| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/01/2010 | US20100164101 Ball land structure having barrier pattern |
| 07/01/2010 | US20100164100 Bump-on-Lead Flip Chip Interconnection |
| 07/01/2010 | US20100164099 Semiconductor integrated circuit device |
| 07/01/2010 | US20100164098 Semiconductor device including a cost-efficient chip-package connection based on metal pillars |
| 07/01/2010 | US20100164097 Semiconductor Device and Method of Confining Conductive Bump Material During Reflow with Solder Mask Patch |
| 07/01/2010 | US20100164096 Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices |
| 07/01/2010 | US20100164095 Semiconductor device and method for manufacturing of same |
| 07/01/2010 | US20100164093 Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside |
| 07/01/2010 | US20100164092 Semiconductor process, and silicon substrate and chip package structure applying the same |
| 07/01/2010 | US20100164090 Semiconductor package apparatus and manufacturing method thereof |
| 07/01/2010 | US20100164089 Non-Conductive Planarization of Substrate Surface for Mold Cap |
| 07/01/2010 | US20100164088 Semiconductor package, manufacturing method thereof and ic chip |
| 07/01/2010 | US20100164087 Semiconductor device having a stacked chip structure |
| 07/01/2010 | US20100164086 Semiconductor device and manufacturing method thereof |
| 07/01/2010 | US20100164085 Multi-die building block for stacked-die package |
| 07/01/2010 | US20100164084 Semiconductor device and semiconductor package including the same |
| 07/01/2010 | US20100164083 Protective thin film coating in chip packaging |
| 07/01/2010 | US20100164082 Manufacturing method for semiconductor devices and semiconductor device |
| 07/01/2010 | US20100164081 Micro-Optical Device Packaging System |
| 07/01/2010 | US20100164080 Semiconductor device |
| 07/01/2010 | US20100164079 Method of manufacturing an assembly and assembly |
| 07/01/2010 | US20100164078 Package assembly for semiconductor devices |
| 07/01/2010 | US20100164077 Semiconductor device and method of manufacturing same |
| 07/01/2010 | US20100164076 Stacked semiconductor package |
| 07/01/2010 | US20100164075 Trench forming method and structure |
| 07/01/2010 | US20100164074 Dielectric separator layer |
| 07/01/2010 | US20100164073 Electrical passivation of silicon-containing surfaces using organic layers |
| 07/01/2010 | US20100164072 Plasma cvd apparatus, method for forming thin film and semiconductor device |
| 07/01/2010 | US20100164059 Semiconductor device and manufacturing method thereof |
| 07/01/2010 | US20100164055 Semiconductor device manufacturing method, semiconductor device and wafer |
| 07/01/2010 | US20100164053 Semiconductor device |
| 07/01/2010 | US20100164052 High power integrated circuit device |
| 07/01/2010 | US20100164051 Semiconductor device having saddle fin-shaped channel and method for manufacturing the same |
| 07/01/2010 | US20100164030 Chip carrier bearing large silicon for high performance computing and related method |
| 07/01/2010 | US20100163913 Lamp and method of producing a lamp |
| 07/01/2010 | US20100163871 Method for indexing dies comprising integrated circuits |
| 07/01/2010 | US20100163870 Structure and Method for Testing MEMS Devices |
| 07/01/2010 | US20100163869 Bonding inspection structure |
| 07/01/2010 | US20100163834 Contact structure, method of manufacturing the same, phase changeable memory device having the same, and method of manufacturing phase changeable memory device |
| 07/01/2010 | DE102009059236A1 Verfahren zum Herstellen eines Halbleiterbauelements und Halbleiterbauelement A method of manufacturing a semiconductor device and semiconductor device |
| 07/01/2010 | DE102009058428A1 Halbleitervorrichtung mit anorganischer Überzugsschicht über Verbindungsanschlusserweiterung A semiconductor device comprising an inorganic coating layer over connection terminal extension |
