05/2010DE202010006658U1 Oberflächenmontierbares Gehäuse für Bauelementeanordnungen für unterschiedliche optische Öffnungswinkel Surface mount housing for device assemblies for different optical aperture angle
08/05/2010DE10348902B4 MIM-Kondensatorstruktur und Herstellungsverfahren MIM capacitor structure and manufacturing method
08/05/2010DE102009031109A1 Wärmeabführeinrichtung Heat rejection
08/05/2010DE102009005879A1 Kühleinrichtung mit einem Rippenkühlkörper Cooling device with cooling fins
08/05/2010DE102009000571A1 Sensor device for use with a housing, has housing base body with contact elements, elastic base part connected with housing base body and chip structure arranged on base part
08/05/2010DE102004062472B4 Verfahren zur Herstellung einer Metallverbindungsleitung unter Verwendung einer bei niedriger Temperatur gebildeten Barrierenmetallschicht A method for producing a metal interconnection using a barrier metal layer formed at a low temperature
08/05/2010DE102004015446B4 Wärmesenke für ein diskretes Halbleiterbauelement und Verfahren zu dessen Herstellung sowie elektronische Komponente A heat sink for a discrete semiconductor device and method of manufacturing the electronic component as well as
08/05/2010DE102004010956B9 Halbleiterbauteil mit einem dünnen Halbleiterchip und einem steifen Verdrahtungssubstrat sowie Verfahren zur Herstellung und Weiterverarbeitung von dünnen Halbleiterchips A semiconductor device comprising a thin semiconductor chip and a rigid wiring substrate and methods of making and further processing of thin semiconductor chips
08/04/2010EP2214461A1 Substrate with semiconductor element mounted thereon
08/04/2010EP2214203A2 Thermally enhanced semiconductor package
08/04/2010EP2214202A2 Metal-ceramic circuit board
08/04/2010EP2214201A1 Process for producing substrate for power module, substrate for power module, and power module
08/04/2010EP2213756A1 Metal-graphite composite material having high thermal conductivity and method for producing the same
08/04/2010EP2213616A1 Method for closing a cavity for at least one microelectronic device
08/04/2010EP2213404A1 Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module
08/04/2010EP2213148A2 Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
08/04/2010EP2212262A2 Process for manufacturing a thermally and/or electrically conducting solid
08/04/2010EP1803154B1 Wireless chip
08/04/2010EP1643420B1 Ic card and ic card manufacturing method
08/04/2010EP1634331B1 Electronic device, information processor, and electromagnetic radiation suppressing member
08/04/2010EP1482552B1 Semiconductor device
08/04/2010CN201541420U Combined structure of fastener and heat conducting component
08/04/2010CN201540906U LED heat conducting and radiating encapsulation structure
08/04/2010CN201540893U LDMOS power device with buried layer
08/04/2010CN201540892U OLED device with double-sided display function
08/04/2010CN201540891U White light LED
08/04/2010CN201540890U Multifunctional flat five-pin frame for encapsulation
08/04/2010CN201540889U Flat leadless package part of integrated circuit
08/04/2010CN201540888U Assembling structure of diode
08/04/2010CN201540550U Touch control system
08/04/2010CN201539840U Radiating module and backlight module by adopting radiating module
08/04/2010CN201539839U LED module radiating fin structure
08/04/2010CN201539834U Cooling packaging structure for LED streetlamp
08/04/2010CN201539821U Cooling device for LED lamp
08/04/2010CN201539776U LED road lamp
08/04/2010CN201539719U LED illumination lamp and LED lamp core
08/04/2010CN201539718U LED lamp core and LED illumination lamp
08/04/2010CN1989503B Method for optimizing high frequency performance of via structures
08/04/2010CN1975948B Sheet capacitor
08/04/2010CN1956180B Substrate structure of electronic device packed by liquid resin drip
08/04/2010CN1551724B Thermosyphon and method for producing it
08/04/2010CN1534777B Semiconductor device with protective ring
08/04/2010CN101796637A Thermally enhanced thin semiconductor package
08/04/2010CN101796636A Chip connection method
08/04/2010CN101796635A Method and device for cooling a heat generating component
08/04/2010CN101796634A Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof
08/04/2010CN101796633A Reinforced structure for a stack of layers in a semiconductor component
08/04/2010CN101796619A Circuit board and display device
08/04/2010CN101796106A Insulating sheet and multilayer structure
08/04/2010CN101795530A Circuit board and method for constructing the same
08/04/2010CN101795052A Novel valve module of converter valve for high-voltage direct-current power transmission based on thyristor
08/04/2010CN101795051A Valve module of thyristor current change valve used for high-voltage DC transmission
08/04/2010CN101794942A Elastic contact and method of manufacturing the same, and contact substrate and method of manufacturing the same
08/04/2010CN101794852A Lighting emitting device package and fabrication method thereof
08/04/2010CN101794810A Organic light-emitting display apparatus
08/04/2010CN101794800A Solid-state imaging device and electronic device
08/04/2010CN101794781A Monolithic semiconductor switches and method for manufacturing
08/04/2010CN101794779A Insulated gate type semiconductor device
08/04/2010CN101794775A A spiral inductor formed in a semiconductor substrate and a method for forming the inductor
08/04/2010CN101794774A Semiconductor integrated circuit
08/04/2010CN101794771A SIP (Session Initiation Protocol) chip and SOC (System On Chip) thereof
08/04/2010CN101794770A 显示设备及其制造方法 The display device and manufacturing method thereof
08/04/2010CN101794769A Fuse circuit and layout method of the same
08/04/2010CN101794767A Mechanical press mounting structure of group large-power flat-plate power electronic device
08/04/2010CN101794764A Light emitting module with high heat-conducting and light-conducting functions and application device thereof
08/04/2010CN101794763A Electric connection method of multi-chip integrated LED
08/04/2010CN101794762A Light source module and lighting device
08/04/2010CN101794761A Lead frame for use in IC packaging
08/04/2010CN101794760A High current semiconductor power soic package
08/04/2010CN101794759A Lead frame and method of manufacturing semiconductor device
08/04/2010CN101794758A Semiconductor device
08/04/2010CN101794757A Substrate and chip package structure
08/04/2010CN101794756A Cooling device with a ridge cooler
08/04/2010CN101794755A Heat pipe with flat end face
08/04/2010CN101794754A Semiconductor device
08/04/2010CN101794753A Method for preparing micro-system radiating device
08/04/2010CN101794752A Fully encapsulated type packaging structure of assembled/inversely assembled heat dissipation block with mount pad embedded chip
08/04/2010CN101794751A Island embedded chip rightly mounted package structure with rectangular heat dissipation block
08/04/2010CN101794750A Island embedded chip rightly mounted package structure with heat dissipation block
08/04/2010CN101794749A Fully encapsulated type packaging structure of assembled heat dissipation block with mount pad embedded chip
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