Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/18/2010CN201556619U LED radiating module
08/18/2010CN201556618U High-power LED luminous element
08/18/2010CN201556617U LED structure
08/18/2010CN201556616U Epoxy plastic-package press-in type automobile rectifier diode
08/18/2010CN201556155U Heat sink
08/18/2010CN201555984U Thin-film transistor used for electric-wetting displaying device
08/18/2010CN201555188U LED radiator
08/18/2010CN201555187U Radiating structure for LED illuminating lamp
08/18/2010CN201555044U LED daylight fluorescent lamp tube
08/18/2010CN1997261B Electronic carrier board and its packaging structure
08/18/2010CN1976036B Semiconductor device and manufacturing method thereof
08/18/2010CN1964028B Radiator
08/18/2010CN1953174B Module with embedded electronic components
08/18/2010CN1943111B Surface acoustic wave device
08/18/2010CN1848305B Electronic assembly wire and flat cable comprising same
08/18/2010CN1755929B Method for forming semiconductor package and its structure
08/18/2010CN1707806B Spiral inductor formed in semiconductor substrate and method for forming the inductor
08/18/2010CN1685507B Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
08/18/2010CN101809738A Memory device interface methods, apparatus, and systems
08/18/2010CN101809736A Electronic component and device of high insulation resistance and method for producing the same
08/18/2010CN101809735A Interconnection element with posts formed by plating
08/18/2010CN101809734A Heat conductive sheet and power module
08/18/2010CN101809733A Stacked dual-die packages, methods of making, and systems incorporating said packages
08/18/2010CN101809177A Copper alloy plate material for electric and electronic components
08/18/2010CN101809088A Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
08/18/2010CN101808490A Heat dissipating device
08/18/2010CN101808488A Heat dissipating device
08/18/2010CN101808478A Plug hole BGA screen and plug hole method of printed circuit board
08/18/2010CN101807662A Thermoelectric element, manufacturing method thereof, chip stack structure and chip encapsulating structure
08/18/2010CN101807651A Light emitting device package
08/18/2010CN101807603A VDMOS (Vertical Double-diffusing Metal-Oxide-Semiconductor) transistor testing structure
08/18/2010CN101807599A Semiconductor device and method of manufacturing the same
08/18/2010CN101807595A Three-dimensional semiconductor structure and method of fabricating the same
08/18/2010CN101807592A Solid-state imaging device
08/18/2010CN101807589A Photosensitive module and optical mouse using same
08/18/2010CN101807587A TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof, and liquid crystal display
08/18/2010CN101807585A TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof
08/18/2010CN101807583A TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof
08/18/2010CN101807581A Contactless split-gate flash memory of shared word line and manufacture method thereof
08/18/2010CN101807575A Semiconductor device including contact plug and associated methods
08/18/2010CN101807573A Semiconductor device
08/18/2010CN101807572A Etching solution, active component array substrate and method for manufacturing active component array substrate
08/18/2010CN101807571A Capacitive element, designing method of the same and integrated circuit device including the same
08/18/2010CN101807570A Structural feature formation within integrated circuit
08/18/2010CN101807565A Semiconductor assembly
08/18/2010CN101807564A Semi-conductor module
08/18/2010CN101807563A Electrostatic protection element and electronic device
08/18/2010CN101807562A Stacked multi-encapsulation structure device, semiconductor encapsulation structure and manufacturing method thereof
08/18/2010CN101807561A Electronic element
08/18/2010CN101807560A Packaging structure of semiconductor device and manufacture method thereof
08/18/2010CN101807559A Stacked multi-encapsulation structure device, semiconductor encapsulation structure and manufacturing method thereof
08/18/2010CN101807558A Element sealing and bonding structure and process thereof
08/18/2010CN101807557A Substrate for holding at least one component and method for producing same
08/18/2010CN101807556A Substrate for holding at least one component and method for producing same
08/18/2010CN101807555A Substrate structure and package structure using the same
08/18/2010CN101807554A Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
08/18/2010CN101807533A Semiconductor die package and method for making the same
08/18/2010CN101807532A Ultra-thin chip inversely packaging method and packaged body
08/18/2010CN101807531A Ultra-thin chip packaging method and packaged body
08/18/2010CN101807517A Method for forming copper-interconnection MIM capacitor structure and formed structure thereof
08/18/2010CN101807516A Marking device with cleaning mechanism and cleaning method
08/18/2010CN101807511A Wafer horizontal chip-level package and method for identifying package by laser
08/18/2010CN101806440A Light emitting diode lamp
08/18/2010CN101806439A Heat dissipation structure of LED
08/18/2010CN101806438A Heat radiating method and structure thereof of light emitting diode lamp
08/18/2010CN101805574A Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof
08/18/2010CN101619813B High-power LED light source based on thermo acoustic refrigeration technology
08/18/2010CN101587889B Transistor distribution of static discharge protective circuit
08/18/2010CN101557676B Printed circuit board
08/18/2010CN101471321B Load bearing belt for packing chip and chip packaging structure
08/18/2010CN101425531B Organic electro-luminescence display device
08/18/2010CN101404274B Lead frame, packaging structure and packaging method for packaging three-pin electronic component
08/18/2010CN101399239B Flat shape electronic chip radiator
08/18/2010CN101393908B Encapsulation construction of multi-chip stack
08/18/2010CN101330065B Method for preparing convex point, low metallic layer of convex point and production method thereof
08/18/2010CN101320742B Semiconductor device and optical device module having the same
08/18/2010CN101271874B Semiconductor element with noise suppressing function and its manufacturing method
08/18/2010CN101266994B Image sensor and method for manufacturing thereof
08/18/2010CN101261962B Active part array base board and its making method
08/18/2010CN101256995B Semiconductor packaging body and silicon-based packaging substrate
08/18/2010CN101232020B Semiconductor integrated circuit
08/18/2010CN101123228B Fixing location for chip and heat radiating slice
08/18/2010CN101065843B Method for manufacturing an electronics module
08/18/2010CN101044258B Plasma sputtering film deposition method and equipment
08/18/2010CN101043041B Active matrix substrate, liquid crystal display device, and method of manufacturing liquid crystal display device
08/18/2010CN101006576B Integrated low-K hard mask
08/17/2010USRE41538 Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby
08/17/2010USRE41511 Semiconductor device having a thin-film circuit element provided above an integrated circuit
08/17/2010USRE41510 Lead frame
08/17/2010US7779311 Testing and recovery in a multilayer device
08/17/2010US7778621 Methods of operating electronic devices, and methods of providing electronic devices
08/17/2010US7778030 Method for cooling using impinging jet control
08/17/2010US7777356 Photosemiconductor element encapsulating material a polyaluminosiloxane modified by reaction with a silane coupling agent, such as 3-(methacryloyloxypropyl)trimethoxysilane; useful for backlights for liquid crystal displays, traffic lights, outdoor big displays, and advertisement sign boards
08/17/2010US7777355 based on platinum-toluenediamine complexes; photodetectors, color filters; digital cameras
08/17/2010US7777354 Integrated circuit package system with leaded package
08/17/2010US7777353 Semiconductor device and wire bonding method therefor
08/17/2010US7777352 Semiconductor device with semiconductor device components embedded in plastic package compound
08/17/2010US7777351 Thin stacked interposer package
08/17/2010US7777350 Semiconductor stack package having wiring extension part which has hole for wiring
08/17/2010US7777349 Semiconductor apparatus having side surface wiring
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