Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/08/2010EP2225776A1 Backplane structures for electronic devices
09/08/2010EP2225775A1 Power circuit
09/08/2010EP1844089B1 Amide-substituted silicones and methods for their preparation and use
09/08/2010CN201577257U Heat dissipating structure provided with loop heat pipe cavity
09/08/2010CN201577255U Radiating component and electronic substrate provided with same
09/08/2010CN201576685U Heat dissipation type paster diode
09/08/2010CN201576682U High-voltage high-power operational amplifier
09/08/2010CN201576680U Electrode support extended heat radiation type array LED diode
09/08/2010CN201576679U Flash memory chip stacking structure
09/08/2010CN201576678U Surface coarsened LED
09/08/2010CN201576677U Semiconductor device having down-lead frame with fastening reinforced holes
09/08/2010CN201576676U Lead frame
09/08/2010CN201576675U Wafer contact point structure
09/08/2010CN201576674U Chip layout structure
09/08/2010CN201576673U Heat pipe gapless combined structure
09/08/2010CN201576672U High heat-dissipating type substrate with single diamond grain layer
09/08/2010CN201576671U Case packaging device for power semiconductor
09/08/2010CN201576670U Semiconductor package structure
09/08/2010CN201576412U Led display screen
09/08/2010CN201575405U Liquid-cooled LED lamp
09/08/2010CN1996631B Heat radiation system
09/08/2010CN1992291B Thin film transistor substrate and fabricating method thereof
09/08/2010CN1985370B Electronic device comprising an ESD device
09/08/2010CN1592568B High performance cooling device with vapor chamber
09/08/2010CN101828435A Bump structure with multiple layers and method of manufacture
09/08/2010CN101828275A LED package substrate and LED package using the same
09/08/2010CN101828274A Nickel tin bonding system with barrier layer for semiconductor wafers and devices
09/08/2010CN101828261A Magnetic detection of back-side layer
09/08/2010CN101828249A Method and system for forming an air gap structure
09/08/2010CN101828212A Display device and cu alloy film for use in the display device
09/08/2010CN101827782A Connecting and bonding adjacent layers with nanostructures
09/08/2010CN101827713A Method for marking valuable articles
09/08/2010CN101827513A Radiation device with wind scooper
09/08/2010CN101827509A Phase-change energy accumulation and temperature control device of sealing equipment
09/08/2010CN101826716A Low voltage transient voltage suppresser with potential barrier Zener diode
09/08/2010CN101826561A Method of forming stacked capacitor dram cells
09/08/2010CN101826547A Active matrix organic LED pixel structure and manufacturing method thereof
09/08/2010CN101826538A Solid-state image pickup element, a method of manufacturing the same, and electronic apparatus using the same
09/08/2010CN101826535A Monolithic integrated chip for micro-electro-mechanical device and integrated circuit device
09/08/2010CN101826534A Semiconductor device and method for manufacturing the same
09/08/2010CN101826533A Switching component structure of active array-type display
09/08/2010CN101826521A 半导体装置 Semiconductor device
09/08/2010CN101826520A Semiconductor device
09/08/2010CN101826517A Light emitting device
09/08/2010CN101826514A Compact type electric inductance power electronic device encapsulation
09/08/2010CN101826513A Resistor string bleeding device with embedded capacitor
09/08/2010CN101826512A 半导体器件 Semiconductor devices
09/08/2010CN101826511A 静电保护电路 Electrostatic protection circuit
09/08/2010CN101826510A Tcp-type semiconductor device
09/08/2010CN101826509A Receivable test structure of wafer
09/08/2010CN101826508A Semiconductor device
09/08/2010CN101826507A Electrical fuse and relevant control circuit thereof
09/08/2010CN101826506A Packaging substrate and chip packaging construct
09/08/2010CN101826505A Packaging substrate and chip packaging structure
09/08/2010CN101826504A Substrate structure and manufacture method thereof
09/08/2010CN101826503A Sinking pad and multi-bump pad lead frame structure and method for carving before plating
09/08/2010CN101826502A Island-exposed and submerged island-exposed type lead frame structure and method for sequentially etching and plating
09/08/2010CN101826501A Leadless integrated circuit package having high density contacts
09/08/2010CN101826500A Light emitting diode conduct support assembly, manufacturing method thereof and light emitting diode
09/08/2010CN101826499A Quad flat non-leaded package
09/08/2010CN101826498A Display device, frame module and method for manufacturing frame module
09/08/2010CN101826497A Chip and transmitter for wireless communication system
09/08/2010CN101826496A Printed wiring board and manufacturing method thereof
09/08/2010CN101826495A Window-shaped semiconductor encapsulation structure
09/08/2010CN101826494A Heat dissipation device based on carbon nanotube arrays and low temperature co-fired ceramics and preparation method
09/08/2010CN101826493A Heat radiating package substrate and fabricating method the same
09/08/2010CN101826492A Chip-suspension-type packaging heat dissipation improved structure of semiconductor
09/08/2010CN101826491A Semiconductor packaging structure and manufacturing method thereof
09/08/2010CN101826490A Packaging structure and test method of semiconductor elements
09/08/2010CN101826489A Stress barrier structures for semiconductor chips
09/08/2010CN101826482A Wafer holding mechanism, wafer holding system and wafer matched with wafer carrier
09/08/2010CN101826473A Forming method of penetrating electrode and semiconductor substrate
09/08/2010CN101826470A Method for packaging high-radiation spherical array by using flip chip bonding
09/08/2010CN101826469A Coreless encapsulation substrate and manufacturing method thereof
09/08/2010CN101825818A Wire structure and manufacturing method thereof
09/08/2010CN101825682A Separation testing method of pixel of electric testing point and testing device thereof
09/08/2010CN101825412A Heat radiator with composite structure and preparation method thereof
09/08/2010CN101825268A Heat radiating module of light emitting body
09/08/2010CN101825235A Light-emitting diode lamp and light engine thereof
09/08/2010CN101823341A Method for fusion bonding molded article of liquid crystalline polymer and glass substrate to each other and composite article obtained by the method
09/08/2010CN101823105A Upright and close arrangement method and application device thereof for fins of cylindrical radiator
09/08/2010CN101562187B Silicon-on-insulator (SOI) circuit ESD global protecting structure
09/08/2010CN101529584B Semiconductor element mounting structure and semiconductor element mounting method
09/08/2010CN101499459B Packaging structure
09/08/2010CN101483162B Semiconductor apparatus and method for manufacturing the same
09/08/2010CN101477971B Semiconductor chip and its production method
09/08/2010CN101419953B Junction construction used for an encapsulation device
09/08/2010CN101414610B Display unit and method of manufacturing the same
09/08/2010CN101414589B IC structure and method for forming the same
09/08/2010CN101410972B Low ohmic through substrate interconnection for semiconductor carriers
09/08/2010CN101383343B Wireless communication device
09/08/2010CN101378046B Structure, method and substrate for packaging touch-slide type thin type fingerprint identifier
09/08/2010CN101325184B Semiconductor device and manufacturing method thereof
09/08/2010CN101320747B Charge transmission device, solid pick-up device and electronic information equipment
09/08/2010CN101317267B System-in-package (SIP) device based on fine-pitch routing in a lead frame
09/08/2010CN101276874B Semiconductor light-emitting device
09/08/2010CN101267011B Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device
09/08/2010CN101252821B Heat sinking method, system and device
09/08/2010CN101246950B Memory element with reduced-current phase change element
09/08/2010CN101245227B Epoxy conductive silver glue for LED and method for manufacturing same
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