| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/08/2010 | US20100171226 Ic having tsv arrays with reduced tsv induced stress |
| 07/08/2010 | US20100171225 Three dimensional structure memory |
| 07/08/2010 | US20100171224 Three dimensional structure memory |
| 07/08/2010 | US20100171223 Through-Silicon Via With Scalloped Sidewalls |
| 07/08/2010 | US20100171222 HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAME |
| 07/08/2010 | US20100171221 Semiconductor device and manufacturing method thereof |
| 07/08/2010 | US20100171220 Reducing Resistivity in Interconnect Structures of Integrated Circuits |
| 07/08/2010 | US20100171219 Extended liner for localized thick copper interconnect |
| 07/08/2010 | US20100171218 Semiconductor device and method for fabricating the same |
| 07/08/2010 | US20100171217 Through-wafer interconnects for photoimager and memory wafers |
| 07/08/2010 | US20100171216 Electronic device and electronic apparatus |
| 07/08/2010 | US20100171215 Method of Producing Optoelectronic Components and Optoelectronic Component |
| 07/08/2010 | US20100171214 Marking method for semiconductor device and semiconductor device provided with markings |
| 07/08/2010 | US20100171213 Semiconductor device having a liquid cooling module |
| 07/08/2010 | US20100171212 Semiconductor package structure with protection bar |
| 07/08/2010 | US20100171211 Semiconductor device |
| 07/08/2010 | US20100171210 Semiconductor device, stacked semiconductor device and interposer substrate |
| 07/08/2010 | US20100171209 Semiconductor device and method for manufacturing the same |
| 07/08/2010 | US20100171208 Semiconductor device |
| 07/08/2010 | US20100171206 Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same |
| 07/08/2010 | US20100171205 Stackable Semiconductor Device Packages |
| 07/08/2010 | US20100171204 Three-dimensional package |
| 07/08/2010 | US20100171203 Robust TSV structure |
| 07/08/2010 | US20100171202 Method of securely data protecting arrangement for electronic device |
| 07/08/2010 | US20100171201 Chip on lead with small power pad design |
| 07/08/2010 | US20100171200 Semiconductor chip package |
| 07/08/2010 | US20100171197 Isolation Structure for Stacked Dies |
| 07/08/2010 | US20100171196 Electrically shielded through-wafer interconnect |
| 07/08/2010 | US20100171194 Semiconductor Device and Method of Forming an Inductor on Polymer Matrix Composite Substrate |
| 07/08/2010 | US20100171188 Integrated circuit device with single crystal silicon on silicide and manufacturing method |
| 07/08/2010 | US20100171185 Semiconductor Devices and Methods of Manufacture Thereof |
| 07/08/2010 | US20100171177 Semiconductor device |
| 07/08/2010 | US20100171176 Integrated Circuitry And Methods Of Forming A Semiconductor-On-Insulator Substrate |
| 07/08/2010 | US20100171156 Method for Forming Semiconductor Contacts |
| 07/08/2010 | US20100170662 Condenser for power module and power module |
| 07/08/2010 | DE112008002338T5 Thermisch verbessertes dünnes Halbleiter-Package Thermally enhanced thin semiconductor package |
| 07/08/2010 | DE10216016B4 Halbleitervorrichtung zum Messen einer physikalischen Größe Semiconductor device for measuring a physical quantity |
| 07/08/2010 | DE102009042600A1 Leistungshalbleitermodul und Herstellungsverfahren für dieses The power semiconductor module, and manufacturing method for this |
| 07/08/2010 | DE102009042320A1 Anordnung mit einem Leistungshalbleiterchip Arrangement with a power semiconductor chip |
| 07/08/2010 | DE102009024421B3 Steueranschlusskontakteinrichtung für ein Leistungshalbleiterbauelement Control terminal contact device for a power semiconductor component |
| 07/08/2010 | DE102009003934A1 Anordnung zur Kühlung einer Wärmequelle einer elektronischen Schaltung Arrangement for cooling a heat source of an electronic circuit |
| 07/08/2010 | DE102008064428A1 Chipaufbau und Verfahren zur Herstellung eines Chipaufbaus Chip structure and method of manufacturing a chip assembly |
| 07/08/2010 | DE102008063430A1 Metallisierungssystem eines Halbleiterbauelements mit zusätzlich verjüngten Übergangskontakten Metallization of a semiconductor device with additional taper transition contacts |
| 07/08/2010 | DE102008063417A1 Lokale Silizidierung an Kontaktlochunterseiten in Metallisierungssystemen von Halbleiterbauelementen Local silicidation of the contact hole bases in metallization of semiconductor devices |
| 07/08/2010 | DE102008063416A1 Wärmeableitung in temperaturkritischen Bauteilbereichen von Halbleiterbauelementen durch Wärmeleitungen, die mit der Substratrückseite verbunden sind Heat dissipation in temperature-critical component regions of semiconductor devices by the heat pipes, which are connected to the substrate rear side |
| 07/08/2010 | DE102008063401A1 Halbleiterbauelement mit einem kosteneffizienten Chipgehäuse, das auf der Grundlage von Metallsäuren angeschlossen ist A semiconductor device comprising a cost-efficient chip housing which is connected on the basis of metal acids |
| 07/08/2010 | DE102008057833A1 Leistungshalbleitermodul mit Steuerfunktionalität und integriertem Überträger Power semiconductor module with control functionality and integrated carriers |
