Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/24/2010US7781057 Seeding resins for enhancing the crystallinity of polymeric substructures
08/24/2010US7780314 Lighting assembly, heat sink and heat recovery system therefor
08/19/2010WO2010093574A1 Time division duplex front end module
08/19/2010WO2010093449A2 Thermoelectric feedback circuit
08/19/2010WO2010093316A1 A construction unit, comprising a light detector, and a process to assemble such construction unit to a carrier, such as printed circuit card
08/19/2010WO2010093256A1 Portable plasma torch system with cooling system for the electronic components using a second media
08/19/2010WO2010093064A1 Fire-resistant phosphorus-containing epoxy resin composition and hardened substance obtained thereby
08/19/2010WO2010092923A1 Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and led luminescent member
08/19/2010WO2010092905A1 Insulating circuit board, inverter device and power semiconductor device
08/19/2010WO2010092804A1 Semiconductor protection film-forming film with dicing sheet, method for manufacturing semiconductor device using same, and semiconductor device
08/19/2010WO2010092691A1 Semiconductor device
08/19/2010WO2010092579A1 A process for electroplating of copper
08/19/2010WO2010092042A2 Silicon-based sub-mount for an opto-electronic device
08/19/2010WO2010091497A1 Termination circuit for on-die termination
08/19/2010WO2010074842A3 Stacked power converter structure and method
08/19/2010WO2010074840A3 Acrylic thermal conductive sheet and method for producing the same
08/19/2010WO2010068652A3 Semiconductor die package with clip interconnection
08/19/2010WO2010068577A3 Anchor pin lead frame
08/19/2010US20100210107 Semiconductor device and manufacturing method thereof
08/19/2010US20100209596 Scalable lead zirconium titanate (pzt) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material
08/19/2010US20100208503 Three-dimensional semiconductor structure and method of fabricating the same
08/19/2010US20100208432 Thermal Interface Material, Electronic Device Containing the Thermal Interface Material, and Methods for Their Preparation and Use
08/19/2010US20100208405 Semiconductor ESD Device and Method of Making Same
08/19/2010US20100207648 Contact Resistance Test Structure and Method Suitable for Three-Dimensional Integrated Circuits
08/19/2010US20100207284 Method for providing rotationally symmetric alignment marks for an alignment system that requires asymmetric geometric layout
08/19/2010US20100207283 Wafer level chip scale package and method of laser marking the same
08/19/2010US20100207282 Primer resin for semiconductor device and semiconductor device
08/19/2010US20100207281 Semiconductor Chip with Reinforcement Layer
08/19/2010US20100207280 Wire bonding method and semiconductor device
08/19/2010US20100207279 Semiconductor package with ribbon with metal layers
08/19/2010US20100207278 Semiconductor package structure
08/19/2010US20100207276 Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures
08/19/2010US20100207275 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
08/19/2010US20100207274 Semiconductor device and its manufacturing method
08/19/2010US20100207273 Micro Ball Feeding Method
08/19/2010US20100207272 Semiconductor device including conductive element
08/19/2010US20100207271 Semiconductor device
08/19/2010US20100207270 Semiconductor module, method for manufacturing semiconductor module, and portable device
08/19/2010US20100207269 Integrated Circuit Nanowires
08/19/2010US20100207268 Semiconductor packaging substrate improving capability of electrostatic dissipation
08/19/2010US20100207267 Integrated Circuit Package
08/19/2010US20100207266 Chip package structure
08/19/2010US20100207265 Method of stiffening coreless package substrate
08/19/2010US20100207264 Semiconductor device and semiconductor device mounted structure
08/19/2010US20100207263 Semiconductor device
08/19/2010US20100207262 Package-on-package system with through vias and method of manufacture thereof
08/19/2010US20100207261 Chip attach adhesive to facilitate embedded chip build up and related systems and methods
08/19/2010US20100207260 Quad flat package with exposed common electrode bars
08/19/2010US20100207259 Semiconductor device packages with electromagnetic interference shielding
08/19/2010US20100207258 Chip package and manufacturing method thereof
08/19/2010US20100207257 Semiconductor package and manufacturing method thereof
08/19/2010US20100207256 Security chip
08/19/2010US20100207255 Shield for an intergrated circuit
08/19/2010US20100207252 Manufacturing method of semiconductor device
08/19/2010US20100207251 Scribe Line Metal Structure
08/19/2010US20100207250 Semiconductor Chip with Protective Scribe Structure
08/19/2010US20100207244 Semiconductor apparatus with decoupling capacitor
08/19/2010US20100207241 Semiconductor device including contact plug and associated methods
08/19/2010US20100207239 Semiconductor device and manufacturing method thereof
