Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/08/2010CN101232011B Stack type chip packaging structure and manufacturing method thereof
09/08/2010CN101211884B Chip packaging structure and method of manufacture
09/08/2010CN101208800B Integrated circuit using embedding resistors, system and method
09/08/2010CN101174635B Flash memory device and method of manufacturing the same
09/08/2010CN101154654B Semiconductor device, semiconductor integrated circuit and bump resistance measurement method
09/08/2010CN101131941B Semiconductor chip packaging process and its structure
09/08/2010CN101098137B Full complementary MOS exhaustion region condenser network aimed at low voltage application
09/08/2010CN101075618B Nonvolatile memory unit array and method for forming same
09/08/2010CN101000915B Semiconductor device and its manufacture method
09/07/2010USRE41637 Stylus visual indicator system
09/07/2010USRE41625 Semiconductor device and method of fabricating the same
09/07/2010US7791888 Electronic control apparatus
09/07/2010US7791883 Fastening heat exchanger apparatus
09/07/2010US7791514 Digital-to-analog converter having constant current cells producing even constant currents
09/07/2010US7791447 Integrated transformer
09/07/2010US7791211 Flip chip package structure and carrier thereof
09/07/2010US7791210 Semiconductor package having discrete non-active electrical components incorporated into the package
09/07/2010US7791209 ejecting an underfill resin at multiple semiconductor die edges such that vacuum suction provided at a laminate through hole located beneath a stage enables spread of underfill resin from each edge simultaneously for quicker spread and reduction of voids
09/07/2010US7791207 Pass through via technology for use during the manufacture of a semiconductor device
09/07/2010US7791206 Semiconductor device and method of manufacturing the same
09/07/2010US7791205 Interposers for semiconductor die packages with standard ball grill array footprint
09/07/2010US7791204 Semiconductor device and method of manufacturing the same
09/07/2010US7791203 Interconnects for packaged semiconductor devices and methods for manufacturing such devices
09/07/2010US7791202 Semiconductor device having oxidized metal film and manufacture method of the same
09/07/2010US7791201 Integration of dissimilar materials for advanced multifunctional devices
09/07/2010US7791200 Approach to high temperature wafer processing
09/07/2010US7791199 Packaged semiconductor chips
09/07/2010US7791198 Semiconductor device including a coupling region which includes layers of aluminum and copper alloys
09/07/2010US7791197 Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member
09/07/2010US7791196 Semiconductor device having a smaller electrostatic capacitance electrode
09/07/2010US7791195 Ball grid array (BGA) package and method thereof
09/07/2010US7791194 Composite interconnect
09/07/2010US7791193 Pad over active circuit system and method with meshed support structure
09/07/2010US7791192 Circuit for and method of implementing a capacitor in an integrated circuit
09/07/2010US7791191 Semiconductor device having multiple die redistribution layer
09/07/2010US7791190 Substrate with crystal silicon array
09/07/2010US7791189 Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
09/07/2010US7791188 Heat spreader having single layer of diamond particles and associated methods
09/07/2010US7791187 Semiconductor device
09/07/2010US7791186 Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
09/07/2010US7791185 An electrically conductive pin comprising a pin stern and a pin head attached to the pin stem; pin head has an underside surface defining a continuous curve configured to allow gases to escape from a pin-attach solder region adjacent the underside surface
09/07/2010US7791184 Image sensor packages and frame structure thereof
09/07/2010US7791183 Universal low cost MEM package
09/07/2010US7791182 Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing
09/07/2010US7791181 Device structure with preformed ring and method therefor
09/07/2010US7791180 Physical quantity sensor and lead frame used for same
09/07/2010US7791179 Integrated battery pack with lead frame connection
09/07/2010US7791178 Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same
09/07/2010US7791175 Method for stacking serially-connected integrated circuits and multi-chip device made from same
09/07/2010US7791173 Chip having side pad, method of fabricating the same and package using the same
09/07/2010US7791168 Techniques for providing decoupling capacitance
