Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2010
07/28/2010CN201535492U 散热效果好的led灯头的散热器 Good heat dissipation radiator led lamp
07/28/2010CN201535491U 一种大功率led散热结构 One kind of power led thermal structure
07/28/2010CN1956646B Heat-generating electronic part cover and cover mounting method
07/28/2010CN1953168B 引线框架 Leadframe
07/28/2010CN1909209B Method for manufacturing semiconductor device
07/28/2010CN1825579B Circuit substrate structure and circuit apparatus
07/28/2010CN1806328B Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe
07/28/2010CN1652331B Device for electrostatic discharge protection and circuit thereof
07/28/2010CN1531077B Inlaid method for preparing thin-membrane transistor conducting wire structure
07/28/2010CN101790787A Electronic parts package, base for electronic parts package, and junction structure of electronic parts package and circuit substrate
07/28/2010CN101790781A Method of packaging an integrated circuit die
07/28/2010CN101790780A Semiconductor device and method for manufacturing the same
07/28/2010CN101789441A Display apparatus, and method of manufacturing same
07/28/2010CN101789439A Resistive random access memory used in flexible circuits and production method thereof
07/28/2010CN101789433A Array structure of dynamic random access memory (DRAM) and preparation method thereof
07/28/2010CN101789429A Metal-insulator-metal capacitor structure and manufacturing method thereof
07/28/2010CN101789428A Embedded PMOS auxiliary trigger SCR structure
07/28/2010CN101789423A U disk structure and packaging method thereof
07/28/2010CN101789421A Semiconductor device
07/28/2010CN101789420A System-in-a-package (SIP) structure of semiconductor device and manufacturing method thereof
07/28/2010CN101789419A Cube semiconductor package
07/28/2010CN101789418A Porous ultra-low dielectric constant material film and preparation method thereof
07/28/2010CN101789417A Through-silicon via sidewall isolation structure
07/28/2010CN101789416A Semiconductor package body structure with guard bars
07/28/2010CN101789415A Encapsulating carrier plate and connected structure
07/28/2010CN101789414A Ultrathin semiconductor chip packaging structure and manufacturing process thereof
07/28/2010CN101789413A Mixed small-channel cooler
07/28/2010CN101789412A Upright packaging structure with paddle exposing chip for rectangular heat dissipation block
07/28/2010CN101789411A Upright totally packaged type packaging structure with paddle exposing chip for heat dissipation block
07/28/2010CN101789410A Upright packaging structure with paddle exposed out of chip for heat dissipation block
07/28/2010CN101789409A Upright packaging structure with paddle exposing chip for locking hole heat dissipation block externally connected with radiator by raised cylinder
07/28/2010CN101789408A Upright packaging structure with paddle exposing chip for locking hole heat dissipation block externally connected with heat dissipation plate by raised cylinder
07/28/2010CN101789407A Upright packaging structure with paddle exposing chip for inverted T-shape locking hole heat dissipation block externally connected with radiator
07/28/2010CN101789406A Upright packaging structure with paddle exposing chip for heat dissipation block externally connected with heat dissipation plate
07/28/2010CN101789405A Encapsulating structure of PCB (printed circuit board) chip up-mounted radiating block with rectangular locking hole
07/28/2010CN101789404A Heat radiator
07/28/2010CN101789403A Chip surface contact glass packaging rectifier tube and manufacturing method thereof
07/28/2010CN101789391A Semiconductor device and manufacturing method thereof
07/28/2010CN101789390A Manufacturing method of silicon through hole and silicon through hole structure
07/28/2010CN101789383A Method for making packaging substrate with recess structure
07/28/2010CN101789380A Structure and process of internally buried package
07/28/2010CN101789032A Design method and structure thereof of physical layout of CUP weld pad zone
07/28/2010CN101788134A Radiating device for LED lamp and radiator component
07/28/2010CN101788107A Radiating block component and light emitting diode comprising same
07/28/2010CN101515588B Radio frequency SOI LDMOS device with H-shaped gate
07/28/2010CN101488498B Integrated circuit device and capacitor pairs
07/28/2010CN101452863B Manufacturing method for using compliant layer in grain reconfigured encapsulation construction
