| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/15/2010 | US20100176498 Power module package having excellent heat sink emission capability and method for manufacturing the same |
| 07/15/2010 | US20100176497 Integrated circuit package-on-package stacking system |
| 07/15/2010 | US20100176496 Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor device |
| 07/15/2010 | US20100176495 Low cost fabrication of double box back gate silicon-on-insulator wafers |
| 07/15/2010 | US20100176494 Through-Silicon Via With Low-K Dielectric Liner |
| 07/15/2010 | US20100176493 Method of splitting a substrate |
| 07/15/2010 | US20100176484 ESD protection device, composite electronic component of the same, manufacturing method of composite substrate, and manufacturing method of ESD protection device |
| 07/15/2010 | US20100176483 Fuse element and semiconductor integrated circuit with the same |
| 07/15/2010 | US20100176481 Memory Device and Manufacturing Method Thereof |
| 07/15/2010 | US20100176453 Low cost fabrication of double box back gate silicon-on-insulator wafers with built-in shallow trench isolation in back gate layer |
| 07/15/2010 | US20100176396 Probe, probe card, and method of production of probe |
| 07/15/2010 | US20100176344 Wavelength-converting casting composition and light-emitting semiconductor component |
| 07/15/2010 | US20100176204 Ic chip |
| 07/15/2010 | DE202009015283U1 Verbindungsstruktur von Kühlrippen für Speicher Connection structure of cooling fins for storage |
| 07/15/2010 | DE19648041B4 Integriertes vertikales Halbleiterbauelement Integrated vertical semiconductor component |
| 07/15/2010 | DE112008002566T5 Wärmeleitfähige Lage und Verfahren zum Herstellen derselben, und Leistungsmodul Heat-conductive sheet and method for manufacturing the same, and power module |
| 07/15/2010 | DE112008002142T5 Vorläuferzusammensetzung für poröse Siliziumdioxid und Verfahren zur Herstellung der Vorläuferzusammensetzung, poröser Siliziumdioxidfilm und Verfahren zur Herstellung des porösen Siliziumdioxidfilms, Halbleiterelement, Gerät zur Anzeige eines Bilds sowie Flüssigkristallanzeige Porous silica precursor composition and method of manufacturing the precursor composition, a porous silica film and method of producing the porous silica film, semiconductor element, apparatus for displaying an image as well as liquid crystal display |
| 07/15/2010 | DE112004002023B4 Film mit niedrieger Dielektrizitätskonstante und Verfahren zur Herstellung desselben sowie elektronische Komponente mit dem Film Niedrieger film with dielectric constant and methods for making the same as well as electronic component with the film |
| 07/15/2010 | DE102009013782A1 Halbleiterverpackungsaufbau mit Schutzleiste Semiconductor package assembly with protective flap |
| 07/15/2010 | DE102009004951A1 Cooling body for electronic component, has cooling pipes accommodated in respective upper grooves of cover, where heat conducting material is provided between cooling pipes and upper grooves, and cover is closely connected to base plate |
| 07/15/2010 | DE102009003936A1 Electrical component has light emitting element, where converter ceramics is arranged at radiation withdrawal surface of light emitting element for converting wavelength of element |
| 07/15/2010 | DE102009000192A1 Sinterwerkstoff, Sinterverbindung sowie Verfahren zum Herstellen eines Sinterverbindung Sintered material, sintered connection and to methods for manufacturing a sintered compound |
| 07/15/2010 | DE102008057831A1 Anordnung mit Leistungshalbleitermodul und Treibereinrichtung Arrangement with power semiconductor module and driver device |
| 07/15/2010 | DE102008044984A1 Halbleiterbauelement mit Verspannungsrelaxationsspalte zur Verbesserung der Chipgehäusewechselwirkungsstabilität A semiconductor device comprising Verspannungsrelaxationsspalte to improve the chip housing interaction stability |
| 07/15/2010 | DE102006005420B4 Stapelbares Halbleiterbauteil und Verfahren zur Herstellung desselben A stackable semiconductor device and method of manufacturing the same |
| 07/15/2010 | CA2747655A1 Telephony and digital media services device |
| 07/14/2010 | EP2207201A2 Cooling unit and flow distributing element for use in such unit |
| 07/14/2010 | EP2207198A2 Manufacturing method of a semiconductor device |
| 07/14/2010 | EP2207195A1 Device and device manufacturing method |
| 07/14/2010 | EP2206562A2 Apparatus and method for pulsed dispensing of liquid |
| 07/14/2010 | EP2206422A1 Cooling member |
| 07/14/2010 | EP2206173A1 High aperture ratio pixel layout for display device |
| 07/14/2010 | EP2206149A2 Hf chip module, hf assembly and method for producing an hf assembly |
| 07/14/2010 | EP2206148A2 Rf-ic packaging method and circuits obtained thereby |
| 07/14/2010 | EP2206147A2 Fixing clamp |
| 07/14/2010 | EP2206145A2 Flip chip interconnection with double post |
| 07/14/2010 | EP1360719B1 Molds for wafer scale molding of protective caps |
| 07/14/2010 | EP1356515B1 Molding assembly for wafer scale molding of protective caps |
| 07/14/2010 | EP1356514B1 Use of infrared radiation in molding of protective caps |
| 07/14/2010 | CN201528502U Heat radiation module and fixing seat thereof |
| 07/14/2010 | CN201528497U Radiator fixing device |
| 07/14/2010 | CN201527989U Bracket Improvement of light-emitting diode (LED) |
| 07/14/2010 | CN201527975U Power transistor in copper wire structure |
| 07/14/2010 | CN201527974U TSSOP8 encapsulating lead frame structure |
