Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2010
07/22/2010DE102009044494A1 Halbleiterdiode Semiconductor diode
07/22/2010DE102008058189A1 Feuchtigkeitsdichtes Leistungshalbleitermodul mit Zentriereinrichtung Moisture-proof power semiconductor module with centering
07/22/2010DE10196418B4 Lasersystem zum Bearbeiten von Verbindungen eines IC-Bauelements, Verfahren zum Bearbeiten von Verbindungen eines IC-Bauelements und Verfahren zum Ausrichten eines Laserbearbeitungsstrahls auf eine Verbindung eines IC-Bauelements A laser system for processing links of an IC device, method for processing connections of an IC device and method for aligning a laser processing beam to a link of an IC device
07/21/2010EP2209142A1 Semiconductor device and manufacturing method thereof
07/21/2010EP2209141A2 Solid-state imaging device and electronic apparatus
07/21/2010EP2209136A1 Gold alloy wire for ball bonding
07/21/2010EP2208801A1 Bonding wire
07/21/2010EP2208226A1 Proximity communication package for processor, cache and memory
07/21/2010EP2208225A1 Power semiconductor module
07/21/2010EP2208223A2 Electronic assemblies without solder and methods for their manufacture
07/21/2010EP2207674A2 Thermal interface material with thin transfer film or metallization
07/21/2010EP1553067B1 Method for producing aluminum nitride sintered compact
07/21/2010EP1016139B1 Rf power device having voltage controlled linearity
07/21/2010CN201532952U Leading wire of 3A Schottky diode
07/21/2010CN201532949U Insulated gate double-pole transistor system
07/21/2010CN201532948U Integrally packaged TN frame structure
07/21/2010CN201532947U IC and LED lamp packages
07/21/2010CN201532946U Control cabinet combined thyristor air duct for cold rolling mill
07/21/2010CN201531855U LED backlight heat radiating device
07/21/2010CN201531854U Heat energy gathering board with fins and heat pipes of LED lighting lamp
07/21/2010CN201531853U Heat dissipation apparatus and radiator member used for LED lamp
07/21/2010CN201531851U High heat lamp separating main body from heat radiation body
07/21/2010CN201531790U Full-range efficient heat radiating LED street lamp
07/21/2010CN1997271B Heat radiator and its making method
07/21/2010CN1983612B Semiconductor device and manufacturing method thereof
07/21/2010CN1967815B Wafer product and processing method therefor
07/21/2010CN1947248B Treatment of service layer of a multi-layer structure and its device
07/21/2010CN1894435B Method for producing metal-based carbon fiber composite material
07/21/2010CN1825578B Semiconductor device and its manufacturing method
07/21/2010CN1802747B Electronic device, information processor, and electromagnetic radiation suppressing device
07/21/2010CN1685502B High frequency signal transmission structure
07/21/2010CN1658744B Liquid cooling system and an electronic apparatus
07/21/2010CN101785375A Water jacket
07/21/2010CN101785110A RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction
07/21/2010CN101785109A RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks
07/21/2010CN101785108A Electrostatic discharge protection device of output driver stage
07/21/2010CN101785107A Method for marking wafers
07/21/2010CN101785106A Semiconductor device including semiconductor constituent and manufacturing method thereof
07/21/2010CN101785105A Redistribution structures for microfeature workpieces
07/21/2010CN101785104A Module construction and connection technology by means of metal scrap web or bent stamping parts bent from a plane
07/21/2010CN101785103A Low resistance through-wafer via
07/21/2010CN101785102A Apparatus with heating part
07/21/2010CN101785101A Microelectronic package element and method of fabricating thereof
07/21/2010CN101785100A 电子零件 Electronic Parts
07/21/2010CN101785099A 电子零件 Electronic Parts
07/21/2010CN101785098A Microelectronic package and method of forming same
07/21/2010CN101785097A 电子零件 Electronic Parts
07/21/2010CN101785093A semiconductor assemblies and methods of manufacturing such assemblies
