Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/10/2010US7772689 Semiconductor package with a conductive post and wiring pattern
08/10/2010US7772688 Electronic circuit unit
08/10/2010US7772687 Multiple electronic component containing substrate
08/10/2010US7772686 Memory card fabricated using SiP/SMT hybrid technology
08/10/2010US7772685 Stacked semiconductor structure and fabrication method thereof
08/10/2010US7772684 Electronic device and production method thereof
08/10/2010US7772683 Stacked integrated circuit package-in-package system
08/10/2010US7772682 Moisture protection metal enclosure
08/10/2010US7772680 Arrangements of fuse-type constructions
08/10/2010US7772678 Metallic compound thin film that contains high-k dielectric metal, nitrogen, and oxygen
08/10/2010US7772652 Semiconductor component arrangement having a first and second region
08/10/2010US7772650 Layout structure of electrostatic discharge protection circuit
08/10/2010US7772635 Non-volatile memory device with tensile strained silicon layer
08/10/2010US7772590 Metal comb structures, methods for their fabrication and failure analysis
08/10/2010US7772344 polyphenylene is formed by a Diels-Alder reaction between a diene group-containing compound and a dienophile group-containing compound and these compounds contain at least four ether groups; a biscyclopentadienone and an aromatic diacetylene; can withstand chemical mechanical polishing; dielectric
08/10/2010US7772130 Insulation film forming method, insulation film forming system, and semiconductor device manufacturing method
08/10/2010US7772121 Method of forming a trench structure
08/10/2010US7772118 Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same
08/10/2010US7772117 Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications
08/10/2010US7772111 Substrate processing method and fabrication process of a semiconductor device
08/10/2010US7772045 Wire bond method for angularly disposed conductive pads and a device made from the method
08/10/2010US7772044 Method of manufacturing a semiconductor device including plural semiconductor chips
08/10/2010US7772039 Procedure for arranging chips of a first substrate on a second substrate
08/10/2010US7771210 Connector with wipe
08/10/2010US7770630 Modular capillary pumped loop cooling system
08/05/2010WO2010088140A2 Method and apparatus for performing rlc modeling and extraction for three-dimensional integrated circuit (3d-ic) designs
08/05/2010WO2010088124A2 Semiconductor device having a diamond substrate heat spreader
08/05/2010WO2010087856A1 Integrated-circuit attachment structure with solder balls and pins
08/05/2010WO2010087432A1 Heat dissipating base body and electronic device using same
08/05/2010WO2010087407A1 Semiconductor device and power supply circuit
08/05/2010WO2010087402A1 Prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
08/05/2010WO2010087392A1 Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power
08/05/2010WO2010087362A1 Film formation method, and plasma film formation apparatus
08/05/2010WO2010087336A1 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, and three-dimensional structure, on the surface of which wiring is provided and fabrication method thereof
08/05/2010WO2010086952A1 Semiconductor device and method for manufacturing same
08/05/2010WO2010086936A1 Semiconductor device, electronic apparatus using semiconductor device and method for manufacturing semiconductor device
08/05/2010WO2010086930A1 Method for manufacturing semiconductor device
08/05/2010WO2010086926A1 Optical device and method for manufacturing same
08/05/2010WO2010086282A1 Composite component and method for producing a composite component
08/05/2010WO2010027658A3 Methods and apparatus for integrated circuit having integrated energy storage device
08/05/2010WO2010014408A3 Method and apparatus for forming i/o clusters in integrated circuits
08/05/2010US20100198958 Real-time feedback for policies for computing system management
08/05/2010US20100197117 Mixed-scale electronic interfaces
08/05/2010US20100197105 Semiconductor integrated circuit device and process for manufacturing the same
08/05/2010US20100197079 Semiconductor device including semiconductor elements mounted on base plate
08/05/2010US20100197058 Thin film transistor panel and manufacturing method thereof
08/05/2010US20100197055 Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
08/05/2010US20100193974 Substrate with Check Mark and Method of Inspecting Position Accuracy of Conductive Glue Dispensed on the Substrate
08/05/2010US20100193973 Semiconductor wafer coated with a filled, spin-coatable material
