Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/02/2010US20100219532 Semiconductor device
09/02/2010US20100219531 Method of forming a low resistance semiconductor contact and structure therefor
09/02/2010US20100219530 Contact Structure of a Semiconductor Device
09/02/2010US20100219529 Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects
09/02/2010US20100219528 Electromigration-Resistant Flip-Chip Solder Joints
09/02/2010US20100219527 Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom
09/02/2010US20100219526 Flexible microelectronics adhesive
09/02/2010US20100219525 Semiconductor device
09/02/2010US20100219524 Chip scale package and method of fabricating the same
09/02/2010US20100219523 Stackable integrated circuit package system
09/02/2010US20100219522 Semiconductor device and method of manufacturing the same, and electronic apparatus
09/02/2010US20100219521 Window type semiconductor package
09/02/2010US20100219520 Lead frame
09/02/2010US20100219519 Complete power management system implemented in a single surface mount package
09/02/2010US20100219518 Quad flat non-leaded package
09/02/2010US20100219517 Method for manufacturing semiconductor device, semiconductor device and molding die
09/02/2010US20100219516 Power management integrated circuit
09/02/2010US20100219515 Lead frame
09/02/2010US20100219514 Semiconductor device
09/02/2010US20100219513 Integrated circuit structure and a method of forming the same
09/02/2010US20100219512 Method for Forming Porous Insulating Film and Semiconductor Device
09/02/2010US20100219511 Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
09/02/2010US20100219508 Semiconductor device
09/02/2010US20100219507 Process for producing semiconductor device
09/02/2010US20100219503 Chip capacitive coupling
09/02/2010US20100219476 Electrostatic protection device for semiconductor circuit
09/02/2010US20100219454 Field-effect transistor and method of manufacturing the same
09/02/2010US20100219421 Method and system for electrically coupling a chip to chip package
09/02/2010US20100218891 Multi-layered interconnect structure using liquid crystalline polymer dielectric
09/02/2010US20100218371 Manufacturing method for a wireless communication device and manufacturing apparatus
09/02/2010DE10327945B4 Halbleiterspeichervorrichtungen und Verfahren zur Herstellung derselben unter Verwendung von Seitenwandabstandshaltern Semiconductor memory devices and methods of making the same using sidewall spacers
09/02/2010DE102009060277A1 Verfahren zur Herstellung von Justiermarken für licht-undurchlässige bzw. licht-absorbierende Schichten (Light-Shield-Resistmasken) Process for the preparation of alignment marks for light-impervious or light-absorbing layers (light-shield resist masks)
09/02/2010DE102009056868A1 Halbleitervorrichtung Semiconductor device
09/02/2010DE102009011349A9 Halbleiterbauelement mit inhärenten Kapazitäten und Verfahren zur Herstellung desselben Of the same semiconductor device with inherent capacity and process for preparing
09/02/2010DE102009010885A1 Metallsystem eines Halbleiterbauelements mit Metallsäulen mit einem kleineren Durchmesser an der Unterseite Metal system of a semiconductor device with a metal pillars having a smaller diameter at the bottom
09/02/2010DE102009010845A1 Mikrostrukturbauelement mit einer Metallisierungsstruktur mit selbstjustierten Luftspalten und wieder aufgefüllten Luftspaltausschließungszonen Microstructure device with a metallization with self-aligned air gaps and refilled Luftspaltausschließungszonen
09/02/2010DE102009009828A1 Bauteilanordnung und Verfahren zu dessen Herstellung Component arrangement and method for its production
09/02/2010DE102006025733B4 Reduktion des thermischen Ausdehnungskoeffizienten bei metallischen Wärmerohren Reduction of the thermal expansion coefficients with metallic heat pipes
09/02/2010DE102005040494B4 Verfahren zum Erfassen der Schädigung eines Bauelementes durch einen Herstellungsschritt und integrierte Schaltungsanordnungen A method for detecting the deterioration of a component by means of a manufacturing step and integrated circuits
09/02/2010DE102004010169B4 Schaltungsanordnung und Verfahren zur Reduzierung von Übersprechen sowie Verwendung derartiger Schaltungsanordnungen Circuit arrangement and method for reducing crosstalk and use of such circuits
09/01/2010EP2224590A1 Power amplification for fragmented transceiver systems
09/01/2010EP2224493A2 Solar cell lead, method of manufacturing the same, and solar cell using the same