08/19/2010US20100207237 Crack stop structure enhancement of the integrated circuit seal ring
08/19/2010US20100207177 Method for producing a copper contact
08/19/2010US20100207163 Semiconductor device including electrostatic-discharge protection circuit
08/19/2010US20100206133 Method of refining solder materials
08/19/2010DE202010006407U1 Befestigungsmittel für Kühlkörper Fasteners for heat sink
08/19/2010DE102010000269A1 Halbleiter-Bauelement Semiconductor component
08/19/2010DE102009055691A1 Leistungshalbleitermodul The power semiconductor module
08/19/2010DE102009049774A1 BiCMOS-Schaltungsanordnung BiCMOS circuitry
08/19/2010DE102009042390A1 Leistungshalbleitermodul und Verfahren zu dessen Herstellung The power semiconductor module and method for its production
08/19/2010DE102009017621B3 Vorrichtung zur Verringerung der Störabstrahlung in einem leistungselektronischen System Device for reducing the noise emission in a power electronic system
08/19/2010DE102009008738A1 Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device
08/19/2010DE102009007837A1 Sensormodul und Verfahren zum Herstellen von Sensormodulen Sensor module and method of manufacturing of sensor modules
08/19/2010DE102009007203A1 LED module for illuminating e.g. road, has LEDs provided on LED carrier, and base supporting plate made of metal and exhibiting plastic deformability, which is larger than plastic deformability of cooling body
08/19/2010DE102009005915A1 Leistungshalbleitermodul in Druckkontaktausführung Power semiconductor module in pressure contact design
08/19/2010DE102008026347B4 Leistungselektronische Anordnung mit einem Substrat und einem Grundkörper Power electronic device comprising a substrate and a base body
08/19/2010DE102007029378B4 Interconnect und Substrat mit nachgiebigen, leitenden Zwischenverbindungen Interconnect and substrate with resilient, conductive interconnects
08/19/2010DE102005062344B4 Halbleiterbauteil für Hochfrequenzanwendungen und Verfahren zur Herstellung eines derartigen Halbleiterbauteils A semiconductor device for high frequency applications and method of manufacturing such a semiconductor device
08/19/2010DE102004031441B4 Verfahren zum Herstellen einer Schicht aus kristallinem Silicium, Verfahren zum Herstellen einer aktiven Schicht aus einer solchen Schicht, Verfahren zum Herstellen eines Schaltelements aus einer solchen aktiven Schicht sowie Schaltelement mit einer Schicht aus kristallinem Silicium A method for producing a layer of crystalline silicon, methods of making an active layer made of such a layer, methods of making a switching element of such an active layer, and switching element with a layer of crystalline silicon
08/19/2010DE10138913B4 Detektormodul, Detektor für Röntgen-Computertomograph und Verfahren zur Herstellung von Schnittbildern mittels eines Röntgen-Computertomographen Detector module detector for X-ray computed tomography apparatus and methods for producing cross-sectional images by means of an X-ray computer tomograph
08/19/2010DE10033352B4 Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe A process for preparing an electronic assembly and electronic assembly
08/19/2010CA2749111A1 A construction unit, comprising a light detector, and a process to assemble such construction unit to a carrier, such as printed circuit card
08/18/2010EP2219220A2 Connection structure, power module and method of manufacturing the same
08/18/2010EP2219219A1 Substrate for holding at least one component and method for producing a substrate
08/18/2010EP2219218A2 Assembly and method for producing an assembly
08/18/2010EP2219217A2 Semi-conductor module
08/18/2010EP2219216A2 Semi-conductor module
08/18/2010EP2219215A1 Semiconductor device and method for manufacturing the same
08/18/2010EP2219213A2 Semiconductor assembly
08/18/2010EP2219211A1 Substrate for holding at least one component and method for producing a substrate
08/18/2010EP2218311A2 Process for placing, securing and interconnecting electronic components
08/18/2010EP2218103A1 Multi-chip module and proximity communication between chips in the module
08/18/2010EP2218102A2 Method for making an electrically conducting mechanical interconnection member
08/18/2010EP2218101A2 Silicon-ceramic composite substrate
08/18/2010EP2053646B1 Method for vertical interconnection inside 3D electronic modules using vias
08/18/2010EP1598863B1 Semiconductor device and radiation detector employing it
08/18/2010EP0996962B1 Resin molded type semiconductor device
08/18/2010CN201557360U Cooling fan device and electronic computing system thereof
08/18/2010CN201557356U electronic radiator
08/18/2010CN201557354U Mounting structure for vehicle-mounted sound equipment IC (Integrated Chip) and radiating fins
08/18/2010CN201556623U schottky diode
08/18/2010CN201556621U Back-illuminated type tellurium-cadmium-mercury long wave infrared detector
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