Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/31/2010US7786555 Semiconductor devices with multiple heat sinks
08/31/2010US7786554 Stress-free lead frame
08/31/2010US7786553 Method of fabricating semiconductor device
08/31/2010US7786552 Semiconductor device having hydrogen-containing layer
08/31/2010US7786551 Integrated circuit system with wafer trimming
08/31/2010US7786549 Antifuse structure and system for closing thereof
08/31/2010US7786546 System-on-chip with shield rings for shielding functional blocks therein from electromagnetic interference
08/31/2010US7786540 Sensor platform using a non-horizontally oriented nanotube element
08/31/2010US7786536 Semiconductor device and method for fabricating the same
08/31/2010US7786512 Dense non-volatile memory array and method of fabrication
08/31/2010US7786487 Semiconductor device and manufacturing method thereof
08/31/2010US7786478 Semiconductor integrated circuit having terminal for measuring bump connection resistance and semiconductor device provided with the same
08/31/2010US7786477 Semiconductor device for measuring an overlay error, method for measuring an overlay error, lithographic apparatus and device manufacturing method
08/31/2010US7786476 Semiconductor device system and method for modifying a semiconductor device
08/31/2010US7786429 Camera module with window mechanical attachment
08/31/2010US7786008 Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof
08/31/2010US7786007 Method and apparatus of stress relief in semiconductor structures
08/31/2010US7786002 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
08/31/2010US7785986 Method of manufacturing semiconductor device
08/31/2010US7785981 Solid-state imaging device and method of manufacturing solid-state imaging device
08/31/2010US7785931 Chip-based thermo-stack
08/31/2010US7785715 Compound with at least two carbon-carbon double bonds such as triallyl isocyanurate; compound with SiH groups such as reaction product of 1,3,5,7 tetramethylcyclotetrasiloxane and triallyl isocyanurate; coupler; and not less than 5% by weight of rutile TiO2
08/31/2010US7785708 Adhesive film for circuit connection, and circuit connection structure
08/31/2010US7785706 Semiconductor wafer and process for its production
08/31/2010US7784913 Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
08/31/2010US7784531 Nanoengineered thermal materials based on carbon nanotube array composites
08/26/2010WO2010096513A1 Electrical connector assembly with back plate
08/26/2010WO2010096473A2 Semiconductor chip with reinforcement layer
08/26/2010WO2010096213A2 Integrated circuit micro-module
08/26/2010WO2010095899A2 Semiconductor package processing system
08/26/2010WO2010095826A2 Method for generating laser beam irradiation trajectory
08/26/2010WO2010095601A1 Functional molded article and method for producing same
08/26/2010WO2010095593A1 Semiconductor wafer assembly, method for producing semiconductor wafer assembly, and semiconductor device
08/26/2010WO2010095592A1 Method for producing semiconductor wafer assembly, semiconductor wafer assembly, and semiconductor device
08/26/2010WO2010095498A1 Method for forming cu film and storage medium
08/26/2010WO2010095497A1 Method for forming cu film and storage medium
08/26/2010WO2010095373A1 Ebullient cooling apparatus
08/26/2010WO2010095368A1 Reception circuit and signal reception method
08/26/2010WO2010095367A1 Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed package
08/26/2010WO2010095359A1 Light emitting device and light emitting module
08/26/2010WO2010095346A1 Semiconductor device, basic cell and semiconductor integrated circuit device
08/26/2010WO2010095335A1 Method of producing liquid-cooled jacket
08/26/2010WO2010095201A1 Semiconductor device and method for manufacturing semiconductor device
08/26/2010WO2010095188A1 Transistor and transistor control system
08/26/2010WO2010095006A1 Package assembly and method of tuning a natural resonant frequency of a package
08/26/2010WO2010095003A1 Semiconductor device with appraisal circuitry
08/26/2010WO2010094511A2 Component arrangement and method for production thereof
08/26/2010WO2010094338A1 Electrical apparatus with electrostatic shield