| 07/14/2010 | CN201527973U TSSOP6 lead frame structure |
| 07/14/2010 | CN201527972U Thin-type power module |
| 07/14/2010 | CN201527971U Structure of cross-type DIP8 lead frame |
| 07/14/2010 | CN201527970U SOP8 encapsulating lead frame structure |
| 07/14/2010 | CN201527969U Lead frame and paddle structure in integrated circuit package |
| 07/14/2010 | CN201527968U Radiating enhanced integrated circuit packaging structure |
| 07/14/2010 | CN201527967U Heat treatment device for sealing PLC |
| 07/14/2010 | CN201526932U Radiating structure of element of light-emitting diode (LED) |
| 07/14/2010 | CN201526928U Combined type heat pipe radiator of super power LED street lamp |
| 07/14/2010 | CN201526916U LED chip rack provided with temperature-uniforming plate |
| 07/14/2010 | CN201526838U LED lamp with built-in radiator |
| 07/14/2010 | CN201526823U White light LED light source and street lamp applying same |
| 07/14/2010 | CN1897277B Semiconductor device |
| 07/14/2010 | CN1862796B Semiconductor device chip and semiconductor device chip package |
| 07/14/2010 | CN1768112B Epoxy resin molding material for sealing use and semiconductor device |
| 07/14/2010 | CN101779527A Split wave compensation for open stubs |
| 07/14/2010 | CN101779286A Stress relief of a semiconductor device |
| 07/14/2010 | CN101779285A Unit and production of a unit |
| 07/14/2010 | CN101779281A Method for packing semiconductor components, and product produced according to the method |
| 07/14/2010 | CN101779280A corrugated interfaces for multilayered interconnects |
| 07/14/2010 | CN101779279A Interlayer insulation film and wiring structure, and their manufacturing method |
| 07/14/2010 | CN101778554A Radiating system |
| 07/14/2010 | CN101778553A Radiator |
| 07/14/2010 | CN101778550A Radiating module and electronic device comprising same |
| 07/14/2010 | CN101777579A Electrostatic protection element of isolated silicon-controlled rectifier |
| 07/14/2010 | CN101777576A Pixel structure and electroluminescence device |
| 07/14/2010 | CN101777571A Array structure of phase-change memory and preparation method thereof |
| 07/14/2010 | CN101777556A Trench large-power MOS part and manufacturing method thereof |
| 07/14/2010 | CN101777555A Complementary silicon controlled rectifier (SCR) structure triggered with aid of N-channel metal oxide semiconductor (NMOS) field effect transistor |
| 07/14/2010 | CN101777554A Electrostatic protection element of bidirectional silicon-controlled rectifier |
| 07/14/2010 | CN101777553A Power transistor chip with built-in junction field effect transistor and application circuit thereof |
| 07/14/2010 | CN101777552A Choke induction |
| 07/14/2010 | CN101777550A 半导体装置 Semiconductor device |
| 07/14/2010 | CN101777549A Packaging module structure of compound semiconductor elements and production method thereof |
| 07/14/2010 | CN101777548A Substrate with built-in chip and manufacturing method thereof |
| 07/14/2010 | CN101777547A Bonding structure of pattern electrodes using ultra-violet curing agent including naturally curing agent |
| 07/14/2010 | CN101777546A Circuit selectable substrate and crystal-covering connection structure |
| 07/14/2010 | CN101777545A Chip packaging structure |
| 07/14/2010 | CN101777544A P-type silicon carbide device and method for improving ohmic contact performance thereof |
| 07/14/2010 | CN101777543A 半导体器件 Semiconductor devices |
| 07/14/2010 | CN101777542A Chip packaging structure and packaging method |
| 07/14/2010 | CN101777541A Inverted sealing structure with heat dissipation block with locking hole of chip of printing circuit board |
| 07/14/2010 | CN101777540A Resin circuit board chip-flip packaging structure with radiating block with locking hole |
| 07/14/2010 | CN101777539A External radiator packaging structure of inverted-T heat radiating block positively arranged on base island exposed chip |
| 07/14/2010 | CN101777538A Island-embedded chip packaging structure with upright radiating block and external heating cap |
| 07/14/2010 | CN101777537A Island-embedded chip packaging structure with upright radiating block and external heating panel |
| 07/14/2010 | CN101777536A Inverted sealing structure with surface-protruded heat dissipation block with locking hole of chip of printing circuit board |
| 07/14/2010 | CN101777535A Island-embedded chip packaging structure with upright radiating block with locking hole and external radiator |
| 07/14/2010 | CN101777534A Island-embedded chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator |
| 07/14/2010 | CN101777533A Packaging structure of inverted T-shaped heat radiating block positively arranged on base island exposed chip |
| 07/14/2010 | CN101777532A Surface bulging packaging structure of heat radiating block positively arranged on base island exposed chip |
| 07/14/2010 | CN101777531A Packaging structure of heat radiating block, with inverted T-shaped locking hole, positively arranged on base island embedded chip |
| 07/14/2010 | CN101777530A Surface bulging out packaging structure of heat radiating block, with locking hole, positively arranged on base island embedded chip |
| 07/14/2010 | CN101777529A Upright fully encapsulating sealing structure with inverse T-shaped heat dissipation block of chip of printing circuit board |
| 07/14/2010 | CN101777528A Upright sealing structure with heat dissipation block of chip of printing circuit board |
| 07/14/2010 | CN101777527A Island-embedded chip packaging structure with upright radiating block with locking hole |