Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/01/2010CN101819962A SCR (Silicon Controlled rectifier) static protection device
09/01/2010CN101819961A Array substrate of liquid crystal display device, and signal wire and manufacturing method thereof
09/01/2010CN101819960A Base plate, semiconductor packaging piece applying same and manufacture method of base plate
09/01/2010CN101819959A Semiconductor module and portable device
09/01/2010CN101819958A Lead frame structure for flip chip and etching-plating production method thereof
09/01/2010CN101819957A Wafer packaging structure and packaging substrate
09/01/2010CN101819956A 半导体器件 Semiconductor devices
09/01/2010CN101819955A Semiconductor packaging structure with reinforced heat dissipation property
09/01/2010CN101819954A Island-exposed chip packaging structure with pyramid heat radiating block with locking hole and protruding surface
09/01/2010CN101819953A Transparent epoxy resin packaging adhesive
09/01/2010CN101819952A Semiconductor device
09/01/2010CN101819951A Base plate, semiconductor packaging piece applying same and manufacture method of base plate
09/01/2010CN101819945A Manufacturing method of semiconductor device with fuse module
09/01/2010CN101819943A Processing method of fuse wire on copper interconnection layer and semiconductor device thereof
09/01/2010CN101819940A Method and structure for testing wafer
09/01/2010CN101819648A Noncontact ic label and method and apparatus for manufacturing the same
09/01/2010CN101819382A Method for reducing wafer defects in edge bead removal process and wafer structure
09/01/2010CN101818889A Light-emitting diode (LED) lamp
09/01/2010CN101818888A Irradiating block and light-emitting device
09/01/2010CN101533838B Mom capacitors integrated with air-gaps
09/01/2010CN101477976B Display panel with signal reaction time homogenized and manufacturing method thereof
09/01/2010CN101436610B Organic electric field light-emitting display device
09/01/2010CN101436583B Stacking type packaging piece
09/01/2010CN101410989B Function element mounting module and method for manufacturing same
09/01/2010CN101360391B Embedded capacitor construction of printed circuit board
09/01/2010CN101359642B Semiconductor chip package and method for designing the same
09/01/2010CN101356642B Printed-circuit board, and method for manufacturing the same
09/01/2010CN101355068B Bond pad stacks for ESD under pad and active under pad bonding
09/01/2010CN101351873B Integrated capacitors in package-level structures, processes of making same, and systems containing same
09/01/2010CN101346817B Solid state imaging element module fabrication method
09/01/2010CN101340803B Fixture construction
09/01/2010CN101330074B Protection circuit for semiconductor device and semiconductor device including the same
09/01/2010CN101322242B Cap for airtight sealing, package for housing electronic part, and process for producing airtightly sealing cap
09/01/2010CN101303980B Surface adhesion type diode support and method for manufacturing the same
09/01/2010CN101266966B Multi-core encapsulation module and its making method
09/01/2010CN101257009B LED encapsulation body and encapsulation method thereof
09/01/2010CN101246871B Multi-layer ceramic substrate and its preparing process
09/01/2010CN101208003B Electronic apparatus cooling structure
09/01/2010CN101197351B Slow fusing type fuse structure of chip and its production method
09/01/2010CN101185164B Carbon nanotube bond pad structure and method therefor
09/01/2010CN101165866B Integrated circuit package and method of making same
09/01/2010CN101150096B Recycling pressing and printing device for crystal wafer connection
09/01/2010CN101123861B Liquid supply module and its applied electronic device
09/01/2010CN101095230B Carbon nanotube-based conductive connections for integrated circuit devices
09/01/2010CN101071794B III-V crystal and production method
09/01/2010CN101069459B Multilayer printed wiring board and process for producing the same
09/01/2010CN101064318B Thin film transistor array panel for display and manufacturing method of the same
08/2010
08/31/2010US7788053 Configurable voltage regulator
08/31/2010US7787838 Integrated circuit, and an arrangement and method for interconnecting components of an integrated circuit
08/31/2010US7787252 Preferentially cooled electronic device
08/31/2010US7787251 Printed circuit board employing heat sink retaining apparatus and method of use
08/31/2010US7786837 Semiconductor power device having a stacked discrete inductor structure
08/31/2010US7786607 Overlay correction by reducing wafer slipping after alignment
08/31/2010US7786606 Resin-sealed electronic device and method of manufacturing the same
08/31/2010US7786605 Stacked semiconductor components with through wire interconnects (TWI)
08/31/2010US7786604 Dual MOSFET package
08/31/2010US7786603 Electronic assembly having graded wire bonding
08/31/2010US7786602 Patterned die attach and packaging method using the same
08/31/2010US7786601 Semiconductor chip and multi-chip package
08/31/2010US7786600 Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire
08/31/2010US7786599 Semiconductor device with an improved solder joint
08/31/2010US7786598 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
08/31/2010US7786597 Multilayer wiring board and semiconductor device
08/31/2010US7786596 Hermetic seal and reliable bonding structures for 3D applications
08/31/2010US7786595 Stacked chip package structure with leadframe having bus bar
08/31/2010US7786594 Wafer level stack structure for system-in-package and method thereof
08/31/2010US7786593 Integrated circuit die with pedestal
08/31/2010US7786592 Chip capacitive coupling
08/31/2010US7786591 Die down ball grid array package
08/31/2010US7786590 Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same
08/31/2010US7786589 Semiconductor device and method for manufacturing semiconductor device
08/31/2010US7786588 Composite interconnect structure using injection molded solder technique
08/31/2010US7786586 Inductor of semiconductor device and method for manufacturing the same
08/31/2010US7786585 Semiconductor integrated circuit device
08/31/2010US7786584 Through substrate via semiconductor components
08/31/2010US7786583 Integrated circuit chip utilizing oriented carbon nanotube conductive layers
08/31/2010US7786582 System for providing a redistribution metal layer in an integrated circuit
08/31/2010US7786581 Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device
08/31/2010US7786579 Apparatus for crack prevention in integrated circuit packages
08/31/2010US7786578 Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure
08/31/2010US7786577 Component with chip through-contacts
08/31/2010US7786576 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
08/31/2010US7786575 Stacked die semiconductor device having circuit tape
08/31/2010US7786574 Microelectronic imaging units
08/31/2010US7786573 Packaging chip having interconnection electrodes directly connected to plural wafers
08/31/2010US7786572 System in package (SIP) structure
08/31/2010US7786571 Heat-conductive package structure
08/31/2010US7786570 Heat sink package
08/31/2010US7786569 Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection
08/31/2010US7786568 Window BGA semiconductor package
08/31/2010US7786567 Substrate for electrical device and methods for making the same
08/31/2010US7786566 Semiconductor integrated circuit
08/31/2010US7786565 Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor
08/31/2010US7786564 Semiconductor device and method for manufacturing semiconductor device
08/31/2010US7786563 Stacking multiple devices using single-piece interconnecting element
08/31/2010US7786562 Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
08/31/2010US7786561 Encapsulated microcomponent equipped with at least one getter
08/31/2010US7786560 MEMS package structure
08/31/2010US7786558 Semiconductor component and methods to produce a semiconductor component
08/31/2010US7786557 QFN Semiconductor package
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