Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/25/2010CN101814462A Semiconductor package element and a fabricating method thereof together with a sealing method
08/25/2010CN101814461A Packaging substrate structure and chip packaging structure, as well as manufacturing method thereof
08/25/2010CN101814460A Active element array substrate and manufacturing method thereof
08/25/2010CN101814459A Semiconductor package assembly and plasma display device
08/25/2010CN101814458A 半导体装置 Semiconductor device
08/25/2010CN101814446A Island expose and multi-salient-point island expose lead frame structure and carving and plating method thereof
08/25/2010CN101814445A Packaging process of photoreceptive chip and structure thereof
08/25/2010CN101814443A Chip design method for multi-chip module of high-performance processor with optical interface
08/25/2010CN101814442A Manufacturing method of glass-sealed package, and glass substrate
08/25/2010CN101814441A Method for manufacturing a semiconductor component and structure therefor
08/25/2010CN101814440A Semiconductor packaging structure and cooling fin arrangement method thereof
08/25/2010CN101813266A High-power LED street lamp based on composite heat pipe
08/25/2010CN101812216A Electronic packaging material containing transition metal oxide nanometer particles
08/25/2010CN101515587B Thin film transistor array substrate and method for producing same
08/25/2010CN101515577B Connection pad structure, chip joint structure and method for detecting chip joint state
08/25/2010CN101515543B Gallium nitride membrane structure grown on silicon substrate and growing method thereof
08/25/2010CN101510540B Projection structure and manufacture method, display panel and detection method for chip stitching state
08/25/2010CN101494222B Semiconductor memory device, semiconductor memory array and read-in method
08/25/2010CN101477992B Array substrate for liquid crystal display device
08/25/2010CN101461058B Thermal resistor, semiconductor device using the same, and electric device
08/25/2010CN101452163B TFT-LCD array substrate structure and method for manufacturing same
08/25/2010CN101451697B LED lamp
08/25/2010CN101413647B LED light fitting with heat radiation structure
08/25/2010CN101410942B Symmetrical mim capacitor design
08/25/2010CN101374397B Apparatus for cooling miniature fluid and used micro liquid droplet generator thereof
08/25/2010CN101373777B Thin-film transistor substrate, electric moistening type display apparatus method for manufacturing the thin-film transistor substrate
08/25/2010CN101359644B Integrated circuit package structure
08/25/2010CN101330069B Flip chip package and method for manufacturing the same
08/25/2010CN101312181B Semiconductor chip, integrated circuit structure and semi-conductor wafer
08/25/2010CN101271887B Semiconductor light emitting device
08/25/2010CN101261979B Inegrated circuit structure
08/25/2010CN101242727B Heat radiation fin structure
08/25/2010CN101236940B Line structure for reconfiguration line layer
08/25/2010CN101213660B Heat exchange device and MR-16 lamp and wall-washing lamp, vehicle lamp and heat radiation method
08/25/2010CN101203119B Heat radiating device
08/25/2010CN101203117B Heat radiating device
08/25/2010CN101203116B Air tightness cavity and moulding method, heat radiating device using the air tightness cavity
08/25/2010CN101202267B Method and structure supplying electric connection for IC die
08/25/2010CN101202257B Semiconductor device
08/25/2010CN101137278B Heat radiating device
08/25/2010CN101137277B Radiation device assembly and fastener using the same
08/25/2010CN101098607B Heat radiating module
08/25/2010CN101095239B High temperature electronic device
08/25/2010CN101091004B Method for forming tantalum nitride film
08/25/2010CN101091002B Method for forming tantalum nitride film
08/25/2010CN101060764B Heat radiator
08/25/2010CN101048056B Radiator and electronic equipment with radiator
08/25/2010CN101047197B Solid-state image sensing device and method of operating the same
08/25/2010CN101039984B Epoxy resin composition and semiconductor device
08/24/2010USRE41581 Monolithic low dielectric constant platform for passive components and method
