Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2010
07/20/2010US7760360 Monitoring a photolithographic process using a scatterometry target
07/20/2010US7760317 Thin film transistor array substrate and fabricating method thereof, liquid crystal display using the same and fabricating method thereof, and method of inspecting liquid crystal display
07/20/2010US7759831 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded
07/20/2010US7759808 Semiconductor substrate including first and second recognition marks and method for manufacturing semiconductor device
07/20/2010US7759807 Semiconductor package having structure for warpage prevention
07/20/2010US7759806 Integrated circuit package system with multiple device units
07/20/2010US7759805 Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles
07/20/2010US7759804 Semiconductor device and a method of manufacturing the same
07/20/2010US7759803 Semiconductor device and method of manufacturing the same
07/20/2010US7759802 Semiconductor device and method for manufacturing same
07/20/2010US7759801 Tapered signal lines
07/20/2010US7759800 Microelectronics devices, having vias, and packaged microelectronic devices having vias
07/20/2010US7759799 Substrate and semiconductor device
07/20/2010US7759798 Semiconductor device and method for manufacturing the same
07/20/2010US7759797 Bonding pad structure to minimize IMD cracking
07/20/2010US7759796 Semiconductor device with two barrier layers formed between copper-containing line layer and aluminum-containing conductive layer
07/20/2010US7759795 Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same
07/20/2010US7759794 Semiconductor device
07/20/2010US7759793 Semiconductor device having elastic solder bump to prevent disconnection
07/20/2010US7759792 Integrated circuit including parylene material layer
07/20/2010US7759791 High density IC module
07/20/2010US7759790 Lidless semiconductor cooling
07/20/2010US7759789 Local area semiconductor cooling system
07/20/2010US7759788 Semiconductor device
07/20/2010US7759787 Packaging substrate having pattern-matched metal layers
07/20/2010US7759786 Electronic circuit chip, and electronic circuit device and method for manufacturing the same
07/20/2010US7759785 Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components
07/20/2010US7759784 3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules
07/20/2010US7759783 Integrated circuit package system employing thin profile techniques
07/20/2010US7759782 Substrate for a microelectronic package and method of fabricating thereof
07/20/2010US7759781 LSI package provided with interface module
07/20/2010US7759780 includes semiconductor substrate and bottom coupled die
07/20/2010US7759779 Semiconductor device and method of manufacturing the same
07/20/2010US7759778 Leaded semiconductor power module with direct bonding and double sided cooling
07/20/2010US7759777 Semiconductor module
07/20/2010US7759776 Space transformer having multi-layer pad structures
07/20/2010US7759775 High current semiconductor power device SOIC package
07/20/2010US7759774 Shielded structures to protect semiconductor devices
07/20/2010US7759773 Semiconductor wafer structure with balanced reflectance and absorption characteristics for rapid thermal anneal uniformity
07/20/2010US7759768 Integrated circuit with intergrated capacitor and methods for making same
07/20/2010US7759753 Integrated circuit die, integrated circuit package, and packaging method
07/20/2010US7759744 Semiconductor device having high dielectric constant layers of different thicknesses
07/20/2010US7759734 Semiconductor device
07/20/2010US7759732 Power semiconductor device
07/20/2010US7759728 Depletable cathode low charge storage diode
07/20/2010US7759712 Solid-state imaging device, solid-state imaging apparatus and methods for manufacturing the same
07/20/2010US7759697 Semiconductor device
07/20/2010US7759581 Circuit board and method for manufacturing semiconductor modules and circuit boards
07/20/2010US7759248 Semiconductor memory device and method of fabricating the same
07/20/2010US7759247 Manufacturing method of semiconductor device with a barrier layer and a metal layer
07/20/2010US7759246 Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
