| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/29/2010 | US7745891 Encapsulation component for integrated micro electromechanical system comprising first and second covers |
| 06/29/2010 | US7745882 High-gain bipolar junction transistor compatible with complementary metal-oxide-semiconductor (CMOS) process and method for fabricating the same |
| 06/29/2010 | US7745834 Semiconductor image sensor and method for fabricating the same |
| 06/29/2010 | US7745832 Semiconductor light-emitting element assembly with a composite substrate |
| 06/29/2010 | US7745739 Sealing a controller |
| 06/29/2010 | US7745735 Cross-over of conductive interconnects and a method of crossing conductive interconnects |
| 06/29/2010 | US7745326 Semiconductor device having multiple wiring layers and method of producing the same |
| 06/29/2010 | US7745264 Semiconductor chip with stratified underfill |
| 06/29/2010 | US7745257 High power MCM package with improved planarity and heat dissipation |
| 06/29/2010 | US7745253 Ribbon bonding in an electronic package |
| 06/29/2010 | US7745235 Method for manufacturing semiconductor sensor |
| 06/29/2010 | US7744996 Adhesive structure and method for manufacturing the same |
| 06/29/2010 | US7744802 Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin |
| 06/29/2010 | CA2426110C A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 06/29/2010 | CA2357686C Electronic unit |
| 06/24/2010 | WO2010071426A1 Flexible electronic product and method for manufacturing the same |
| 06/24/2010 | WO2010071092A1 Silanol condensation catalyst, heat-curable silicone resin composition for sealing photosemiconductors and sealed photosemiconductor using same |
| 06/24/2010 | WO2010071031A1 Wiring structure, semiconductor element, wiring substrate, display panel, and display device |
| 06/24/2010 | WO2010070826A1 Method for forming through electrode, and semiconductor device |
| 06/24/2010 | WO2010070753A1 Wafer and method for manufacturing package product |
| 06/24/2010 | WO2010070626A1 High power semiconductor device for wireless applications and method of forming a high power semiconductor device |
| 06/24/2010 | WO2010070390A1 High power semiconductor device for wireless applictions and method of forming a high power semiconductor device |
| 06/24/2010 | WO2010070320A1 Semiconductor device with integrated antenna and manufacturing method therefor |
| 06/24/2010 | WO2010070304A1 Improved die seal ring |
| 06/24/2010 | WO2010069786A1 Surface-mounted shielded multicomponent assembly |
| 06/24/2010 | WO2010069642A1 Component having a via, and a method for producting a component such as this |
| 06/24/2010 | WO2010069077A1 Face-to-face (f2f) hybrid structure for an integrated circuit |
| 06/24/2010 | WO2010049846A3 Semiconductor chip, method of manufacturing a semiconductor chip, and method of testing a semiconductor chip |
| 06/24/2010 | WO2010049087A3 A semiconductor device including a reduced stress configuration for metal pillars |
| 06/24/2010 | WO2010027231A3 Lead frame and manufacturing method thereof |
| 06/24/2010 | WO2010020753A3 Halo-hydrocarbon polymer coating |
| 06/24/2010 | US20100160761 Analyte Monitoring Device and Methods of Use |
| 06/24/2010 | US20100160748 Analyte Monitoring Device and Methods of Use |
| 06/24/2010 | US20100159693 Method of Forming Via Recess in Underlying Conductive Line |
| 06/24/2010 | US20100159690 Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns |
| 06/24/2010 | US20100159689 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same |
| 06/24/2010 | US20100159686 Semiconductor device and method of manufacturing the same |
| 06/24/2010 | US20100159645 Semiconductor apparatus and process of production thereof |
| 06/24/2010 | US20100155969 Resin paste for die bonding, method for manufacturing semiconductor device, and semiconductor device |
| 06/24/2010 | US20100155968 Overlay Metrology Target |
| 06/24/2010 | US20100155967 Integrated circuits on a wafer and method of producing integrated circuits |
| 06/24/2010 | US20100155966 Grid array packages |
| 06/24/2010 | US20100155965 Semiconductor device |
| 06/24/2010 | US20100155964 Adhesive Tape, Semiconductor Package and Electronics |
| 06/24/2010 | US20100155963 Dummy vias for damascene process |
| 06/24/2010 | US20100155962 Semiconductor device and method for fabricating the same |
| 06/24/2010 | US20100155961 Micromechanical component having wafer through-plating and corresponding production method |
| 06/24/2010 | US20100155960 Semiconductor device |
| 06/24/2010 | US20100155959 Semiconductor Devices Having Narrow Conductive Line Patterns and Related Methods of Forming Such Semiconductor Devices |
