| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/24/2010 | US20100155857 A semiconductor device and a method of manufacturing the same and designing the same |
| 06/24/2010 | US20100155794 Rework method of metal structure of semiconductor device |
| 06/24/2010 | US20100155776 Forming ESD Diodes and BJTs Using FinFET Compatible Processes |
| 06/24/2010 | US20100155770 Multilayered lead frame for a semiconductor light-emitting device |
| 06/24/2010 | US20100155748 Aligned multiple emitter package |
| 06/24/2010 | US20100155727 Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions |
| 06/24/2010 | US20100155726 Semiconductor integrated circuit |
| 06/24/2010 | US20100155725 Insert module for a test handler |
| 06/24/2010 | US20100155724 Flat panel display including electrostatic protection circuit |
| 06/24/2010 | US20100155582 Solid-state imaging device and manufacturing method of the same, electronic equipment, and semiconductor device |
| 06/24/2010 | US20100155247 Radiation-curable rubber adhesive/sealant |
| 06/24/2010 | US20100155114 Package for semiconductor devices |
| 06/24/2010 | US20100155098 Component package for maintaining safe operating temperature of components |
| 06/24/2010 | DE19752408B4 Leistungsmodul mit einem oder mehreren Halbleiter-Leistungsbauelementen Power module with one or more semiconductor power devices |
| 06/24/2010 | DE112005001736B4 Verfahren zur Herstellung mehrerer elektronischer Anordnungen und Kombinationswaferanordnung A process for producing a plurality of electronic devices and combination wafer assembly |
| 06/24/2010 | DE102009045793A1 Klemmbauelement für elektrostatische Entladung Clamping device for electrostatic discharge |
| 06/24/2010 | DE102009044714A1 Halbleiter-Bauelement Semiconductor component |
| 06/24/2010 | DE102009044639A1 Bauelement mit einem Halbleiterchip Component having a semiconductor chip |
| 06/24/2010 | DE102009044485A1 Leistungs-Halbleitereinrichtung Power semiconductor device |
| 06/24/2010 | DE102009041476A1 Verkapselungsmaterial, kristallines Silicium-Photovoltaikmodul und Dünnschicht-Photovoltaikmodul Encapsulating crystalline silicon photovoltaic module and thin-film photovoltaic module |
| 06/24/2010 | DE102009023417A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device |
| 06/24/2010 | DE102008054765A1 Bauteil mit einer Durchkontaktierung und ein Verfahren zur Herstellung eines solchen Bauteils Component having a via and a method for producing such a component |
| 06/24/2010 | DE102008054068A1 Veringern von Metallhohlräumen in einem metallischen Schichtstapel eines Halbleiterbauelements durch Vorsehen einer dielektrischen Barrierenschicht REDUCE of metal voids in a metal layer stack of a semiconductor device by providing a dielectric barrier layer |
| 06/24/2010 | DE102008049220A1 Halbleiterbauelement mit Kontakten aus einlegierten Metalldrähten Semiconductor device with contacts from alloyed metal wires |
| 06/23/2010 | EP2200414A2 Integrated circuit package |
| 06/23/2010 | EP2200412A1 Flexible electronic product and method for manufacturing the same |
| 06/23/2010 | EP2200409A1 Electronic part |
| 06/23/2010 | EP2200089A1 Trench gate field effect devices |
| 06/23/2010 | EP2200086A1 Light emitting diode having a plurality of light emitting cells and method of fabricating the same |
| 06/23/2010 | EP2200080A2 Low Cost Manufacturing of Micro-Channel Heatsink |
| 06/23/2010 | EP2200079A1 Method and device for operating a semiconductor component |
| 06/23/2010 | EP2200076A1 Bonding wire for semiconductor devices |
| 06/23/2010 | EP2200075A1 Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device |
| 06/23/2010 | EP2200074A1 Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device |
| 06/23/2010 | EP2199809A1 Capacitive divider, voltage sensor, breaker and protective apparatus comprising such a divider |
| 06/23/2010 | EP2199339A1 Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device |
| 06/23/2010 | EP2198455A2 Chip module for chip card |
| 06/23/2010 | EP2198454A1 Composite element consisting of at least two semiconductor substrates, and production method |
| 06/23/2010 | EP2198452A1 Method for packing semiconductor components, and product produced according to the method |
| 06/23/2010 | EP2197780A1 Structure comprising a getter layer and an adjusting sublayer, and fabrication process |
