Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/12/2010US20100200987 Semiconductor Device and a Method of Manufacturing the Same
08/12/2010US20100200986 Grooving Bumped Wafer Pre-Underfill System
08/12/2010US20100200985 Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process
08/12/2010US20100200984 Adjustable threaded cores for led thermal management
08/12/2010US20100200983 Electronic component
08/12/2010US20100200982 Semiconductor device and manufacturing method thereof
08/12/2010US20100200981 Semiconductor package and method of manufacturing the same
08/12/2010US20100200980 Semiconductor device
08/12/2010US20100200979 Power Transistor Package with Integrated Bus Bar
08/12/2010US20100200978 Semiconductor device
08/12/2010US20100200977 Layered chip package and method of manufacturing same
08/12/2010US20100200976 Semiconductor device and semiconductor memory device
08/12/2010US20100200974 Semiconductor package structure using the same
08/12/2010US20100200973 Leadframe structure for electronic packages
08/12/2010US20100200972 BGA package with leads on chip
08/12/2010US20100200971 High current capacity inner leads for semiconductor device
08/12/2010US20100200970 Semiconductor Assembly With One Metal Layer After Base Metal Removal
08/12/2010US20100200969 Semiconductor package and method of manufacturing the same
08/12/2010US20100200968 Microwave circuit assembly
08/12/2010US20100200967 Integrated circuit package system including shield
08/12/2010US20100200966 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
08/12/2010US20100200965 Package structure for wireless communication module
08/12/2010US20100200963 Protein repelling silicon and germanium surfaces
08/12/2010US20100200961 Thru silicon enabled die stacking scheme
08/12/2010US20100200960 Deep trench crackstops under contacts
08/12/2010US20100200959 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
08/12/2010US20100200958 Pedestal guard ring having continuous m1 metal barrier connected to crack stop
08/12/2010US20100200951 Method of Forming Top Electrode for Capacitor and Interconnection in Integrated Passive Device (IPD)
08/12/2010US20100200948 Semiconductor device and fabrication method thereof
08/12/2010US20100200932 Electronic-Component-Housing Package and Electronic Device
08/12/2010US20100200928 Semiconductor device, and manufacturing method thereof
08/12/2010US20100200926 Memory Cells Having Contact Structures and Related Intermediate Structures
08/12/2010US20100200893 Super gto-based power blocks
08/12/2010US20100200853 Semiconductor device and manufacturing method thereof
08/12/2010US20100200663 Method for manufacturing semiconductor device
08/12/2010US20100200200 Heat-transport device, method for manufacturing the same, and electronic device
08/12/2010US20100200197 Liquid cooled compliant heat sink and related method
08/12/2010DE112007003638T5 Prozess zum Herstellen einer siliziumhaltigen Beschichtung, siliziumhaltige Beschichtung und Halbleitervorrichtung Process for producing a silicon-containing coating, silicon-containing coating, and semiconductor device
08/12/2010DE102009006798A1 Verfahren zur Herstellung eines Metallisierungssystems eines Halbleiterbauelements unter Anwendung einer Hartmaske zum Definieren der Größe der Kontaktdurchführung A process for producing a metallization of a semiconductor device using a hard mask to define the size of the via
08/12/2010DE102009005458A1 Halbleiterbauelement mit Durchkontaktierung und Verfahren zu dessen Herstellung A semiconductor device having through-hole plating and process for its preparation
08/12/2010DE102009000491A1 Sintered ceramic substrate used in data transmission systems, particularly microwave circuits, has metallic-hermetic through holes, where holes are filled with mesh made of one or multiple electrically conductive materials
08/12/2010DE102008044985B4 Verfahren zur Herstellung eines Halbleiterbauelements mit einem kohlenstoffenthaltenden leitenden Material für Durchgangskontakte A process for producing a semiconductor device with a carbon-containing conductive material for vias
08/12/2010DE102004052093B4 Schaltungsanordung mit Schutz gegen elektrostatische Zerstörung Circuit arrangement with protection against electrostatic destruction
