Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2010
07/27/2010US7763948 Flexible and elastic dielectric integrated circuit
07/27/2010US7763942 Pixel structure
07/27/2010US7763941 Integrated circuit device having input/output electrostatic discharge protection cell equipped with electrostatic discharge protection element and power clamp
07/27/2010US7763940 Device having a low-voltage trigger element
07/27/2010US7763926 Semiconductor device manufacturing method and semiconductor device
07/27/2010US7763887 Semiconductor device and method of fabricating the same
07/27/2010US7763812 Semiconductor device capable of switching operation modes
07/27/2010US7763811 Housing for an electronic circuit and method for sealing the housing
07/27/2010US7763809 Multilayered substrate for semiconductor device and method of manufacturing same
07/27/2010US7763697 Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor device
07/27/2010US7763535 Method for producing a metal backside contact of a semiconductor component, in particular, a solar cell
07/27/2010US7763497 Structure and method for forming a capacitively coupled chip-to-chip signaling interface
07/27/2010US7763495 Integrated circuit incorporating wire bond inductance
07/27/2010US7763372 Fuel cell formed in a single layer of monocrystalline silicon and fabrication process
07/27/2010US7762184 Production unit including a printing device and upper and lower sealed chambers
07/27/2010US7761982 Method for manufacturing IC-embedded substrate
07/26/2010CA2690795A1 Metal bonded nanotube array
07/22/2010WO2010083268A2 Heat sink with helical fins and electrostatic augmentation
07/22/2010WO2010083092A1 Method of forming trench capacitors and via connections by a chemical-mechanical polishing process for wafer-to-wafer bonding
07/22/2010WO2010082781A2 Trimming device and a wafer on which the trimming device is formed
07/22/2010WO2010082638A1 Cu alloy film and display device
07/22/2010WO2010082637A1 Display device
07/22/2010WO2010082564A1 Fuel gauge circuit and battery pack
07/22/2010WO2010082517A1 Semiconductor device and method for manufacturing same
07/22/2010WO2010082478A1 Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module
07/22/2010WO2010082464A1 Semiconductor device and method for manufacturing same
07/22/2010WO2010082439A1 Etchant composition
07/22/2010WO2010082429A1 Method of manufacturing pattern electrode and pattern electrode
07/22/2010WO2010082329A1 Method for manufacturing package, wafer bonded body, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled clock
07/22/2010WO2010082251A1 Method for manufacturing semiconductor device
07/22/2010WO2010082250A1 Semiconductor device and method for manufacturing same
07/22/2010WO2010082248A1 Semiconductor device, electronic apparatus using same, and method for manufacturing semiconductor device
07/22/2010WO2010082190A1 Secure point of sale terminal
07/22/2010WO2010081795A1 Semiconductor-based submount with electrically conductive feed-throughs
07/22/2010WO2010081767A1 High-yield method of exposing and contacting through-silicon vias
07/22/2010WO2010081517A2 Method for verifying an identification circuit
07/22/2010WO2010081475A2 Evaporator, cooling device and method of manufacture
07/22/2010WO2010081445A1 Method for producing an optoelectronic component and optoelectronic component
07/22/2010WO2010081403A1 Aligned multiple emitter package
07/22/2010WO2010059333A3 Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same
07/22/2010WO2010051211A3 Pre-molded, clip-bonded multi-die semiconductor package
07/22/2010WO2010048102A3 Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
07/22/2010WO2010036676A3 Input/output architecture for mounted processors, and methods of using same
07/22/2010WO2010036051A3 Structure and manufacture method for multi-row lead frame and semiconductor package
07/22/2010WO2009035962A3 Electromagnetic shield formation for integrated circuit die package
07/22/2010US20100185410 Three dimensional chip fabrication
07/22/2010US20100184258 Method and apparatus for forming an integrated circuit electrode having a reduced contact area
07/22/2010US20100182744 Thermal spacer for stacked die package thermal management
07/22/2010US20100182729 Method of operating transistors and structures thereof for improved reliability and lifetime
07/22/2010US20100182073 Semiconductor Component with Annularly-Closed Contacting
07/22/2010US20100182041 3d chip-stack with fuse-type through silicon via
07/22/2010US20100182040 Programmable through silicon via