| 06/24/2010 | US20100155958 Bonding pad structure and manufacturing method thereof |
| 06/24/2010 | US20100155957 Pad layout structure of semiconductor chip |
| 06/24/2010 | US20100155956 Fill patterning for symmetrical circuits |
| 06/24/2010 | US20100155955 Method for manufacturing system-in-package |
| 06/24/2010 | US20100155954 Methods of forming low interface resistance rare earth metal contacts and structures formed thereby |
| 06/24/2010 | US20100155952 Copper interconnection structures and semiconductor devices |
| 06/24/2010 | US20100155951 Copper interconnection structure and method for forming copper interconnections |
| 06/24/2010 | US20100155950 Implementation of a metal barrier in an integrated electronic circuit |
| 06/24/2010 | US20100155949 Low cost process flow for fabrication of metal capping layer over copper interconnects |
| 06/24/2010 | US20100155948 Tooling method for fabricating a semiconductor device and semiconductor devices fabricated thereof |
| 06/24/2010 | US20100155947 Solder joints with enhanced electromigration resistance |
| 06/24/2010 | US20100155946 Solder limiting layer for integrated circuit die copper bumps |
| 06/24/2010 | US20100155945 Semiconductor device |
| 06/24/2010 | US20100155944 Semiconductor device |
| 06/24/2010 | US20100155943 Semiconductor chip used in flip chip process |
| 06/24/2010 | US20100155942 Semiconductor device and method for fabricating the same |
| 06/24/2010 | US20100155941 Semiconductor device |
| 06/24/2010 | US20100155940 Semiconductor device and method of manufacturing the same |
| 06/24/2010 | US20100155939 Circuit board and fabrication method thereof and chip package structure |
| 06/24/2010 | US20100155938 Face-to-face (f2f) hybrid structure for an integrated circuit |
| 06/24/2010 | US20100155937 Wafer structure with conductive bumps and fabrication method thereof |
| 06/24/2010 | US20100155936 Method of thinning a semiconductor substrate |
| 06/24/2010 | US20100155935 Protective coating for semiconductor substrates |
| 06/24/2010 | US20100155934 Molding compound including a carbon nano-tube dispersion |
| 06/24/2010 | US20100155933 Package for semiconductor devices |
| 06/24/2010 | US20100155932 Bonded semiconductor substrate including a cooling mechanism |
| 06/24/2010 | US20100155931 Embedded Through Silicon Stack 3-D Die In A Package Substrate |
| 06/24/2010 | US20100155930 Stackable semiconductor device assemblies |
| 06/24/2010 | US20100155929 Chip-Stacked Package Structure |
| 06/24/2010 | US20100155928 Semiconductor package and manufacturing method of the same |
| 06/24/2010 | US20100155927 Semiconductor packages with stiffening support for power delivery |
| 06/24/2010 | US20100155926 Integrated circuit packaging system for fine pitch substrates and method of manufacture thereof |
| 06/24/2010 | US20100155925 Resin-sealed package and method of producing the same |
| 06/24/2010 | US20100155924 Semiconductor module |
| 06/24/2010 | US20100155923 Microball assembly methods, and packages using maskless microball assemblies |
| 06/24/2010 | US20100155922 Semiconductor Device and Method of Forming Recessed Conductive Vias in Saw Streets |
| 06/24/2010 | US20100155921 Semiconductor apparatus |
| 06/24/2010 | US20100155918 Integrated circuit packaging system with package stacking and method of manufacture thereof |
| 06/24/2010 | US20100155917 Semiconductor device and method for fabricating the same |
| 06/24/2010 | US20100155916 Chip package structure and the method thereof with adhering the chips to a frame and forming ubm layers |
| 06/24/2010 | US20100155915 Stacked power converter structure and method |
| 06/24/2010 | US20100155914 Power Module Having Stacked Flip-Chip and Method of Fabricating the Power Module |
| 06/24/2010 | US20100155913 Thermally enhanced thin semiconductor package |
| 06/24/2010 | US20100155912 Apparatus for shielding integrated circuit devices |
| 06/24/2010 | US20100155909 Method to enhance charge trapping |
| 06/24/2010 | US20100155907 Semiconductor device having an inorganic coating layer applied over a junction termination extension |
| 06/24/2010 | US20100155888 Silicon interposer testing for three dimensional chip stack |
| 06/24/2010 | US20100155886 Semiconductor device |
| 06/24/2010 | US20100155885 Fuse Corner Pad for an Integrated Circuit |
| 06/24/2010 | US20100155884 Melting fuse of semiconductor and method for forming the same |
| 06/24/2010 | US20100155862 Package for electronic component, manufacturing method thereof and sensing apparatus |