Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/17/2010WO2010067546A1 Semiconductor-sealing resin composition, method for producing semiconductor device, and semiconductor device
06/17/2010WO2010067538A1 Granulated epoxy resin composition for semiconductor encapsulation, semiconductor device using same, and method for manufacturing semiconductor device
06/17/2010WO2010067481A1 Semiconductor integrated circuit device and method for designing the same
06/17/2010WO2010066484A1 Rectifier module with cooled busbar
06/17/2010WO2010066483A1 Rectifier module with cooled busbar
06/17/2010WO2010066089A1 Heat dissipation component for led, led, and led lamp
06/17/2010US20100153788 Semiconductor device
06/17/2010US20100151679 System for modifying small structures
06/17/2010US20100151675 Wiring structure and method for manufacturing the same
06/17/2010US20100151598 Temporary package for at-speed functional test of semiconductor chip
06/17/2010US20100151323 Electrode, electrode paste and electronic parts using the same
06/17/2010US20100150757 Circuit board adapted to fan and fan structure
06/17/2010US20100149855 Integrated circuitry for semiconductor memory
06/17/2010US20100149775 Tape circuit substrate with reduced size of base film
06/17/2010US20100149773 Integrated circuit packages having shared die-to-die contacts and methods to manufacture the same
06/17/2010US20100149770 Semiconductor stack package
06/17/2010US20100149410 Electronic component apparatus
06/17/2010US20100148381 Semiconductor device
06/17/2010US20100148380 Thermosetting epoxy resin composition and semiconductor device
06/17/2010US20100148379 Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same
06/17/2010US20100148378 Thermosetting silicone resin composition, silicone resin, silicone resin sheet and use thereof
06/17/2010US20100148377 Intermediate structure of semiconductor device and method of manufacturing the same
06/17/2010US20100148376 Flip chip mounting process and flip chip assembly
06/17/2010US20100148375 Vertically Tapered Transmission Line for Optimal Signal Transition in High-Speed Multi-Layer Ball Grid Array Packages
06/17/2010US20100148374 Method for low stress flip-chip assembly of fine-pitch semiconductor devices
06/17/2010US20100148373 Stacked Die Parallel Plate Capacitor
06/17/2010US20100148372 Integrated circuit package having reduced interconnects
06/17/2010US20100148371 Via First Plus Via Last Technique for IC Interconnects
06/17/2010US20100148370 Through-silicon via and method for forming the same
06/17/2010US20100148369 Wire bonding method and semiconductor device
06/17/2010US20100148368 Semiconductor device
06/17/2010US20100148367 Semiconductor device and method for fabricating the same
06/17/2010US20100148366 Grain growth promotion layer for semiconductor interconnect structures
06/17/2010US20100148365 Grid array connection device and method
06/17/2010US20100148364 Semiconductor device and method for producing semiconductor device
06/17/2010US20100148363 Step cavity for enhanced drop test performance in ball grid array package
06/17/2010US20100148362 Semiconductor device and method for fabricating the same
06/17/2010US20100148361 Semiconductor device and method for fabricating the same
06/17/2010US20100148360 Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
06/17/2010US20100148359 Package on Package Assembly using Electrically Conductive Adhesive Material
06/17/2010US20100148358 Semiconductor device with a high thermal dissipation efficiency
06/17/2010US20100148357 Method of packaging integrated circuit dies with thermal dissipation capability
06/17/2010US20100148356 Stacked semiconductor device and manufacturing method thereof
06/17/2010US20100148355 Integrated circuit package system employing wafer level chip scale packaging
06/17/2010US20100148354 Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
06/17/2010US20100148353 Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures
06/17/2010US20100148352 Grid array packages and assemblies including the same
06/17/2010US20100148351 Method of packaging integrated circuit devices using preformed carrier
06/17/2010US20100148350 Semiconductor device and method for manufacturing the same
06/17/2010US20100148348 Package substrate
06/17/2010US20100148347 Chip scale package structure with can attachment
06/17/2010US20100148346 Semiconductor die package including low stress configuration
06/17/2010US20100148345 Electronic devices including flexible electrical circuits and related methods