07/28/2010CN101390210B Semiconductor element mounting substrate, semiconductor device using the same, and process for producing semiconductor element mounting substrate
07/28/2010CN101389202B Cooling device for electronic element
07/28/2010CN101383300B Wafer level package of electronic element and manufacturing method thereof
07/28/2010CN101373762B 功率半导体模块 Power semiconductor module
07/28/2010CN101364601B Method for improving SRAM function of high-voltage product and solving problem of unqualified voltage
07/28/2010CN101363609B Light source assembly of high-power LED lamp and installation method thereof in lamp holder
07/28/2010CN101345231B Semiconductor chip, method of fabricating the same and stack package having the same
07/28/2010CN101345199B Packaging structure and its forming method
07/28/2010CN101312635B Air-guiding cover having hot pipe and heat radiating fins, electronic apparatus provided with the air-guiding cover
07/28/2010CN101290945B Method for forming pixel unit and integrated circuit
07/28/2010CN101236972B Thin film transistor substrate
07/28/2010CN101231988B Circuit coiling tape of thin film crystal cover packaging and thin film crystal cover packaging construction thereof
07/28/2010CN101231982B Package structure of semiconductor device
07/28/2010CN101201157B Single end LED energy-saving lamp and drive circuit thereof
07/28/2010CN101179074B Integrated semiconductor device and manufacturing method thereof
07/28/2010CN101106128B Semiconductor device and protection circuit
07/28/2010CN101051631B Interconnecting machine structure, damascene structure of IC and semiconductor structure
07/28/2010CN101039571B Heat radiator and base holder thereof
07/27/2010US7764532 High speed OTP sensing scheme
07/27/2010US7764500 Electronic system with a heat sink assembly
07/27/2010US7764316 CCD array with integrated high voltage protection circuit
07/27/2010US7764078 Test structure for monitoring leakage currents in a metallization layer
07/27/2010US7763986 Semiconductor chip, film substrate, and related semiconductor chip package
07/27/2010US7763985 Flip-chip type semiconductor device
07/27/2010US7763984 Semiconductor package and method for manufacturing the same
07/27/2010US7763983 Stackable microelectronic device carriers, stacked device carriers and methods of making the same
07/27/2010US7763982 Package substrate strip, metal surface treatment method thereof and chip package structure
07/27/2010US7763981 Semiconductor device and method for manufacturing the same
07/27/2010US7763980 Semiconductor die having a distribution layer
07/27/2010US7763979 Organic insulating film, manufacturing method thereof, semiconductor device using such organic insulating film and manufacturing method thereof
07/27/2010US7763978 Three-dimensional crossbar array systems and methods for writing information to and reading information stored in three-dimensional crossbar array junctions
07/27/2010US7763977 Semiconductor device and manufacturing method therefor
07/27/2010US7763976 Integrated circuit module with integrated passive device
07/27/2010US7763975 Flip-chip assembly of protected micromechanical devices
07/27/2010US7763974 Integrated circuit for driving semiconductor device and power converter
07/27/2010US7763973 Integrated heat sink for a microchip
07/27/2010US7763972 Stacked package structure for reducing package volume of an acoustic micro-sensor
07/27/2010US7763971 Circuit module and electrical component
07/27/2010US7763970 Power module
07/27/2010US7763969 Structure with semiconductor chips embeded therein
07/27/2010US7763968 Semiconductor device featuring large reinforcing elements in pad area
07/27/2010US7763967 Semiconductor device with surface mounting terminals
07/27/2010US7763966 Resin molded semiconductor device and differential amplifier circuit
07/27/2010US7763965 Stress relief structures for silicon interposers
07/27/2010US7763964 Semiconductor device and semiconductor module using the same
07/27/2010US7763962 Wafer-level packaging of micro devices
07/27/2010US7763961 Hybrid stacking package system
07/27/2010US7763960 Semiconductor device, method for manufacturing semiconductor device, and electric equipment system
07/27/2010US7763959 Heat slug for package structure
07/27/2010US7763958 Leadframe panel for power packages
07/27/2010US7763957 Active matrix type display device and method of manufacturing the same
07/27/2010US7763955 Reducing shunt currents in a semiconductor body
07/27/2010US7763951 Fuse structure for maintaining passivation integrity
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