| 06/23/2010 | CN201515589U Heat radiation block system |
| 06/23/2010 | CN201515316U KBU rectifying bridge |
| 06/23/2010 | CN201514956U LED encapsulation structure with concave cup |
| 06/23/2010 | CN201514954U Encapsulation of semiconductor light-emitting diode with roughing surface |
| 06/23/2010 | CN201514944U LED with internal fixedly welding structure |
| 06/23/2010 | CN201514943U Silicon stack with structural improvement |
| 06/23/2010 | CN201514941U Hybrid integrated circuit with controllable working temperature |
| 06/23/2010 | CN201514940U Lead framework structure for packaging of integrated circuit |
| 06/23/2010 | CN201514939U 3600V high-voltage power semiconductor module |
| 06/23/2010 | CN201514938U 封装载体 Package Carrier |
| 06/23/2010 | CN201514937U Power transistor package structure |
| 06/23/2010 | CN201514607U Extension-type radiating module and computer device with same |
| 06/23/2010 | CN201513994U Device using temperature energy of tap water as uniform temperature |
| 06/23/2010 | CN201513860U Heat radiation module |
| 06/23/2010 | CN201513859U High-power LED light source heat dissipation structure |
| 06/23/2010 | CN201513858U Radiating device of LED lamp |
| 06/23/2010 | CN201513857U LED work mineral lamp of fin type radiator provided with heat tube |
| 06/23/2010 | CN201513856U High-power LED lamp based on heat-conducting nanoparticle |
| 06/23/2010 | CN201513842U LED chip rack with temperature-uniforming plate |
| 06/23/2010 | CN201513837U High-power LED tunnel lamp |
| 06/23/2010 | CN201513836U High-power LED street lamp |
| 06/23/2010 | CN201513835U LED streetlamp lamp housing |
| 06/23/2010 | CN201513778U LED ordinary bulb |
| 06/23/2010 | CN201513774U Internal heat dissipation flower type LED post-shaped lamp |
| 06/23/2010 | CN201513754U Liquid-cooled LED lamp |
| 06/23/2010 | CN201513752U LED fluorescent lamp |
| 06/23/2010 | CN1992283B Stacked memory cell for use in high-density CMOS SRAM |
| 06/23/2010 | CN1953223B 基于氮化物的半导体发光二极管 Nitride-based semiconductor light-emitting diode |
| 06/23/2010 | CN1947231B 半导体器件 Semiconductor devices |
| 06/23/2010 | CN1946795B Dual-stage wafer applied underfills |
| 06/23/2010 | CN1855451B Semiconductor apparatus and manufacturing method thereof |
| 06/23/2010 | CN1855409B Method of manufacturing a semiconductor device |
| 06/23/2010 | CN1738020B Self-timed reliability and yield vehicle with gated data and clock |
| 06/23/2010 | CN1689732B Method for preparing aluminum nitride sintered body |
| 06/23/2010 | CN1619812B Stacked semiconductor device |
| 06/23/2010 | CN1601735B Semiconductor device and method for fabricating the same |
| 06/23/2010 | CN1574323B Semiconductor device |
| 06/23/2010 | CN1573847B 半导体器件 Semiconductor devices |
| 06/23/2010 | CN1568546B Semiconductor device and method of manufacturing the same |
| 06/23/2010 | CN101755496A Interference shielded electronics module and method for providing the same |
| 06/23/2010 | CN101755337A 半导体模块 Semiconductor Modules |
| 06/23/2010 | CN101755336A Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods |
| 06/23/2010 | CN101755334A 半导体器件 Semiconductor devices |
| 06/23/2010 | CN101754938A Ceramic substrate, process for producing the same, and dielectric-porcelain composition |
| 06/23/2010 | CN101754662A Radiating device assemble |
| 06/23/2010 | CN101754660A Water-cooled radiating system and water-cooled device thereof |
| 06/23/2010 | CN101754659A Radiating device |
| 06/23/2010 | CN101754658A Radiating device |
| 06/23/2010 | CN101754657A Radiating device |
| 06/23/2010 | CN101754656A Uniform temperature plate |
| 06/23/2010 | CN101754655A Radiating die set |
| 06/23/2010 | CN101754654A Heat transfer substrate and heat dissipation device provided with same |
| 06/23/2010 | CN101754653A 散热器 Heat sink |
| 06/23/2010 | CN101754651A Fan fixing device |
| 06/23/2010 | CN101754649A Radiator and making method of radiating fins thereof |
| 06/23/2010 | CN101754645A Heat pipe type heat radiator and manufacturing method thereof |
| 06/23/2010 | CN101754643A Electronic device and thermal module thereof |
| 06/23/2010 | CN101754642A Radiating module and manufacturing method thereof |
| 06/23/2010 | CN101754641A Heat sink with temperature difference diversion |
| 06/23/2010 | CN101754578A Occluding circuit structure and forming method thereof |