07/22/2010US20100181688 Semiconductor device and method of manufacturing the same
07/22/2010US20100181687 Semiconductor device including single circuit element
07/22/2010US20100181686 Semiconductor Device
07/22/2010US20100181685 Integrated clock and power distribution
07/22/2010US20100181684 Resin composition, filling material, insulating layer and semiconductor device
07/22/2010US20100181683 Via definition for semiconductor die
07/22/2010US20100181682 Semiconductor device and manufacturing method thereof
07/22/2010US20100181681 Semiconductor device and manufacturing method of the same
07/22/2010US20100181680 Semiconductor device and manufacturing method of the semiconductor device
07/22/2010US20100181679 3d integration of vertical components in reconstituted substrates
07/22/2010US20100181678 Structure with self aligned resist layer on an interconnect surface and method of making same
07/22/2010US20100181677 Structure with self aligned resist layer on an insulating surface and method of making same
07/22/2010US20100181676 Substrate bonding with metal germanium silicon material
07/22/2010US20100181675 Semiconductor package with wedge bonded chip
07/22/2010US20100181674 Electrical contacts for cmos devices and iii-v devices formed on a silicon substrate
07/22/2010US20100181673 Method for fabricating semiconductor device and semiconductor device
07/22/2010US20100181672 Method of fabricating semiconductor device for reducing parasitic capacitance between bit lines and semiconductor device fabricated thereby
07/22/2010US20100181671 Semiconductor devices and methods of manufacturing the same
07/22/2010US20100181670 Contact structure for a semiconductor and method for producing the same
07/22/2010US20100181669 Semiconductor device and method for manufacturing the same
07/22/2010US20100181668 Semiconductor Device and Electronic Apparatus Equipped with the Semiconductor Device
07/22/2010US20100181667 Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
07/22/2010US20100181666 Semiconductor device having lead free solders between semiconductor chip and frame and gabrication method thereof
07/22/2010US20100181665 System and Method of Achieving Mechanical and Thermal Stability in a Multi-Chip Package
07/22/2010US20100181664 Integrated circuit chip package module
07/22/2010US20100181663 Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
07/22/2010US20100181662 Stackable layer containing ball grid array package
07/22/2010US20100181661 Semiconductor device
07/22/2010US20100181659 Lead frames with improved adhesion to plastic encapsulant
07/22/2010US20100181658 Semiconductor device which exposes die pad without covered by interposer and its manufacturing method
07/22/2010US20100181656 Methods of eliminating pattern collapse on photoresist patterns
07/22/2010US20100181654 Manufacturing method of semiconductor device, insulating film for semiconductor device, and manufacturing apparatus of the same
07/22/2010US20100181652 Systems and methods for stiction reduction in mems devices
07/22/2010US20100181650 Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device
07/22/2010US20100181643 Efuse with partial sige layer and design structure therefor
07/22/2010US20100181642 Wafer-level flip chip package with rf passive element/ package signal connection overlay
07/22/2010US20100181639 Semiconductor devices and fabrication methods thereof
07/22/2010US20100181628 Semiconductor device
07/22/2010US20100181627 Semiconductor device and method for manufacturing
07/22/2010US20100181568 Integrated circuits on a wafer and methods for manufacturing integrated circuits
07/22/2010US20100181567 Semiconductor device including bonding pads and semiconductor package including the semiconductor device
07/22/2010US20100181384 Semiconductor Device
07/22/2010US20100181060 Heat radiator of semiconductor package
07/22/2010US20100181056 Porous media cold plate
07/22/2010DE202010004888U1 Externe Wärmevorrichtung und zugehörige elektronische Vorrichtung External heat device and associated electronic device
07/22/2010DE19800178B4 Gehärtetes Produkt einer Epoxyharzmasse zur Halbleitereinkapselung und dessen Verwendung The cured product of an epoxy resin composition for Halbleitereinkapselung and its use
07/22/2010DE112008002270T5 MOS-Strukturen mit einem geringeren Kontaktwiderstand und Verfahren zu deren Herstellung MOS structures with a lower contact resistance, and process for their preparation
07/22/2010DE102009055648A1 Leistungshalbleitermodul The power semiconductor module
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