06/17/2010US20100148344 Integrated circuit package system with input/output expansion
06/17/2010US20100148343 Side stacking apparatus and method
06/17/2010US20100148341 Semiconductor device and method for manufacturing the same
06/17/2010US20100148340 Semiconductor device and method of manufacturing the same
06/17/2010US20100148339 Process for fabricating a semiconductor component support, support and semiconductor device
06/17/2010US20100148337 Stackable semiconductor package and process to manufacture same
06/17/2010US20100148336 Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof
06/17/2010US20100148335 Semiconductor package, method of manufacturing same, semiconductor device and electronic device
06/17/2010US20100148334 Intergrated circuit package support system
06/17/2010US20100148333 Packaging millimeter wave modules
06/17/2010US20100148332 Semiconductor apparatus and manufacturing method thereof
06/17/2010US20100148331 Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
06/17/2010US20100148330 Leadless package housing
06/17/2010US20100148329 Quad flat no lead (qfn) integrated circuit (ic) package having a modified paddle and method for designing the package
06/17/2010US20100148328 Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same
06/17/2010US20100148327 Semiconductor die package with clip interconnection
06/17/2010US20100148326 Thermally Enhanced Electronic Package
06/17/2010US20100148325 Semiconductor Dice with Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using the Same, and Methods of Making the Same
06/17/2010US20100148316 Semiconductor Device and Method of Forming Topside and Bottom-side Interconnect Structures Around Core Die with TSV
06/17/2010US20100148315 Semiconductor wafer and a method of separating the same
06/17/2010US20100148314 Semiconductor device and method for manufacuring the same
06/17/2010US20100148313 Semiconductor apparatus and method of manufacturing the same
06/17/2010US20100148312 Reinforced smart cards & methods of making same
06/17/2010US20100148311 Semiconductor device
06/17/2010US20100148293 Miniaturized implantable sensor platform having multiple devices and sub-chips
06/17/2010US20100148292 Semiconductor device
06/17/2010US20100148282 Wafer joining method, wafer composite, and chip
06/17/2010US20100148267 Semiconductor integrated circuit
06/17/2010US20100148263 Semiconductor device structure and fabricating method thereof
06/17/2010US20100148256 Lateral diffused metal oxide semiconductor (ldmos) devices with electrostatic discharge (esd) protection capability in integrated circuit
06/17/2010US20100148247 Semiconductor device
06/17/2010US20100148232 Surface treatment of hydrophobic ferroelectric polymers for printing
06/17/2010US20100148219 Semiconductor integrated circuit device
06/17/2010US20100148218 Semiconductor integrated circuit device and method for designing the same
06/17/2010US20100148207 Semiconductor device, and manufacturing method thereof, and display device and its manufacturing method
06/17/2010US20100148180 Thin film transistor array panel with common bars of different widths
06/17/2010US20100148173 Semiconductor device and fabrication method for the same
06/17/2010US20100148172 Semiconductor device
06/17/2010US20100147492 IGBT cooling method
06/17/2010DE202009010215U1 Adapterklemme für einen Kühler Terminal adapter for a cooler
06/17/2010DE112008001684T5 Verfahren zur Verhinderung der Hohlraumbildung in einer Lötverbindung A method for preventing cavity formation in a solder joint
06/17/2010DE102009036898A1 Kühlsystem zum Abführen von Wärme an elektrischen Einrichtungen Cooling system for dissipating heat on electrical equipment
06/17/2010DE102009000892A1 Verfahren zur Schichtapplikation folienförmiger Lotwerkstoffe mittels Ultraschallschweißen A method for application layer of sheet-like solder materials by ultrasonic welding
06/17/2010DE102008062211A1 Method for manufacturing semiconductor component, involves applying electronic component on flexible carrier substrate, and determining reference point at flexible carrier substrate
06/17/2010DE102008062130A1 Verfahren zur Kapselung einer elektronischen Anordnung A method for encapsulating an electronic arrangement
06/17/2010CA2745219A1 An arrangement related to a gas sensor
06/16/2010EP2197051A2 Light emitting device and method for manufacturing the same
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