| 07/01/2010 | DE102009055882A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 07/01/2010 | DE102009051342A1 Mikroelektronisches Gehäuse und Verfahren zum Anordnen in einem Gehäuse Microelectronic package and method for arranging in a housing |
| 07/01/2010 | DE102009050744A1 Halbleitervorrichtung und Herstellungsverfahren A semiconductor device and manufacturing method |
| 07/01/2010 | DE102009050743A1 Halbleitervorrichtung und Herstellungsverfahren A semiconductor device and manufacturing method |
| 07/01/2010 | DE102009044712A1 Halbleiter-Bauelement Semiconductor component |
| 07/01/2010 | DE102009042920A1 Elektronikbauelement und Verfahren zu dessen Herstellung An electronics device and process for its preparation |
| 07/01/2010 | DE102009040613A1 Integrierte Halbleiterschaltungsvorrichtung und Testanschlussanordnungsverfahren Semiconductor integrated circuit device and test terminal assembly method |
| 07/01/2010 | DE102009034239A1 Halbleitervorrichtung mit Stiftanschlüssen A semiconductor device having pin terminals |
| 07/01/2010 | DE102009031157A1 Verfahren und Vorrichtung zum Erfassen eines Risses in einem Halbleiterwafer, und ein Wafer Chuck Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck |
| 07/01/2010 | DE102009029644A1 Reduzierung von Querströmen in einem Halbleiterkörper Reduction of cross-currents in a semiconductor body |
| 07/01/2010 | DE102008064080A1 Verfahren und Einrichtung zum Betreiben eines Leistungshalbleiterbauelements Method and apparatus for operating a power semiconductor device |
| 07/01/2010 | DE102008063863A1 Elektronisches Bauteil mit aufgenommenem elektronischen Bauelement Electronic component with ingested electronic component |
| 07/01/2010 | DE102008063325A1 Verfahren zur Fertigung von Leuchtmitteln Process for the production of lamps |
| 07/01/2010 | DE102008059650A1 Mikrostruktur mit einer Metallisierungsstruktur mit selbstjustierten Luftspalten zwischen dichtliegenden Metallleitungen Microstructure with a metallization with self-aligned air gaps between closely spaced metal lines |
| 07/01/2010 | DE102008059503A1 Leistungsverbesserung in Metallisierungssystemen von Mikrostrukturbauelementen durch Einbau von Metallstrukturen mit größeren Korngrenzen Improving performance in metallization microstructure devices by the incorporation of metal structures with larger grain boundaries |
| 07/01/2010 | DE102008059499A1 Mikrostrukturbauelement mit einer Metallisierungsstruktur mit Luftspalten, die zusammen mit Kontaktdurchführungen hergestellt sind Microstructure component having a metallization structure with air gaps, which are produced together with vias |
| 07/01/2010 | DE102008057832B4 Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder Power semiconductor module with auxiliary pre-stressed contact spring |
| 07/01/2010 | DE102008055138A1 Hochtemperaturbeständige lötmittelfreie Bauelementstruktur und Verfahren zum elektrischen Kontaktieren High temperature resistant lötmittelfreie device structure and method for making electrical contact |
| 07/01/2010 | DE102008055137A1 Elektrisches oder elektronisches Verbundbauteil sowie Verfahren zum Herstellen eines elektrischen oder elektronischen Verbundbauteils The electrical or electronic composite component as well as methods of making an electrical or electronic composite component |
| 07/01/2010 | DE102008055134A1 Elektrisches oder elektronisches Verbundbauteil sowie Verfahren zum Herstellen eines elektrischen oder elektronischen Verbundbauteils The electrical or electronic composite component as well as methods of making an electrical or electronic composite component |
| 07/01/2010 | DE102008054932A1 Power semiconductor module has base plate, which has assembly surface facing module interior, where power semiconductor circuit is provided with power semiconductor chip on assembly surface |
