Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2014
10/02/2014US20140291844 Semiconductor device and manufacturing method thereof
10/02/2014US20140291843 Hybrid solder and filled paste in microelectronic packaging
10/02/2014US20140291842 Enhanced flip-chip die architecture
10/02/2014US20140291841 Semiconductor device, method for manufacturing same, and electronic component
10/02/2014US20140291840 Stacked semiconductor package
10/02/2014US20140291839 Solder Joint Flip Chip Interconnection
10/02/2014US20140291838 Design Scheme for Connector Site Spacing and Resulting Structures
10/02/2014US20140291837 Embedded package and method for manufacturing the same
10/02/2014US20140291836 Semiconductor device
10/02/2014US20140291835 IC Package with Integrated Waveguide Launcher
10/02/2014US20140291834 Semiconductor devices and packages including conductive underfill material and related methods
10/02/2014US20140291833 Semiconductor device
10/02/2014US20140291832 Integrated cooling modules of power semiconductor device
10/02/2014US20140291831 Semiconductor device and manufacturing method for semiconductor device
10/02/2014US20140291828 Semiconductor device and method of manufacturing the same
10/02/2014US20140291827 Lead Frame and Semiconductor Device
10/02/2014US20140291826 Semiconductor device manufacturing method and semiconductor device
10/02/2014US20140291825 Semiconductor device and semiconductor module
10/02/2014US20140291824 Leadframe, Semiconductor Package Including a Leadframe and Method for Producing a Leadframe
10/02/2014US20140291823 Chip package and method of manufacturing the same
10/02/2014US20140291822 Integrated circuit package
10/02/2014US20140291821 Semiconductor package having grounding member and method of manufacturing the same
10/02/2014US20140291820 Semiconductor Device and Method of Forming Shielding Layer Over Active Surface of Semiconductor Die
10/02/2014US20140291819 Hybrid carbon-metal interconnect structures
10/02/2014US20140291818 Integrated Circuit Device Facilitating Package on Package Connections
10/02/2014US20140291817 Semiconductor device including porous low-k dielectric layer and fabrication method
10/02/2014US20140291814 Insulating substrate, method of manufacturing the same, and semiconductor device
10/02/2014US20140291813 Laser machining method and chip
10/02/2014US20140291802 Semiconductor structures with metal lines
10/02/2014US20140291801 Anti-fuse structure and programming method thereof
10/02/2014US20140291800 Semiconductor device
10/02/2014US20140291797 Semiconductor Device
10/02/2014US20140291796 Imaging device, imaging apparatus, production apparatus and method, and semiconductor device
10/02/2014US20140291795 Cable connecting structure and cable connecting method
10/02/2014US20140291701 Semiconductor device
10/02/2014US20140291696 Power electronics modules with solder layers having reduced thermal stress
10/02/2014US20140291680 Silicon member and method of producing the same
10/02/2014US20140291678 Semiconductor sensor reliability operation
10/02/2014US20140291004 Carrier Tape for Tab-Package and Manufacturing Method Thereof
10/02/2014US20140290929 Heat pipe heat sink with heating unit
10/02/2014DE112013000494T5 Bumpless Build-Up-Layer-Paket einschliesslich eines integrierten Wärmeverteilers Bumpless build-up layer package including an integrated heat spreader
10/02/2014DE112013000362T5 Elektrisch programmierbare back-end-sicherung Electrically programmable back-end security
10/02/2014DE112012005486T5 Wärmeleitende Harzzusammensetzung Thermally conductive resin composition
10/02/2014DE10238523B4 Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung An encapsulated electronic component and methods for making
10/02/2014DE102014202651A1 Halbleitervorrichtung und Halbleitermodul Semiconductor device and semiconductor module
10/02/2014DE102014104497A1 Halbleitergehäuse mit mehreren Ebenen Semiconductor package with multiple levels
10/02/2014DE102014104399A1 Leadframe, Halbleiterchipgehäuse umfassend einen Leadframe und ein Verfahren zur Herstellung eines Leadframe Lead frame, the semiconductor chip package comprising a lead frame and a method of manufacturing a lead frame
10/02/2014DE102014104201A1 Eine Siliziumkarbidvorrichtung und ein Verfahren zum Ausbilden einer Siliziumkarbidvorrichtung A Siliziumkarbidvorrichtung and a method for forming a Siliziumkarbidvorrichtung
10/02/2014DE102014104177A1 Integrierte kühlmodule eines leistungshalbleiterbauelements Integrated cooling module of a power semiconductor device
