Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/17/2010US7777348 Semiconductor device
08/17/2010US7777347 Semiconductor device
08/17/2010US7777346 Semiconductor integrated circuit device and a method of manufacturing the same
08/17/2010US7777345 Semiconductor device having through electrode and method of fabricating the same
08/17/2010US7777344 Transitional interface between metal and dielectric in interconnect structures
08/17/2010US7777343 Semiconductor device and manufacturing method thereof
08/17/2010US7777342 Semiconductor device and method for manufacturing the same
08/17/2010US7777339 Semiconductor chips with reduced stress from underfill at edge of chip
08/17/2010US7777338 Seal ring structure for integrated circuit chips
08/17/2010US7777337 Semiconductor device having damascene interconnection structure that prevents void formation between interconnections
08/17/2010US7777334 Semiconductor device having active element formation region provided under a bump pad
08/17/2010US7777333 Structure and method for fabricating flip chip devices
08/17/2010US7777332 Semiconductor device
08/17/2010US7777331 Semiconductor apparatus comprising a semiconductor chip with a power supply circuit and a smoothing circuit disposed outside the semiconductor chip
08/17/2010US7777330 High bandwidth cache-to-processing unit communication in a multiple processor/cache system
08/17/2010US7777328 Substrate and multilayer circuit board
08/17/2010US7777327 Chip package structure and circuit board thereof
08/17/2010US7777326 Routing structure of re-distribution layer and method for re-distributing routing structure in integrated circuit
08/17/2010US7777325 Power semiconductor module
08/17/2010US7777324 Interposer and semiconductor package with reduced contact area
08/17/2010US7777323 Semiconductor structure and method for forming the same
08/17/2010US7777322 Apparatus for providing a light source that combines different color LEDS
08/17/2010US7777321 Stacked microelectronic layer and module with three-axis channel T-connects
08/17/2010US7777320 Quad flat pack in quad flat pack integrated circuit package system
08/17/2010US7777319 Three dimensional integrated circuits
08/17/2010US7777318 Wafer level packaging integrated hydrogen getter
08/17/2010US7777317 Card and manufacturing method
08/17/2010US7777316 Semiconductor device
08/17/2010US7777315 Dual side cooling integrated power device module and methods of manufacture
08/17/2010US7777314 Electronic component mounting package and package assembled substrate
08/17/2010US7777313 Electronic package structures and methods
08/17/2010US7777312 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
08/17/2010US7777311 Circuit substrate, molding semiconductor device, tray and inspection socket
08/17/2010US7777310 Integrated circuit package system with integral inner lead and paddle
08/17/2010US7777309 Amplifier chip mounted on a lead frame
08/17/2010US7777308 Integrated circuit packages including sinuous lead frames
08/17/2010US7777304 Semiconductor device
08/17/2010US7777301 Electronic components on trenched substrates and method of forming same
08/17/2010US7777300 Semiconductor device with capacitor
08/17/2010US7777298 Semiconductor device and method of manufacturing the same
08/17/2010US7777296 Nano-fuse structural arrangements having blow protection barrier spaced from and surrounding fuse link
08/17/2010US7777294 Semiconductor device including a high-breakdown voltage MOS transistor
08/17/2010US7777293 Semiconductor integrated circuit, D-A converter device, and A-D converter device
08/17/2010US7777288 Integrated circuit device and fabrication method therefor
08/17/2010US7777279 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
08/17/2010US7777277 Dual triggered silicon controlled rectifier
08/17/2010US7777247 Semiconductor light emitting device mounting substrates including a conductive lead extending therein
08/17/2010US7777237 Semiconductor light-emitting device and method of fabricating the same
08/17/2010US7777223 Semiconductor device
08/17/2010US7777136 Multi-layered interconnect structure using liquid crystalline polymer dielectric
08/17/2010US7776993 Underfilling with acid-cleavable acetal and ketal epoxy oligomers
08/17/2010US7776739 Semiconductor device interconnection contact and fabrication method
08/17/2010US7776737 Reliability of wide interconnects
08/17/2010US7776736 Substrate for electronic device capable of suppressing fluorine atoms exposed at the surface of insulating film from reacting with water and method for processing same