09/01/2010EP2224487A2 Semiconductor optoelectronic device and quad flat non-leaded optoelectronic device
09/01/2010EP2224486A2 Quad flat non-leaded chip package structure
09/01/2010EP2224485A2 Light emitting diode package
09/01/2010EP2224484A1 Semiconductor module
09/01/2010EP2224482A2 Integrated leadframe and bezel structure and device formed from same
09/01/2010EP2224481A1 Semiconductor device
09/01/2010EP2224480A1 The Improved Structure of a Radiator
09/01/2010EP2224479A2 Metal-ceramic composite substrate and method of its manufacture
09/01/2010EP2224472A1 Substrate and method for manufacturing the same
09/01/2010EP2224199A1 Heat sink with forced ventilation, particularly for high-power electronic devices
09/01/2010EP2223579A1 A device for reducing thermal stress on connection points
09/01/2010EP2223346A2 Leadframe receiver package for solar concentrator
09/01/2010EP2223334A2 Cooling body of at least one electrical component
09/01/2010EP2163145B1 Electronic module and method for producing an electronic module
09/01/2010EP1984939B1 Semiconductor device and method of manufacturing thereof
09/01/2010EP1952439B1 Semiconductor device comprising a housing containing a triggering unit
09/01/2010CN201571286U Loop type heat dissipation device
09/01/2010CN201571257U Novel IC radiating circuit board
09/01/2010CN201570985U Bridge rectifier framework
09/01/2010CN201570515U Luminous diode
09/01/2010CN201570498U Single-arm bridge type automobile rectifying diode
09/01/2010CN201570496U Direct current converter valve thyristor press-assembling structure radiator
09/01/2010CN201570495U Heating device for chip
09/01/2010CN201569205U Three-layer coldness and heat controller
09/01/2010CN201568934U Composite radiator structure of LED lamp
09/01/2010CN201568933U LED street lamp system
09/01/2010CN201568932U High heat radiation structure of LED fluorescent lamp tube with bayonets
09/01/2010CN201568849U High-power LED illuminating lamp for squares
09/01/2010CN201568762U Hollow type liquid-cooled LED strip lamp
09/01/2010CN201566509U Compact EPS controller
09/01/2010CN1965406B Captive socket actuator
09/01/2010CN1886039B Electronic device
09/01/2010CN1659716B Semiconductor device, semiconductor circuit and method for producing semiconductor device
09/01/2010CN101822132A Substrate with semiconductor element mounted thereon
09/01/2010CN101821853A Semiconductor device and manufacturing method thereof
09/01/2010CN101821848A Wireless semiconductor package for efficient heat dissipation
09/01/2010CN101821847A Composite element consisting of at least two semiconductor substrates, and production method
09/01/2010CN101821843A Bump I/O contact for semiconductor device
09/01/2010CN101821842A 半导体装置 Semiconductor device
09/01/2010CN101821838A Method for producing hydrophobilized porous film
09/01/2010CN101821431A Process for producing electronic component, and electronic component produced by the process
09/01/2010CN101821415A Metal-graphite composite material having high thermal conductivity and method for producing the same
09/01/2010CN101821312A Single-component cyanate-epoxy composite resin composition, cured product thereof and method for producing the same, and sealing material and adhesive each using the single-component cyanate-epoxy composite resin composition
09/01/2010CN101820741A Emi shield including a lossy medium
09/01/2010CN101820736A Radiating device and support thereof
09/01/2010CN101820735A Radiation device with enhanced radiation effect and related radiation system thereof
09/01/2010CN101820169A Electrostatic discharge protection circuit
09/01/2010CN101819986A Electro-optical device and electronic apparatus
09/01/2010CN101819983A Light-emitting device and manufacturing method thereof as well as image display system applying same
09/01/2010CN101819974A Groove type metal oxide semiconductor transistor
09/01/2010CN101819973A High voltage and current metal oxide semiconductor circuit structure
09/01/2010CN101819972A Configuration of gate to drain (gd) clamp and ESD protection circuit for power device breakdown protection
09/01/2010CN101819971A Thin film transistor for liquid crystal display
09/01/2010CN101819970A Welded IGBT and solderless diode-based series structure module
09/01/2010CN101819968A Light-emitting diode (LED) packaging
09/01/2010CN101819966A Light emitting devices
09/01/2010CN101819965A Semiconductor device
09/01/2010CN101819964A Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
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