Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2014
09/30/2014US8847410 Semiconductor chip with bonding wire and method for making the same
09/30/2014US8847409 Compliant micro-socket hybridization method
09/30/2014US8847408 III-nitride transistor stacked with FET in a package
09/30/2014US8847406 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
09/30/2014US8847405 Integrated circuits including air gaps around interconnect structures, and fabrication methods thereof
09/30/2014US8847404 Three-dimensional semiconductor device comprising an inter-die connection on the basis of functional molecules
09/30/2014US8847403 Semiconductor device including two groove-shaped patterns
09/30/2014US8847402 Semiconductor device
09/30/2014US8847401 Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure
09/30/2014US8847400 Semiconductor device, method for manufacturing the same, and data processing device
09/30/2014US8847399 Semiconductor device and method of fabricating the same
09/30/2014US8847397 High work function, manufacturable top electrode
09/30/2014US8847396 Semiconductor integrated circuit and fabricating the same
09/30/2014US8847395 Microelectronic device having metal interconnection levels connected by programmable vias
09/30/2014US8847394 Laminated structure, multilayer circuit board, active matrix substrate, and electronic display
09/30/2014US8847393 Vias between conductive layers to improve reliability
09/30/2014US8847392 Panel-type input device and electronic apparatus having panel-type input device
09/30/2014US8847391 Non-circular under bump metallization (UBM) structure, orientation of non-circular UBM structure and trace orientation to inhibit peeling and/or cracking
09/30/2014US8847390 Lead-free solder bump bonding structure
09/30/2014US8847389 Method and apparatus for a conductive bump structure
09/30/2014US8847388 Bump with protection structure
09/30/2014US8847387 Robust joint structure for flip-chip bonding
09/30/2014US8847386 Electrical contact for a cadmium tellurium component
09/30/2014US8847385 Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package
09/30/2014US8847384 Power modules and power module arrays having a modular design
09/30/2014US8847383 Integrated circuit package strip with stiffener
09/30/2014US8847382 Thermoelectric cooler system, method and device
09/30/2014US8847381 Semiconductor element housing package and semiconductor device equipped with the same
09/30/2014US8847380 Staged via formation from both sides of chip
09/30/2014US8847379 Package manufacturing method and semiconductor device
09/30/2014US8847378 Semiconductor package
09/30/2014US8847377 Stacked wafer level package having a reduced size
09/30/2014US8847376 Microelectronic elements with post-assembly planarization
09/30/2014US8847375 Microelectromechanical systems embedded in a substrate
09/30/2014US8847374 Power semiconductor module and manufacturing method thereof
09/30/2014US8847373 Exothermic activation for high vacuum packaging
09/30/2014US8847372 Exposed die overmolded flip chip package and fabrication method
09/30/2014US8847371 Electronic component module including a lead frame and an insulating resin having a thickness less than or equal to a thickness of the lead frame and method for producing same
09/30/2014US8847370 Exposed die package that helps protect the exposed die from damage
09/30/2014US8847369 Packaging structures and methods for semiconductor devices
09/30/2014US8847368 Flip chip assembly process for ultra thin substrate and package on package assembly
09/30/2014US8847367 Organic electroluminescent device
09/30/2014US8847365 Inductors and methods for integrated circuits
09/30/2014US8847364 Removing conductive material to form conductive features in a substrate
09/30/2014US8847360 Systems and methods for enabling ESD protection on 3-D stacked devices
09/30/2014US8847354 Metal-insulator-metal capacitors with high capacitance density
09/30/2014US8847350 Metal-via fuse
09/30/2014US8847331 Semiconductor chip including region having cross-coupled transistor configuration with offset electrical connection areas on gate electrode forming conductive structures and at least two different inner extension distances of gate electrode forming conductive structures
09/30/2014US8847328 Module and assembly with dual DC-links for three-level NPC applications
09/30/2014US8847320 Decoupling capacitor and layout for the capacitor
09/30/2014US8847319 Dummy structure for multiple gate dielectric interface and methods
09/30/2014US8847318 ESD protection circuit
09/30/2014US8847317 Isolated epitaxial modulation device
09/30/2014US8847300 Semiconductor device and method for fabricating the same
09/30/2014US8847280 Insulated gate field effect transistors
09/30/2014US8847275 Electronic device for protection against electrostatic discharges, with a concentric structure
09/30/2014US8847261 Light-emitting devices having engineered phosphor elements
09/30/2014US8847247 Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof
09/30/2014US8847229 Flexible semiconductor device, method for manufacturing the same, image display device using the same and method for manufacturing the image display device
09/30/2014US8847222 Semiconductor device test structures and methods
09/30/2014US8847221 Stacked semiconductor device and method of testing the same
09/30/2014US8847146 Image sensor package structure with casing including a vent without sealing and in communication with package material
09/30/2014US8847110 Laser processing of conductive links
09/30/2014US8847080 Laminated wiring board
09/30/2014US8846828 Curable organopolysiloxane composition and semiconductor device
09/30/2014US8846548 Post-passivation interconnect structure and methods for forming the same
09/30/2014US8846526 Through-hole substrate and method of producing the same
09/30/2014US8846524 Plating process
09/30/2014US8846521 Method for manufacturing an electronic component package and electronic component package
09/30/2014US8846520 Semiconductor device and method for manufacturing semiconductor device
09/30/2014US8846494 Alignment marks and alignment methods for aligning backside components to frontside components in integrated circuits
09/30/2014US8846477 Methods of forming 3-D semiconductor devices using a replacement gate technique and a novel 3-D device
09/30/2014US8846473 Low-resistance electrode design
09/30/2014US8846456 Method and apparatus for manufacturing an electronic module, and electronic module
09/30/2014US8846455 Semiconductor device and method for manufacturing the same
09/30/2014US8846454 Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
09/30/2014US8846453 Semiconductor package structure and method of manufacturing the same
09/30/2014US8846450 Room temperature metal direct bonding
09/30/2014US8846449 Three-dimensional integrated circuit, processor, semiconductor chip, and manufacturing method of three-dimensional integrated circuit
09/30/2014US8846447 Thin wafer handling and known good die test method
09/30/2014US8846446 Semiconductor package having buried post in encapsulant and method of manufacturing the same
09/30/2014US8846445 Inverse chip connector
09/30/2014US8846444 Semiconductor package and method for manufacturing the same
09/30/2014US8846163 Method for removing oxides
09/30/2014US8845942 Compact production apparatus and method for producing compact
09/30/2014US8845909 Process of fabricating heat dissipation substrate
09/30/2014US8845849 Anisotropic conductive adhesive
09/30/2014US8845835 Carrier structure and manufacturing method thereof
09/30/2014US8844826 Integrated circuit transponder, method of producing an integrated circuit and method of producing a transponder
09/30/2014US8844793 Reducing formation of oxide on solder
09/30/2014US8844609 Cooling manifold
09/30/2014US8844134 Method of manufacturing a heat exchanger
09/30/2014US8844125 Method of making an electronic device having a liquid crystal polymer solder mask and related devices
09/25/2014WO2014153513A1 Diene/dienophile couples and thermosetting resin compositions having reworkability
09/25/2014WO2014153405A1 Semiconductor device having reinforced wire bond to metal terminal
09/25/2014WO2014152781A1 Low cost interposer and method of fabrication
09/25/2014WO2014152756A1 Low cte interposer without tsv structure and method
09/25/2014WO2014152354A1 Heat transfer system and method incorporating tapered flow field
09/25/2014WO2014151993A1 Multi-layer core organic package substrate
09/25/2014WO2014150918A1 In-package fly-by signaling
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