08/24/2010USRE41576 cooling a heat generating electronic component with an associated thermal dissipation member such as heat sink; the interface is formed as a self-supporting layer of a thermally-conductive for improved heat transfer
08/24/2010USRE41559 Semiconductor device package with improved cooling
08/24/2010US7783276 Wireless communication system
08/24/2010US7783142 Low stress package
08/24/2010US7782522 Encapsulation methods for interferometric modulator and MEMS devices
08/24/2010US7781901 Semiconductor device and processing method of the same
08/24/2010US7781900 Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same
08/24/2010US7781899 Leadframe having mold lock vent
08/24/2010US7781898 IC package reducing wiring layers on substrate and its chip carrier
08/24/2010US7781897 Semiconductor device and method for producing the same
08/24/2010US7781896 Semiconductor device and process for fabrication thereof
08/24/2010US7781895 Via electromigration improvement by changing the via bottom geometric profile
08/24/2010US7781894 Semiconductor device and manufacturing method of same
08/24/2010US7781890 Structure and method for parallel testing of dies on a semiconductor wafer
08/24/2010US7781889 Shielded via
08/24/2010US7781888 Surface mounting electronic component and manufacturing method thereof
08/24/2010US7781887 Semiconductor device including an interconnect
08/24/2010US7781886 Electronic chip contact structure
08/24/2010US7781885 Optoelectronic semiconductor package and method for attaching heat dissipation element thereto
08/24/2010US7781884 Method of fabrication of on-chip heat pipes and ancillary heat transfer components
08/24/2010US7781883 Electronic package with a thermal interposer and method of manufacturing the same
08/24/2010US7781882 Low voltage drop and high thermal performance ball grid array package
08/24/2010US7781879 Apparatus for integrating capacitors in stacked integrated circuits
08/24/2010US7781878 Zigzag-stacked package structure
08/24/2010US7781877 Packaged integrated circuit devices with through-body conductive vias, and methods of making same
08/24/2010US7781876 Curing layers of a semiconductor product using electromagnetic fields
08/24/2010US7781875 Techniques for packaging multiple device components
08/24/2010US7781873 Encapsulated leadframe semiconductor package for random access memory integrated circuits
08/24/2010US7781871 Structure for reduction of soft error rates in integrated circuits
08/24/2010US7781870 Wire bond and redistribution layer process
08/24/2010US7781861 Semiconductor device
08/24/2010US7781851 Semiconductor device having reduced die-warpage and method of manufacturing the same
08/24/2010US7781849 Semiconductor devices and methods of fabricating the same
08/24/2010US7781844 Semiconductor device having a stressor film
08/24/2010US7781841 System and method to reduce noise in a substrate
08/24/2010US7781823 Nonvolatile semiconductor memory
08/24/2010US7781812 Semiconductor device for non-volatile memory and method of manufacturing the same
08/24/2010US7781808 Semiconductor apparatus and complimentary MIS logic circuit
08/24/2010US7781794 Resin sheet for encapsulating optical semiconductor element and optical semiconductor device
08/24/2010US7781782 Device for defeating reverse engineering of integrated circuits by optical means
08/24/2010US7781772 Display device and manufacturing method thereof
08/24/2010US7781757 amine compound having a tertiary amine unit and a thiophene ring structure, used for an organic transistor having higher carrier mobility
08/24/2010US7781683 Assembly for a microstimulator
08/24/2010US7781682 Methods of fabricating multichip packages and structures formed thereby
08/24/2010US7781322 Nickel alloy salicide transistor structure and method for manufacturing same
08/24/2010US7781316 Methods of manufacturing metal-silicide features
08/24/2010US7781299 Leadframe semiconductor package stand and method for making the same
08/24/2010US7781264 Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
08/24/2010US7781262 Method for producing semiconductor device and semiconductor device
08/24/2010US7781240 Integrated circuit device
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