| 07/08/2010 | DE102008026211B4 Verfahren zur Herstellung eines Halbleiterbauelements mit Metallleitungen mit einer selektiv gebildeten dielektrischen Deckschicht A method for producing a semiconductor device having metal lines with a selectively formed dielectric coating layer |
| 07/08/2010 | DE102007047698B4 Vorrichtung und Verfahren zum Verbinden von Komponenten Device and method for connecting components |
| 07/08/2010 | DE102005018941B4 Halbleiterbauteil in einem Standardgehäuse und Verfahren zur Herstellung desselben Of the same semiconductor device in a standard housing and methods for preparing |
| 07/08/2010 | DE10162983B4 Kontaktfederanordnung zur elektrischen Kontaktierung eines Halbleiterwafers zu Testzwecken sowie Verfahren zu deren Herstellung For testing contact spring arrangement for making electrical contact of a semiconductor wafer as well as processes for their preparation |
| 07/08/2010 | CA2739846A1 Heat sink blockage detector |
| 07/07/2010 | EP2204849A1 Method for indexing dice comprising integrated circuits |
| 07/07/2010 | EP2204848A1 Semiconductor Package and Plasma Display Device including the same |
| 07/07/2010 | EP2204846A1 Gold alloy wire for ball bonding |
| 07/07/2010 | EP2204843A2 Semiconductor device and its manufacturing method |
| 07/07/2010 | EP2204824A1 Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same |
| 07/07/2010 | EP2204697A2 Marker structure, lithographic projection apparatus, method for substrate alignment using such a structure, and substrate comprising such marker structure |
| 07/07/2010 | EP2203955A1 Production method for a radar sensor |
| 07/07/2010 | EP2203941A2 Method of protecting circuits using integrated array fuse elements and process for fabrication |
| 07/07/2010 | EP2203937A2 Electronic circuit composed of sub-circuits and method for producing the same |
| 07/07/2010 | EP2203936A2 Magnetic detection of back-side layer |
| 07/07/2010 | EP1987536B1 Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns |
| 07/07/2010 | EP1512176B1 Die connected with integrated circuit component |
| 07/07/2010 | EP1388277B1 Method and apparatus for cooling electronic components |
| 07/07/2010 | EP1339102B1 Lead frame for a semiconductor device |
| 07/07/2010 | CN201523507U radiating module |
| 07/07/2010 | CN201523504U Radiator with radiation cooling fins |
| 07/07/2010 | CN201523352U 集成电路电压调节器 An integrated circuit voltage regulator |
| 07/07/2010 | CN201523331U Micro packaging single-phase rectifier bridge |
| 07/07/2010 | CN201523011U OLED device capable of emitting light on two faces or on top |
| 07/07/2010 | CN201523010U High-voltage high-power series thyristor self-cooling heat pipe radiator panel |
| 07/07/2010 | CN201523009U Lead frame |
| 07/07/2010 | CN201523008U Semiconductor multichip packaging and stacking structure |
| 07/07/2010 | CN201523007U Laser microscope for cutting chip internal circuit |
| 07/07/2010 | CN201523006U Electrical component packaging structure and circuit board thereof |
| 07/07/2010 | CN201523005U Double-row pin quad flat non-pin package piece |
| 07/07/2010 | CN201523004U Small carrier four-surfaced flat packaging part without pins |
| 07/07/2010 | CN201522131U 半导体制冷装置 Semiconductor cooling device |
| 07/07/2010 | CN201521927U Loop heat pipe radiating device adopting enhanced evaporation section in LED lamp |
| 07/07/2010 | CN201521925U Improvement of LED heat dissipation structure |
| 07/07/2010 | CN201521859U Modular type two-stage heat dissipation LED street lamp |
| 07/07/2010 | CN201521814U LED light source module applied for solid state illumination |
| 07/07/2010 | CN1622326B Offset-bonded, multi-chip semiconductor device |
| 07/07/2010 | CN101772841A Packaged integrated circuit devices with through-body conductive vias, and methods of making same |
| 07/07/2010 | CN101772840A Method to make low resistance contact |
| 07/07/2010 | CN101772775A Tamper-resistant semiconductor device and methods of manufacturing thereof |
| 07/07/2010 | CN101772293A Radiating device |
| 07/07/2010 | CN101772292A Radiating device |
| 07/07/2010 | CN101772291A Radiating device, and fan device and fan thereof |
| 07/07/2010 | CN101772290A Thermal conductive device and manufacturing method thereof |
| 07/07/2010 | CN101771077A Laterally diffused metal oxide semiconductor transistor unit with electrostatic discharge protection |
| 07/07/2010 | CN101771072A Active component array substrate and manufacturing method thereof |
| 07/07/2010 | CN101771068A Semiconductor device and method of manufacturing same |
| 07/07/2010 | CN101771056A Semiconductor device and method of manufacturing the same |
| 07/07/2010 | CN101771049A Real chip level package power metal oxide semiconductor field effect tube based on a bottom source electrode metal oxide semiconductor field effect tube |
| 07/07/2010 | CN101771047A Semiconductor device having saddle fin transistor and method for fabricating the same |
| 07/07/2010 | CN101771045A Complementary type SCR (Silicon Controlled Rectifier) structure by auxiliary triggering of PNP (positive-negative-positive) bipolar transistors |
| 07/07/2010 | CN101771044A Complementary SCR structure triggered with assistance of coupling capacitor |
| 07/07/2010 | CN101771043A Complementary SCR structure triggered with assistance of Zener diode |