Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/26/2010US20100213583 Electronic parts, and method for arranging shielding case and chip parts
08/26/2010US20100213581 Dielectric film with low coefficient of thermal expansion (cte) using liquid crystalline resin
08/26/2010US20100213578 Methods of forming integrated circuits and resulting structures
08/26/2010US20100213570 Antifuse
08/26/2010US20100213569 Integrated circuits having fuses and systems thereof
08/26/2010US20100213568 Micro-electro-mechanical-system device with guard ring and method for making same
08/26/2010US20100213566 Reduced-crosstalk wirebonding in an optical communication system
08/26/2010US20100213551 E-Fuse and Associated Control Circuit
08/26/2010US20100213549 Semiconductor device
08/26/2010US20100213515 Metal or Via Programmable Element
08/26/2010US20100213484 Lead frame assembly, package structure and LED package structure
08/26/2010US20100213437 Light emitting device
08/26/2010DE4401616B4 Keramische Mehrfachschichten-Verdrahtungskarte Ceramic multi-layer wiring board
08/26/2010DE202010007905U1 Wärmeleitelement, Anordnung und Verwendung desselben The same heat conducting arrangement and use
08/26/2010DE112008002559T5 Drahtlose Halbleiterbaugruppe für effiziente Wärmeabfuhr Wireless semiconductor package for efficient heat dissipation
08/26/2010DE102010005465A1 Electrical or electronic component e.g. integrated circuit, has metallic contact layer arranged on solid metallic socket and forming structure e.g. micro structure, including elevations and slots with height of specific value
08/26/2010DE102010000417A1 Elektronisches Bauelement und Verfahren zu seiner Herstellung An electronic device and method for its preparation
08/26/2010DE102010000407A1 Halbleiter-Package mit einem aus Metallschichten bestehenden Band The semiconductor package with an existing metal layers band
08/26/2010DE102010000401A1 Halbleiterbauelement Semiconductor device
08/26/2010DE102010000400A1 Array von Halbleiterbauelementen Array of semiconductor devices
08/26/2010DE102010000355A1 Bauelement und Verfahren zum Koppeln eines ersten und zweiten Bauelementbereichs Device and method for coupling a first and second device region
08/26/2010DE102009049613A1 Leistungshalbleitervorrichtung Power semiconductor device
08/26/2010DE102009010256A1 Leiterplatte mit Kühlkörper PCB with heat sink
08/26/2010DE102009009499A1 Method for marking semiconductor component i.e. solar cell, of solar module, involves processing coded semiconductor substrate for producing conductor structure, where conductor structure is formed such that coding is readable
08/26/2010DE102009009288A1 Starrflexible Trägerplatte Flex-rigid support plate
08/26/2010DE102009000888A1 Halbleiteranordnung Semiconductor device
08/26/2010DE102009000885A1 Halbleitermodul Semiconductor module
08/26/2010DE102009000883A1 Substrat zur Aufnahme mindestens eines Bauelements und Verfahren zur Herstellung eines Substrats Substrate for receiving at least one device and process for the preparation of a substrate
08/26/2010DE102009000882A1 Substrat zur Aufnahme mindestens eines Bauelements und Verfahren zur Herstellung eines Substrats Substrate for receiving at least one device and process for the preparation of a substrate
08/26/2010DE102009000514A1 Verbundbauteil sowie Verfahren zum Herstellen eines Verbundbauteil The composite component as well as method for producing a composite component
08/25/2010EP2222150A1 Circuit board with cooling unit
08/25/2010EP2222149A1 Electronic component mounting structure and electronic component mounting method
08/25/2010EP2221926A1 Anisotropic conductive joint package
08/25/2010EP2221910A1 Base station RF duplexer, RF module, and RF system field
08/25/2010EP2221870A2 Power semiconductor module and fabrication method thereof
08/25/2010EP2221869A2 Wire bond chip package
08/25/2010EP2221868A2 Optical semiconductor device encapsulated with silicone resin
08/25/2010EP2221867A1 Connection terminal, package using the same, and electronic device
08/25/2010EP2221864A2 Method for forming Cu film
08/25/2010EP2221862A1 Semiconductor device
08/25/2010EP2221861A1 Semiconductor device bonding wire and wire bonding method
08/25/2010EP2221860A2 Chip Attach Adhesive To Facilitate Embedded Chip Build Up And Related Systems And Methods
08/25/2010EP2221666A1 Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