| 07/01/2010 | DE102008054923A1 Power semiconductor module, has circuit carrier provided with power semiconductor chip that is arranged in housing, and capacitor with body integrated into sidewall of housing, where circuit carrier is designed as ceramic plate |
| 07/01/2010 | DE102008049775A1 Metalldeckschicht mit besserer Ätzwiderstandsfähigkeit für kupferbasierte Metallgebiete in Halbleiterbauelementen Metal coating layer with better etch resistivity of copper-based metal regions in semiconductor devices |
| 07/01/2010 | DE102008049727A1 Kontaktelemente und Kontaktdurchführungen eines Halbleiterbauelements, die durch eine Hartmaske und Doppelbelichtung hergestellt sind Contact elements and vias of a semiconductor device made by a hard mask and double exposure |
| 07/01/2010 | DE102005028919B4 Verfahren zum Herstellen eines elektronischen Bauelementes und elektronisches Bauelement A method of manufacturing an electronic component and electronic component |
| 07/01/2010 | DE10126800B4 Verfahren und Vorrichtung zum Testen der ESD-Festigkeit eines Halbleiter-Bauelements Method and device for testing the ESD immunity of a semiconductor device |
| 07/01/2010 | CA2748175A1 Liquid resin composition and semiconductor device |
| 06/30/2010 | EP2202793A2 Semiconductor device |
| 06/30/2010 | EP2202792A2 Semiconductor device |
| 06/30/2010 | EP2202791A2 Semiconductor device having deep through vias |
| 06/30/2010 | EP2202790A2 Heatsink mounting system |
| 06/30/2010 | EP2202475A1 Wing-spanning thermal-dissipating device |
| 06/30/2010 | EP2202461A2 Glow plug for diesel engine with integrated electronics and heat sink |
| 06/30/2010 | EP2202326A1 Copper alloy plate material for electric and electronic components |
| 06/30/2010 | EP2201831A2 Bump structure with multiple layers and method of manufacture |
| 06/30/2010 | EP2201602A1 Alignment features for proximity communication |
| 06/30/2010 | EP2201600A1 Method for producing electrical interconnects and devices made thereof |
| 06/30/2010 | EP2201311A1 System and method for cooling structures having both an active state and an inactive state |
| 06/30/2010 | EP1500140B1 Integrated circuit with integrated capacitor |
| 06/30/2010 | CN201518567U Radiating die set |
| 06/30/2010 | CN201518319U Special axial high-power solar diode |
| 06/30/2010 | CN201518318U White light LED |
| 06/30/2010 | CN201518317U Lead-in wire framework of semi-conductor discrete device |
| 06/30/2010 | CN201518316U Electronic module and encapsulation structure thereof |
| 06/30/2010 | CN201518116U CPU thermal module structure |
| 06/30/2010 | CN101765964A Power conversion device and method for manufacturing the same |
| 06/30/2010 | CN101765913A Reduced bottom roughness of stress buffering element of a semiconductor component |
| 06/30/2010 | CN101765912A Method for producing an electronic component and electronic component |
| 06/30/2010 | CN101765911A Semiconductor die having a redistribution layer |
| 06/30/2010 | CN101765639A Poly(arylene sulfide) resin composition, process for production thereof, and surface mount electronic component |
| 06/30/2010 | CN101765561A Porous silica precursor composition and method for preparing the same, porous silica film and method for forming the same, semiconductor device, image display device, and liquid crystal display device |
| 06/30/2010 | CN101765353A Heat-dissipation module |
| 06/30/2010 | CN101765352A Flat type heat conducting pipe and heat radiating module using same |
| 06/30/2010 | CN101765351A Heat-dissipation device |
| 06/30/2010 | CN101765350A High-power radiating module |
| 06/30/2010 | CN101765349A Heat-dissipation device |
| 06/30/2010 | CN101765341A Molding structure and method for laser-assisting base plate line |
| 06/30/2010 | CN101764184A Device and method for welding cooling of light-emitting diode |
| 06/30/2010 | CN101764160A Semiconductor device |