09/07/2010US7791167 Inductively coupled integrated circuit and methods for use therewith
09/07/2010US7791142 Electrostatic discharge protection diode
09/07/2010US7791131 Semiconductor device and a method of manufacturing the same
09/07/2010US7791120 Circuit device and manufacturing method thereof
09/07/2010US7791111 Semiconductor device with an opening for cutting a fuse
09/07/2010US7791087 Device for defeating reverse engineering of integrated circuits by optical means
09/07/2010US7791086 Device for defeating reverse engineering of integrated circuits by optical means
09/07/2010US7791071 Profiling solid state samples
09/07/2010US7790988 Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap
09/07/2010US7790812 crack resistance, transparency, minimal discoloration; optical semiconductor device; reacting polyester of cyclohexanedicarboxylic acid and neopentyl glycol; methylhexahydrophthalic anhydride; polyepoxide; 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate
09/07/2010US7790616 Encapsulated silicidation for improved SiC processing and device yield
09/07/2010US7790609 Method of forming metal line in semiconductor device
09/07/2010US7790603 Integrated circuit insulators and related methods
09/07/2010US7790597 Solder cap application process on copper bump using solder powder film
09/07/2010US7790594 Electronic part and method of producing the same
09/07/2010US7790579 Semiconductor storage device, semiconductor device, and manufacturing method therefor
09/07/2010US7790513 Substrate based unmolded package
09/07/2010US7790511 Method for direct heat sink attachment
09/07/2010US7790506 Method of manufacturing semiconductor devices encapsulated in chip size packages
09/07/2010US7790501 Semiconductor chip passivation structures and methods of making the same
09/07/2010US7790500 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
09/07/2010US7790048 Treatment of the working layer of a multilayer structure
09/07/2010US7788976 Semiconductor acceleration sensor device and method for manufacturing the same
09/07/2010CA2586994C Heat sink and cooling unit using the same
09/02/2010WO2010099080A2 Systems and methods for improved photovoltaic module structure and encapsulation
09/02/2010WO2010098943A2 Antifuse
09/02/2010WO2010098771A1 Micro device packaging
09/02/2010WO2010098500A1 Semiconductor device and method for producing the same
09/02/2010WO2010098393A1 Radio frequency module
09/02/2010WO2010098156A1 Frame package type light emitting device and method of manufacturing the same
09/02/2010WO2010098151A1 Semiconductor device and method for manufacturing same
09/02/2010WO2010098066A1 Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition
09/02/2010WO2010098028A1 Heat generation element cooling structure, heat generation element cooling device, electronic device provided with cooling device, and cooling device producing method
09/02/2010WO2010097324A1 Power amplification for fragmented transceiver systems
09/02/2010WO2010097191A1 A metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom
09/02/2010WO2010059879A3 Heat exchanger apparatus and methods of manufacturing cross reference
09/02/2010US20100223021 Analyte Monitoring Device and Methods of Use
09/02/2010US20100222660 Analyte Monitoring Device and Methods of Use
09/02/2010US20100222659 Analyte Monitoring Device and Methods of Use
09/02/2010US20100221892 Semiconductor device and manufacturing method thereof
09/02/2010US20100221872 Reversible leadless package and methods of making and using same
09/02/2010US20100221871 Multi-Surface IC Packaging Structures and Methods for their Manufacture
09/02/2010US20100220274 Porous silica precursor composition and method for preparing the precursor composition, porous silica film and method for preparing the porous silica film, semiconductor element, apparatus for displaying an image, as well as liquid crystal display
09/02/2010US20100219538 Semiconductor device and method of manufacturing the same
09/02/2010US20100219537 Semiconductor device
09/02/2010US20100219536 Connecting terminal, semiconductor package, wiring board, connector, and microcontactor
09/02/2010US20100219535 Method for producing a semiconductor component
09/02/2010US20100219534 Microstructure device including a metallization structure with self-aligned air gaps and refilled air gap exclusion zones
09/02/2010US20100219533 Multilayered wiring structure, and method for manufacturing multilayered wiring
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