08/25/2010EP2220921A1 Cooling device utilizing internal synthetic jets
08/25/2010EP2220682A2 Formation of a hybrid integrated circuit device
08/25/2010EP2220680A1 Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization
08/25/2010EP2220679A1 Embedded package security tamper mesh
08/25/2010EP2220677A2 Heat transfer composite, associated device and method
08/25/2010EP2220674A2 Cooling fin and manufacturing method of the cooling fin
08/25/2010EP2220673A1 Thermal stress reduction
08/25/2010EP1782428B1 An organic ferroelectric or electret memory circuit and a method for making same
08/25/2010EP1255642B1 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby
08/25/2010CN201563340U Radiator protecting sleeve and radiating device with same
08/25/2010CN201563336U Uniform-temperature radiator support structure
08/25/2010CN201563335U Uniform-temperature plate heat dissipating device
08/25/2010CN201563332U radiator
08/25/2010CN201562692U LED paster type encapsulation with roughened surface
08/25/2010CN201562680U Multi-chip component structure
08/25/2010CN201562679U Surface mounting LED
08/25/2010CN201562678U Cross DIP14 lead frame structure
08/25/2010CN201562677U Integrated circuit lead frame
08/25/2010CN201562676U Chip stacking device
08/25/2010CN201562675U Adjustable pressure plate and radiator with same
08/25/2010CN1992255B Semiconductor structure, electrical fuse and method of forming the same
08/25/2010CN1905181B Semiconductor packages for surface mounting and method of producing same
08/25/2010CN1840258B Method for manufacturing heat pipe with flat end surface
08/25/2010CN101816068A IC mounting substrate and method for manufacturing the same
08/25/2010CN101815422A Radiator
08/25/2010CN101814911A Semiconductor component and method of determining temperature
08/25/2010CN101814697A Light-emitting device and method of manufacturing the same
08/25/2010CN101814525A ESD protecting method for fin field effect transistor(FinFET)
08/25/2010CN101814511A TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof
08/25/2010CN101814504A Metal structure for memory device
08/25/2010CN101814501A Semiconductor device
08/25/2010CN101814498A Structure with built-in NMOS auxiliary trigger controllable silicon
08/25/2010CN101814491A IC circuit with fuse and a system thereof
08/25/2010CN101814488A LED packaging structure and loader structure
08/25/2010CN101814485A Packaging and fabricating method for mini power semiconductor with stacked inductance IC chip
08/25/2010CN101814484A Chip package and manufacturing method thereof
08/25/2010CN101814483A Packaging structure of sensing element and method thereof
08/25/2010CN101814482A Base island lead frame structure and production method thereof
08/25/2010CN101814481A No-pad lead frame structure and production method thereof
08/25/2010CN101814480A Chip package structure and packaging method thereof
08/25/2010CN101814479A Electrode contact structure and method for fabricating the same
08/25/2010CN101814478A An Image sensing device and a making method with the same
08/25/2010CN101814477A A Silicon through holes after the interlinked structure being passivated.
08/25/2010CN101814476A 半导体装置 Semiconductor device
08/25/2010CN101814475A Barrier structures and methods for through substrate vias
08/25/2010CN101814474A Wire bond chip package
08/25/2010CN101814473A Mounting board and display device
08/25/2010CN101814472A Semiconductor package and plasma display device including the same
08/25/2010CN101814471A Interconnect structure
08/25/2010CN101814470A Micro-channel heat sink for electronic encapsulation device
08/25/2010CN101814469A Gravity circulation evaporation cooling semiconductor power device package
08/25/2010CN101814468A Heatsink mounting system
08/25/2010CN101814467A Package structure of heat radiating plate externally connected with island embedded chip pyramid locking hole heat radiating block convex cylinder
08/25/2010CN101814466A Thermally enhanced semiconductor package
08/25/2010CN101814465A Electronic component mounting structure and electronic component mounting method
08/25/2010CN101814464A Silicon controlled thyristor device micro slot group composite phase change integrated cooling heat dissipation method and device
08/25/2010CN101814463A Semiconductor package and manufacturing method thereof
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