08/05/2010US20100193972 Spherical sintered ferrite particles, resin composition for semiconductor encapsulation comprising them and semiconductor devices produced by using the same
08/05/2010US20100193971 Positive photosensitive resin composition for spray coating, method for forming cured film using the same, cured film, and semiconductor device
08/05/2010US20100193970 Micro pin grid array with pin motion isolation
08/05/2010US20100193969 Dicing tape-integrated wafer back surface protective film
08/05/2010US20100193968 Dicing tape-integrated wafer back surface protective film
08/05/2010US20100193967 Dicing tape-integrated wafer back surface protective film
08/05/2010US20100193966 Contact Structures and Semiconductor Devices Including the Same
08/05/2010US20100193965 Semiconductor device having wirings formed by damascene
08/05/2010US20100193964 method of making 3d integrated circuits and structures formed thereby
08/05/2010US20100193963 Void sealing in a dielectric material of a contact level of a semiconductor device comprising closely spaced transistors
08/05/2010US20100193962 Semiconductor device
08/05/2010US20100193961 Adhesive composition for electronic components, and adhesive sheet for electronic components using the same
08/05/2010US20100193960 Semiconductor device, method for making pattern layout, method for making mask pattern, method for making layout, method for manufacturing photo mask, photo mask, and method for manufacturing semiconductor device
08/05/2010US20100193959 Redistribution Layer Power Grid
08/05/2010US20100193958 Semiconductor Device and a Method of Manufacturing the Same
08/05/2010US20100193957 Semiconductor device and method for producing the same
08/05/2010US20100193956 Multi-layer metal wiring of semiconductor device preventing mutual metal diffusion between metal wirings and method for forming the same
08/05/2010US20100193955 Plasma-enhanced atomic layer deposition of conductive material over dielectric layers
08/05/2010US20100193954 Barrier Structures and Methods for Through Substrate Vias
08/05/2010US20100193953 Semiconductor device and method for manufacturing same
08/05/2010US20100193952 Integrated circuit die containing particale-filled through-silicon metal vias with reduced thermal expansion
08/05/2010US20100193951 Metal precursors for deposition of metal-containing films
08/05/2010US20100193950 Wafer level, chip scale semiconductor device packaging compositions, and methods relating thereto
08/05/2010US20100193949 Novel structure of ubm and solder bumps and methods of fabrication
08/05/2010US20100193948 Semiconductor device, printed wiring board for mounting the semiconductor device and connecting structure for these
08/05/2010US20100193947 Flip Chip Interconnection Having Narrow Interconnection Sites on the Substrate
08/05/2010US20100193946 Semiconductor module and manufacturing method thereof
08/05/2010US20100193945 Reinforced structure for a stack of layers in a semiconductor component
08/05/2010US20100193944 Semiconductor Flip-Chip System Having Oblong Connectors and Reduced Trace Pitches
08/05/2010US20100193943 Semiconductor Device Having a Diamond Substrate Heat Spreader
08/05/2010US20100193942 Thermally Enhanced Semiconductor Package
08/05/2010US20100193941 Semiconductor device
08/05/2010US20100193940 Wafer level package and method of manufacturing the same
08/05/2010US20100193939 Wiring substrate, electronic device, and electronic device mounting structure
08/05/2010US20100193938 Semiconductor device including semiconductor constituent and manufacturing method thereof
08/05/2010US20100193937 Semiconductor module
08/05/2010US20100193936 Semiconductor device
08/05/2010US20100193935 Integrated antennas in wafer level package
08/05/2010US20100193934 Semiconductor device, a method of manufacturing the same and an electronic device
08/05/2010US20100193933 Semiconductor device and method of manufacturing the semiconductor device
08/05/2010US20100193932 Wafer level package for heat dissipation and method of manufacturing the same
08/05/2010US20100193931 Package-on-Package Using Through-Hole Via Die on Saw Streets
08/05/2010US20100193930 Multi-chip semiconductor devices having conductive vias and methods of forming the same
08/05/2010US20100193929 Semiconductor device
08/05/2010US20100193928 Semiconductor device
08/05/2010US20100193927 Memory card and method for manufacturing memory card
08/05/2010US20100193926 Integrated circuit package system with offset stacked die
08/05/2010US20100193925 Leadframe for semiconductor packages
08/05/2010US20100193924 Semiconductor device
08/05/2010US20100193923 Semiconductor Device and Manufacturing Method Therefor
08/05/2010US20100193922 Semiconductor chip package
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