07/20/2010US7759240 Use of palladium in IC manufacturing with conductive polymer bump
07/20/2010US7759223 Semiconductor wafer and manufacturing process for semiconductor device
07/20/2010US7759171 Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package
07/20/2010US7759170 Fabrication method of semiconductor package having heat dissipation device
07/20/2010US7759163 Semiconductor module
07/20/2010US7759144 Package for a semiconductor light emitting device
07/20/2010US7759135 Method of forming a sensor node module
07/20/2010US7758911 Microelectronic security coatings
07/20/2010US7757930 Fabrication method of semiconductor integrated circuit device
07/20/2010CA2552908C Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode
07/20/2010CA2409435C Wireless radio frequency technique design and method for testing of integrated circuits and wafers
07/20/2010CA2342570C Pumped liquid cooling system using a phase change refrigerant
07/15/2010WO2010081092A1 Laser device and heat sink with core to manage stress due to thermal expansion
07/15/2010WO2010080500A1 Telephony and digital media services device
07/15/2010WO2010080235A1 Heat exchangers and related methods
07/15/2010WO2010080068A1 Method for manufacturing a low cost three dimensional stack package and resulting structures using through silicon vias and assemblies
07/15/2010WO2010079831A1 Method for manufacturing semiconductor package, method for encapsulating semiconductor, and solvent-borne semiconductor encapsulating epoxy resin composition
07/15/2010WO2010079663A1 Semiconductor device, method for producing the same, millimeter-wave dielectric transmission device, method for producing the same, and millimeter-wave dielectric transmission system
07/15/2010WO2010078715A1 High-power semiconductor laser and method for manufacturing the same
07/15/2010WO2010078691A1 Device for energy conversion and equipment for energy conversion
07/15/2010WO2010059879A9 Heat exchanger apparatus and methods of manufacturing cross reference
07/15/2010WO2010056857A3 Extremely stretchable electronics
07/15/2010WO2010056211A3 System for encapsulation of semiconductor dies
07/15/2010US20100179398 Analyte Monitoring Device and Methods of Use
07/15/2010US20100178778 Radiofrequency contactor
07/15/2010US20100177549 Silicide-silicon oxide-semiconductor antifuse device and method of making
07/15/2010US20100177491 Orientation-tolerant land pattern and method of manufacturing the same
07/15/2010US20100177490 Computer modules with small thicknesses and associated methods of manufacturing
07/15/2010US20100177226 Solid-state imaging device and electronic apparatus
07/15/2010US20100176838 Semiconductor device and test method
07/15/2010US20100176517 Electronic device
07/15/2010US20100176516 Substrate having optional circuits and structure of flip chip bonding
07/15/2010US20100176515 Contact pad supporting structure and integrated circuit
07/15/2010US20100176514 Interconnect with recessed dielectric adjacent a noble metal cap
07/15/2010US20100176513 Structure and method of forming metal interconnect structures in ultra low-k dielectrics
07/15/2010US20100176512 Structure and method for back end of the line integration
07/15/2010US20100176511 Semiconductor device with a line and method of fabrication thereof
07/15/2010US20100176510 Fusible I/O Interconnection Systems and Methods for Flip-Chip Packaging Involving Substrate-Mounted Stud Bumps
07/15/2010US20100176509 Semiconductor device and method of fabricating the same
07/15/2010US20100176508 Semiconductor device package and method of assembly thereof
07/15/2010US20100176507 Semiconductor-based submount with electrically conductive feed-throughs
07/15/2010US20100176506 Thermoelectric 3d cooling
07/15/2010US20100176505 Power semiconductor module and fabrication method thereof
07/15/2010US20100176504 Semiconductor device
07/15/2010US20100176503 Semiconductor package system with thermal die bonding
07/15/2010US20100176502 Wafer level vertical diode package structure and method for making the same
07/15/2010US20100176501 Method and Apparatus for Stacked Die Package with Insulated Wire Bonds
07/15/2010US20100176500 Semiconductor device
07/15/2010US20100176499 Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross section
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