Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/23/2010CN101752995A Heat dissipation shell for automobile rectifier diodes
06/23/2010CN101752994A Heat dispersion panel structure of automobile rectifier
06/23/2010CN101752993A Heat dissipation shell structure for automobile rectifier diodes
06/23/2010CN101752484A Light emitting diode and production method thereof
06/23/2010CN101752409A Gate structure of semiconductor device and methods of forming word line structure and memory
06/23/2010CN101752408A Structure of metal silicide buried layer and forming method thereof
06/23/2010CN101752405A Organic light emitting apparatus and method of manufacturing thereof
06/23/2010CN101752402A Top emission type organic electro luminescent device and methode of fabricating the same
06/23/2010CN101752396A Solid-state imaging device and manufacturing method of the same, electronic equipment, and semiconductor device
06/23/2010CN101752390A 半导体装置 Semiconductor device
06/23/2010CN101752387A E-paper, E-paper thin film transistor (TFT) baseplate and fabrication method thereof
06/23/2010CN101752378A Semiconductor and manufacturing method of the same
06/23/2010CN101752375A Groove type power MOS device with improved terminal protective structure
06/23/2010CN101752374A Electronic device including a trench and a conductive structure therein
06/23/2010CN101752373A Anti-static protection structure and manufacturing method thereof
06/23/2010CN101752372A Complementary type SCR (semiconductor control rectifier) structure triggered by help of NPN (negative-positive-negative) bipolar-junction transistors
06/23/2010CN101752370A Transistor-type protection device and semiconductor integrated circuit
06/23/2010CN101752369A Semiconductor integrated circuit
06/23/2010CN101752363A Capacitor structure
06/23/2010CN101752361A Array substrate for display device and method for fabricating the same
06/23/2010CN101752360A Electrostatic discharging protection circuit and element
06/23/2010CN101752358A Compact semiconductor package with integrated bypass capacitor and method
06/23/2010CN101752357A Leadless package housing
06/23/2010CN101752356A Cooling apparatus for semiconductor chips
06/23/2010CN101752355A Light-emitting device
06/23/2010CN101752354A Packaging substrate structure for LED and production method thereof
06/23/2010CN101752353A Packaging structure of multi-chip semiconductor
06/23/2010CN101752352A Light emitting diode package and production method thereof
06/23/2010CN101752350A Multi-layer complementary metal transmission line structure
06/23/2010CN101752349A ESD protection circuit having multi finger transister
06/23/2010CN101752348A Electrostatic discharging protection device and protection method thereof
06/23/2010CN101752347A Electrostatic protection structure and manufacturing method thereof
06/23/2010CN101752346A Structure and method thereof for testing reliability of gate oxide of high-voltage MOS device
06/23/2010CN101752345A Test structure for semiconductor devices P2ID and SM
06/23/2010CN101752344A Contact plug electric fuse structure and method for manufacturing contact plug electric fuse device
06/23/2010CN101752343A Integrated circuit structure
06/23/2010CN101752342A Integrated circuit structure
06/23/2010CN101752341A Lead frame of multi-chip integrated circuit
06/23/2010CN101752340A 半导体装置 Semiconductor device
06/23/2010CN101752339A Pad connecting structure, lead wire jointing structure and encapsulating structure
06/23/2010CN101752338A Ball grid array encapsulating structure and encapsulating process thereof
06/23/2010CN101752337A Semiconductor integrated circuit devices and display apparatus including the same
06/23/2010CN101752336A 半导体装置及其制造方法 Semiconductor device and manufacturing method
06/23/2010CN101752335A Semiconductor device and method for producing semiconductor device
06/23/2010CN101752334A 半导体集成电路器件 The semiconductor integrated circuit device
06/23/2010CN101752333A Power semiconductor module
06/23/2010CN101752332A Opto-semiconductor device
06/23/2010CN101752331A Cooling jacket, cooling unit, and electronic apparatus
06/23/2010CN101752330A Heat dissipation cold plate and refrigeration system
06/23/2010CN101752329A Top-side cooled semiconductor package with stacked interconnection plates and method