08/12/2010DE102004046807B4 Verfahren zur Herstellung eines Kunststoff-Gehäuseteils für ein Leistungshalbleitermodul A process for producing a plastic housing part for a power semiconductor module
08/12/2010DE102004030806B4 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
08/12/2010CA2704683A1 Grounded lid for micro-electronic assemblies
08/11/2010EP2217043A1 Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module
08/11/2010EP2216814A2 Power semiconductor device and manufacturing method therefor
08/11/2010EP2216813A2 Integrated circuit package comprising a magnetic capacitor
08/11/2010EP2216812A1 Ebullient cooling unit
08/11/2010EP2216807A2 Heat-dissipation apparatus
08/11/2010EP2216801A2 An electrical device having a power source with a magnetic capacitor as an energy storage device
08/11/2010EP2216682A1 Positive photosensitive composition, positive permanent resist, and method for producing positive permanent resist
08/11/2010EP2215656A1 Semiconductor device with improved esd protection
08/11/2010EP2215655A1 Wafer level packaging using flip chip mounting
08/11/2010EP2215654A1 Robust mems flow die with integrated protective flow channel
08/11/2010EP2215008A2 Module housing and method for producing a module housing
08/11/2010EP1817793B1 Methods for forming co-planar wafer-scale chip packages
08/11/2010EP1490902B1 Semiconductor device with a protective security coating and method of manufacturing the same
08/11/2010CN201550394U Temperature equalizing plate radiating device with heat ducts
08/11/2010CN201550391U Circuit board cooling structure
08/11/2010CN201550389U Fixing frame and heat dissipation device thereof
08/11/2010CN201550388U Radiating structure with combined radiating fins
08/11/2010CN201550387U Radiator with special structure
08/11/2010CN201550386U Radiating device with rotary air passage
08/11/2010CN201549512U Ldmos power device
08/11/2010CN201549510U Integrated inductor structure
08/11/2010CN201549509U Focusing infrared receiver with internal reflective cup
08/11/2010CN201549506U Cutting channel structure of surface-mount LED packaging substrate
08/11/2010CN201549505U Glass passivation packaging transient voltage suppression diode structure
08/11/2010CN201549502U Thyristor valve body suitable for high-pressure solid-state composite switch devices
08/11/2010CN201549501U LED ultraviolet light module
08/11/2010CN201549500U All-metal heat conducting double-sided radiating LED substrate
08/11/2010CN201549499U Encapsulating structure of ceramic-based high-power red, green and blue LED
08/11/2010CN201549498U Encapsulation structure of side-luminescence LED
08/11/2010CN201549497U Improved semiconductor chip carrier
08/11/2010CN201549496U High-power patch-type lead frame
08/11/2010CN201549495U Directly inserted triode lead frame
08/11/2010CN201549494U High-frequency triode lead frame component
08/11/2010CN201549493U Micro diode molybdenum electrode lead structure
08/11/2010CN201549492U Reverse-installation preventive novel electronic component
08/11/2010CN201549491U Cooling device of CPU
08/11/2010CN201549490U sip substrate
08/11/2010CN201549489U Packaging structure of SIP substrate
08/11/2010CN201549488U Metal substrate, radiating component and semiconductor device provided with radiating component
08/11/2010CN201548896U Heat radiation device with heat radiation rods
08/11/2010CN201548772U Driving component array substrate
08/11/2010CN201547725U Heat dissipation device of LED lamp
08/11/2010CN201547722U Radiating fin for high power LED lamp
08/11/2010CN201547574U LED lamp with improved heat radiation structure
08/11/2010CN1973370B Angled elongated features for improved alignment process integration
08/11/2010CN1967834B Semiconductor device and method for designing same
08/11/2010CN1964062B Organic light-emitting display device
08/11/2010CN1961424B Chip having two groups of chip contacts
08/11/2010CN1937243B Power device explosion-proof method and device
08/11/2010CN1495540B Alignment system of photoetching system utilizing at least two wavelengths and its method
08/11/2010CN101803023A Semiconductor device
08/11/2010CN101803019A Integrated circuit stack and its thermal management
08/11/2010CN101803018A Security chip
08/11/2010CN101803017A Conformal shielding process using process gases
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