08/17/2010US7776658 Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates
08/17/2010US7776652 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
08/17/2010US7776651 Method for compensating for CTE mismatch using phase change lead-free super plastic solders
08/17/2010US7776647 Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors
08/17/2010US7776452 A brazing layer of a tin/copper alloy is positioned between acopper layer and the surface of a molydenum layer; bonding the cooper ply layer to the molybdenum substrate; noncracking;protective devices; dimensional stability; electronics
08/17/2010US7776438 Curing agent to generate free radicals with heating; a radically polymerizable substance; and film-forming polymer, wherein a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m
08/17/2010US7776383 Ceramic nanomaterial; electrodes overcoated with multilayer ceramic film; sintering
08/17/2010US7775685 Power surface mount light emitting die package
08/12/2010WO2010091096A1 Techniques for placement of active and passive devices within a chip
08/12/2010WO2010090827A2 Semiconductor die package and method for making the same
08/12/2010WO2010090820A2 Ic package with capacitors disposed on an interposal layer
08/12/2010WO2010090326A1 Semiconductor device cooling structure and power converter provided with the cooling structure
08/12/2010WO2010090316A1 Semiconductor package and manufacturing method therefor
08/12/2010WO2010090280A1 Transparent sealing material composition and optical semiconductor element
08/12/2010WO2010090038A1 Insulating film material, and film formation method utilizing the material, and insulating film
08/12/2010WO2010089818A1 Semiconductor device and method for manufacturing same
08/12/2010WO2010057068A3 Method and apparatus for wafer bonding with enhanced wafer mating
08/12/2010WO2010056212A3 Method for encapsulating semiconductor dies
08/12/2010WO2010053821A3 Technique for interconnecting integrated circuits
08/12/2010WO2010024932A3 Enhanced wire bond stability on reactive metal surfaces of a semiconductor device by encapsulation of the bond structure
08/12/2010US20100203733 Etching method, semiconductor and fabricating method for the same
08/12/2010US20100203724 Method of manufacturing a semiconductor integrated circuit device
08/12/2010US20100203721 Multi-component integrated circuit contacts
08/12/2010US20100203671 Solid-state imaging device and method for making the same
08/12/2010US20100203283 Thermoplastic material
08/12/2010US20100202122 Carrier assembly for an integrated circuit
08/12/2010US20100201432 Multi-layered semiconductor apparatus
08/12/2010US20100201395 Semiconductor device and defect analysis method for semiconductor device
08/12/2010US20100201005 Microfluidic component and method for manufacturing same
08/12/2010US20100201004 Carbon/epoxy resin composition and method of producing a carbon-epoxy dielectric film using the same
08/12/2010US20100201003 Packaging Systems Incorporating Thin Film Liquid Crystal Polymer (LCP) and Methods of Manufacture
08/12/2010US20100201002 Semiconductor device and process for producing same
08/12/2010US20100201001 Semiconductor device and method for manufacturing semiconductor device
08/12/2010US20100201000 Bond pad support structure for semiconductor device
08/12/2010US20100200999 Semiconductor device and method of fabricating same
08/12/2010US20100200998 Semiconductor integrated circuit device
08/12/2010US20100200997 Semiconductor device having decreased contact resistance and method for manufacturing the same
08/12/2010US20100200996 Structural feature formation within an integrated circuit
08/12/2010US20100200995 Coupling layer composition for a semiconductor device, semiconductor device, method of forming the coupling layer, and apparatus for the manufacture of a semiconductor device
08/12/2010US20100200994 Semiconductor Device and Method of Manufacturing the Same
08/12/2010US20100200993 Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures
08/12/2010US20100200992 Lock and Key Through-Via Method for Wafer Level 3D Integration and Structures Produced
08/12/2010US20100200991 Dopant Enhanced Interconnect
08/12/2010US20100200990 Manufacturing method of semiconductor device and semiconductor device produced therewith
08/12/2010US20100200989 Liner materials and related processes for 3-d integration
08/12/2010US20100200988 GRAIN REFINEMENT BY PRECIPITATE FORMATION IN Pb-FREE ALLOYS OF TIN
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