06/23/2010CN101752328A Semi-chip packaging structure and production method thereof
06/23/2010CN101752327A Semiconductor packaging piece with heat dissipation structure
06/23/2010CN101752326A Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same
06/23/2010CN101752325A Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutions
06/23/2010CN101752324A Mounting structure
06/23/2010CN101752323A Image sensor camera module and method of manufacturing the same
06/23/2010CN101752322A Chip packaging structure and manufacturing method thereof
06/23/2010CN101752321A Semiconductor device
06/23/2010CN101752320A Semiconductor chip structure
06/23/2010CN101752314A Surface channel PMOS device with self-aligned contact hole and manufacturing method
06/23/2010CN101752313A Surface P-channel metal oxide semiconductor (PMOS) device with self-aligned contact hole and method for producing same
06/23/2010CN101752310A CMOS (complementary metal-oxide-semiconductor) image sensor and manufacture method thereof
06/23/2010CN101752301A Semiconductor device and method of manufacturing semiconductor device
06/23/2010CN101752299A Plug structure and making method thereof
06/23/2010CN101752297A Fabrication method and structure of interconnecting lines
06/23/2010CN101752279A Method for joining first substrate and second substrate, system for printing module and stacking substrates
06/23/2010CN101752278A Lead joint method in packaging of semiconductor and packaging structure
06/23/2010CN101752277A System-in-a-package method and structure thereof
06/23/2010CN101752276A Method for encapsulating electronic device
06/23/2010CN101752267A Chip scale package structure of CMOS (complementary metal-oxide-semiconductor) image sensor and packaging method
06/23/2010CN101752266A Chip scale package structure of CMOS (complementary metal-oxide-semiconductor) image sensor and packaging method
06/23/2010CN101752264A Radiating semiconductor sealing structure and making method thereof
06/23/2010CN101752261A Semiconductor process and silicon baseplate and chip packaging structure formed by applying same
06/23/2010CN101752240A Group iii nitride semiconductor substrate production method, and group iii nitride semiconductor substrate
06/23/2010CN101752208A Semiconductor high-voltage terminal structure and production method thereof
06/23/2010CN101751829A Ultra-thin light-emitting diode (LED) display
06/23/2010CN101751827A Plasma display device
06/23/2010CN101750828A An array substrate for in-plane switching mode LCD
06/23/2010CN101750822A Display substrate and methode of manufacturing the same
06/23/2010CN101750819A Array substrate for transflective liquid crystal display device and manufacturing method thereof
06/23/2010CN101749980A Radiating fin, radiator and electronic device
06/23/2010CN101749979A Radiating fin, radiator and electronic device
06/23/2010CN101749682A LED recessed lamp
06/23/2010CN101749681A Lighting device and radiation structure thereof
06/23/2010CN101749679A Direct cooling recirculating large-power LED spotlight series
06/23/2010CN101749678A Lamp structure with characteristic of low temperature
06/23/2010CN101749667A High-power LED lighting device
06/23/2010CN101749656A LED lamp
06/23/2010CN101749574A Lighting device and light engine thereof
06/23/2010CN101749570A LED light fitting and light engine thereof
06/23/2010CN101749555A Lighting module and lighting system
06/23/2010CN101749261A Radiating device
06/23/2010CN101747870A Preparation method, use method and preparation device of heat dissipation interface material
06/23/2010CN101459154B Conductive wire rack and encapsulation construction applying the conductive wire rack
06/23/2010CN101452918B Carrier plate module having built-in phase lock loop, integration type system, and manufacturing method thereof
06/23/2010CN101410952B Method for seed film formation, plasma film forming apparatus, and memory medium
06/23/2010CN101390206B Electronic module and a method of assembling such a module
06/23/2010CN101385139B Improvement in or related to semiconductor package based on lead frame and manufacturing method
06/23/2010CN101383335B Semiconductor package substrate and fabrication method thereof
06/23/2010CN101375394B Warpage-reducing packaging design
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