07/21/2010CN101785090A Semiconductor device manufacturing method, semiconductor device manufacturing apparatus and storage medium
07/21/2010CN101784579A One-pack type epoxy resin composition and use thereof
07/21/2010CN101784177A Heat radiating structure of thinned electronic structure
07/21/2010CN101784176A Insulated heat radiation structure of electronic part
07/21/2010CN101784156A Circuit board and preparation method thereof
07/21/2010CN101783667A Complementary metal oxide semiconductor switch
07/21/2010CN101783579A Power inverter
07/21/2010CN101783431A Complementary metal coupling line
07/21/2010CN101783370A Solar cell module
07/21/2010CN101783362A Upper cover structure, packaging structure of luminous element and packaging method for luminous element
07/21/2010CN101783355A Thermoelectric semiconductor device
07/21/2010CN101783353A Array substrate and method of manufacturing the same
07/21/2010CN101783344A Power transistor chip with built-in starting transistor and application circuit thereof
07/21/2010CN101783343A Electro-static discharge protective circuit and integrated circuit
07/21/2010CN101783339A Electronic element module
07/21/2010CN101783337A Electronic device
07/21/2010CN101783336A Complementary metal transmission line structure
07/21/2010CN101783335A Semiconductor device
07/21/2010CN101783334A Packaging carrier plate structure and realizing method thereof
07/21/2010CN101783333A Structure for improving flip chip base plate deformation
07/21/2010CN101783332A Circuit board and preparation process thereof
07/21/2010CN101783331A System-in-package structure and package method
07/21/2010CN101783330A Chip-type solid discharging tube
07/21/2010CN101783329A Semiconductor component and manufacturing method thereof
07/21/2010CN101783328A Radiating block package structure with locking hole for normal installation of printed circuit board chip
07/21/2010CN101783327A Integrated circuit chip encapsulation assembly
07/21/2010CN101783326A high-frequency semiconductor apparatus
07/21/2010CN101783314A Method of forming an isolation structure and corresponding device
07/21/2010CN101783301A Heterogeneous material bonding method
07/21/2010CN101783290A Method for forming a patterned thick metallization atop a power semiconductor chip
07/21/2010CN101782703A Pixel array
07/21/2010CN101409278B Planar display and IC chip for display
07/21/2010CN101405863B Semiconductor devices and electrical parts manufacturing using metal coated wires
07/21/2010CN101383337B Programmable phase change material structure and its forming method
07/21/2010CN101355043B Encapsulation body for electronic element and preparation method thereof
07/21/2010CN101345242B A spiral inductor formed in a semiconductor substrate and a method for forming the inductor
07/21/2010CN101320702B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/21/2010CN101312226B Luminous diode base structure possessing horizontal heat diffusion member
07/21/2010CN101312170B Line component
07/21/2010CN101304032B Pixel structure and drive method thereof
07/21/2010CN101286494B Semiconductor structure and its manufacture method
07/21/2010CN101276762B 多芯片堆叠结构及其制法 Multi-chip stack structure Jiqizhifa
07/21/2010CN101253615B Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target
07/21/2010CN101232000B Wireless overall interconnect line assembly based on aluminum nitride heat conduction layer
07/21/2010CN101226922B SICOH dielectric and its forming method
07/21/2010CN101202259B Chip stack encapsulation structure, inner embedded type chip packaging structure and method of manufacture
07/21/2010CN101127361B Pixel structure and LCD panel
07/21/2010CN101118920B Submount type high voltage light emitting diode wafer having resistance
07/21/2010CN101114412B Electronic ink display panel
07/21/2010CN101040386B Semiconductor device and its manufacturing method
07/20/2010US7760508 Thermal management device for multiple heat producing devices
07/20/2010US7760504 Apparatus, system, and method for thermal conduction interfacing
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