10/02/2014DE102013205702A1 Kühlvorrichtung mit Biegewandler und Elektronikmodul Cooler with bending transducer and electronic module
10/02/2014DE102013205626A1 Biegewandler mit piezoelektrischem Biegeelement, Kühlvorrichtung und Elektronikmodul Bending actuator with piezoelectric bending element, cooler and electronics module
10/02/2014DE102013114890A1 Transparenter elektrischer Leiter und Vorrichtung enthaltend denselben Transparent electrical conductor and device containing same
10/02/2014DE102013108106A1 Verpackungsmechanismen für Chips mit unterschiedlich großen Verbindern Packaging mechanisms for chips with different sized connectors
10/02/2014DE102013102667A1 Anzeigevorrichtung Display device
10/02/2014DE102004024659B4 Halbleiterbauteil Semiconductor device
10/01/2014EP2784837A1 Piezoelectric/electrostrictive element and wiring substrate
10/01/2014EP2784815A1 Semiconductor device
10/01/2014EP2784814A2 Method apparatus and material for radio frequency passives and antennas
10/01/2014EP2784813A2 Support for capillary self-assembly with horizontal stabilisation, manufacturing method and use
10/01/2014EP2784812A2 Heat pipe sink for high power density
10/01/2014EP2784811A2 Heat pipe sink with heating unit
10/01/2014EP2784810A1 Chip packaging structure and chip packaging method
10/01/2014EP2784809A2 Semiconductor power module and method for manufacturing the same
10/01/2014EP2784808A1 Resin for electrical components, semiconductor device, and wiring board
10/01/2014EP2784807A1 Circuit board and method for producing same
10/01/2014EP2784141A2 Anisotropic conductive film and method of making conductive connection
10/01/2014EP2784127A1 Curable composition
10/01/2014EP2784126A1 Curable composition
10/01/2014EP2784123A1 Curable composition
10/01/2014EP2784105A1 Method for producing organopolysiloxane
10/01/2014EP2784104A1 Organopolysiloxane
10/01/2014EP2783557A1 Hold down for retaining a heat sink
10/01/2014EP2783394A1 A hvdc thyristor valve assembly
10/01/2014EP2783393A2 Protective layer for protecting tsv tips during thermo-compressive bonding
10/01/2014EP2783391A1 Method for making contact with a semiconductor and contact arrangement for a semiconductor
10/01/2014EP2783229A1 Magnetic field sensor device having non- conductive die paddle and production method
09/2014
09/30/2014USRE45165 Structure for a multiple-gate FET device and a method for its fabrication
09/30/2014US8850370 Method of manufacturing semiconductor circuit structure
09/30/2014US8850176 Electronic device and speed-up booting module and method thereof using heat pipes
09/30/2014US8849362 Communication module
09/30/2014US8848475 Fuse circuit, fuse array, semiconductor memory device and method of manufacturing semiconductor device
09/30/2014US8848443 Semiconductor memory device and repair method thereof
09/30/2014US8848417 Integrated circuit with a self-programmed identification key
09/30/2014US8848416 Semiconductor storage device with wiring that conserves space
09/30/2014US8848390 Capacitive proximity communication using tuned-inductor
09/30/2014US8848381 Power semiconductor module and power semiconductor module system
09/30/2014US8848380 Bumpless build-up layer package warpage reduction
09/30/2014US8848375 System and method for reduced thermal resistance between a power electronics printed circuit board and a base plate
09/30/2014US8848374 Method and structure for dissipating heat away from a resistor having neighboring devices and interconnects
09/30/2014US8848373 Heat sink for an electronic or electrical component
09/30/2014US8848372 Nanotube-based fluid interface material and approach
09/30/2014US8848368 Computer with at least one faraday cage and internal flexibility sipes
09/30/2014US8848075 Semiconductor device, manufacturing method thereof, and electronic apparatus
09/30/2014US8847672 Switching device with resistive divider
09/30/2014US8847416 Multi-layer chip overlay target and measurement
09/30/2014US8847415 Liquid compression molding encapsulants
09/30/2014US8847414 Resin for transparent encapsulation material, and associated encapsulation material and electronic device
09/30/2014US8847413 Integrated circuit package system with leads having multiple sides exposed
09/30/2014US8847412 Microelectronic assembly with thermally and electrically conductive underfill
09/30/2014US8847411 Semiconductor device and method of manufacturing the same
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