08/26/2010WO2010094315A1 Flip-chip soldering method, and circuit comprising a soldered semiconductor chip which is contacted using flip-chip technology
08/26/2010WO2010094154A1 Thermal pad and method of forming the same
08/26/2010WO2010076187A3 Integrated electronic device with transceiving antenna and magnetic interconnection
08/26/2010WO2010068699A3 Semiconductor die interconnect formed by aerosol application of electrically conductive material
08/26/2010WO2010068515A3 Electronic devices including flexible electrical circuits and related methods
08/26/2010WO2010057041A3 Package including proximately-positioned lead frame
08/26/2010US20100214754 Ribbon bonding in an electronic package
08/26/2010US20100214753 Pb-free solder-connected structure and electronic device
08/26/2010US20100214750 Electronics module comprising an embedded microcircuit
08/26/2010US20100214566 Lateral shift measurement using an optical technique
08/26/2010US20100214519 Tape carrier package and liquid crystal display device having the same
08/26/2010US20100214066 Chip and Transmitter for Wireless Communication System
08/26/2010US20100213623 Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby
08/26/2010US20100213622 Semiconductor device
08/26/2010US20100213621 Moisture-proof device, moisture-proof IC, and method for increasing moisture-proof capability of IC
08/26/2010US20100213620 Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
08/26/2010US20100213619 Bonding structure of bonding wire and method for forming same
08/26/2010US20100213618 Semiconductor Device and Method of Forming Through Vias with Reflowed Conductive Material
08/26/2010US20100213617 Semiconductor device and method for manufacturing the same
08/26/2010US20100213616 Semiconductor device and a method of manufacturing the same, and an electronic device
08/26/2010US20100213615 Semiconductor device
08/26/2010US20100213614 Methods for Passivating Metallic Interconnects
08/26/2010US20100213613 Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
08/26/2010US20100213612 Through-silicon via formed with a post passivation interconnect structure
08/26/2010US20100213611 Semiconductor device
08/26/2010US20100213610 Semiconductor Device and Method of Forming an Interconnect Structure for 3-D Devices Using Encapsulant for Structural Support
08/26/2010US20100213609 Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure
08/26/2010US20100213608 Solder bump UBM structure
08/26/2010US20100213607 Integrated circuit micro-module
08/26/2010US20100213606 Dielectric enhancements to chip-to-chip capacitive proximity communication
08/26/2010US20100213605 Semiconductor device and method of manufacturing semiconductor device
08/26/2010US20100213604 Integrated circuit micro-module
08/26/2010US20100213603 Integrated circuit micro-module
08/26/2010US20100213602 Integrated circuit micro-module
08/26/2010US20100213601 Integrated circuit micro-module
08/26/2010US20100213600 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers
08/26/2010US20100213599 Semiconductor device and manufacturing method thereof
08/26/2010US20100213598 Circuit carrier and semiconductor package using the same
08/26/2010US20100213597 Semiconductor element mounting board
08/26/2010US20100213596 Stack package
08/26/2010US20100213595 Semiconductor package and manufacturing method thereof and encapsulating method thereof
08/26/2010US20100213594 Semiconductor device and a manufacturing method of the same
08/26/2010US20100213593 Stacked semiconductor package
08/26/2010US20100213592 Semiconductor Module, Terminal Strip, Method for Manufacturing Terminal Strip, and Method for Manufacturing Semiconductor Module
08/26/2010US20100213591 Semiconductor package and method of manufacturing the same
08/26/2010US20100213590 Systems and Methods of Tamper Proof Packaging of a Semiconductor Device
08/26/2010US20100213589 Multi-chip package
08/26/2010US20100213588 Wire bond chip package
08/26/2010US20100213587 Electronic device
08/26/2010US20100213586 Semiconductor package and manufacturing method thereof
08/26/2010US20100213585 Semiconductor device
08/26/2010US20100213584 Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package
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