Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/14/2010US7795126 Electrical die contact structure and fabrication method
09/14/2010US7795105 Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement
09/14/2010US7795087 Ultra-violet protected tamper resistant embedded EEPROM
09/14/2010US7795072 Structure and method of high performance two layer ball grid array substrate
09/14/2010US7794623 Semiconductor die molded from a bis(epoxyalkyl) derivative of an aromatic initiator, e.g., 1,4-cyclohexylene bis(p-glycidyloxy)benzoate of or 4,4'-bis(4-(glycidyloxy)butoxyphenyl)stilbene; melting point of less than 140 degrees C.; are liquid crystalline at greater than 150 degrees C.
09/14/2010US7793818 Semiconductor device, manufacturing method and apparatus for the same
09/14/2010US7793412 Component-embedded board fabrication method
09/14/2010CA2666120C One-time-programmable logic bit with multiple logic elements
09/10/2010WO2010102229A1 Wire-bonded integrated circuit package without package substrate and including metal traces linking to external connection pads routed under integrated circuit die.
09/10/2010WO2010102151A2 Chip-scale packaging with protective heat spreader
09/10/2010WO2010102132A1 Magnetic film enhanced inductor
09/10/2010WO2010101858A2 Hermetic packaging of integrated circuit components
09/10/2010WO2010101763A1 Hermetic seal for an electronic device comprising an active organic material
09/10/2010WO2010101542A1 Encapsulation methods for organic electrical devices
09/10/2010WO2010101167A1 Semiconductor device and method for manufacturing same
09/10/2010WO2010101163A1 Substrate with built-in functional element, and electronic device using the substrate
09/10/2010WO2010100893A1 Electrically conductive paste composition and electrically conductive film formed by using the same
09/10/2010WO2010100864A1 Method for manufacturing electronic circuit module
09/10/2010WO2010100849A1 Semiconductor integrated circuit device
09/10/2010WO2010100845A1 Semiconductor chip and semiconductor device
09/10/2010WO2010100705A1 Semiconductor device and method for manufacturing same
09/10/2010WO2010100703A1 Semiconductor device and method for manufacturing same
09/10/2010WO2010100682A1 Semiconductor integrated circuit device
09/10/2010WO2010099733A1 Hollow liquid cooling led lamp
09/10/2010WO2010099622A1 Passive resistive-heater addressing network
09/10/2010WO2010074510A3 Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof
09/10/2010WO2010059724A3 Capacitor die design for small form factors
09/09/2010US20100226195 Integrated circuit self aligned 3d memory array and manufacturing method
09/09/2010US20100226108 Printed circuit board and method of manufacturing printed circuit board
09/09/2010US20100225364 Stacked semiconductor devices and signal distribution methods thereof
09/09/2010US20100225011 System and Method for Integrated Circuit Fabrication
09/09/2010US20100225010 Composition for thermosetting silicone resin
09/09/2010US20100225009 Integrated circuit assemblies with alignment features and devices and methods related thereto
09/09/2010US20100225008 Wire bond interconnection
09/09/2010US20100225007 Integrated circuit packaging system with stacked die and method of manufacture thereof
09/09/2010US20100225006 Chips having rear contacts connected by through vias to front contacts
09/09/2010US20100225005 Semiconductor device
09/09/2010US20100225004 Semiconductor apparatus and method of manufacturing semiconductor apparatus
09/09/2010US20100225003 Method for manufacturing a semiconductor device and semiconductor device obtainable with such a method
09/09/2010US20100225002 Three-Dimensional System-in-Package Architecture
09/09/2010US20100225001 Manufacturing method of semiconductor device, semiconductor device, and electronic device
09/09/2010US20100225000 Semiconductor device and method of manufacturing semiconductor device
09/09/2010US20100224999 Method for Producing Metallic Interconnect Lines
09/09/2010US20100224998 Integrated Circuit with Ribtan Interconnects
09/09/2010US20100224997 Semiconductor device
09/09/2010US20100224996 Methods of manufacturing copper interconnect systems
09/09/2010US20100224995 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
09/09/2010US20100224994 Low Temperature Metal to Silicon Diffusion and Silicide Wafer Bonding
09/09/2010US20100224993 Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
09/09/2010US20100224992 System and method for stacked die embedded chip build-up
09/09/2010US20100224991 Integrated circuit heat spreader stacking system
09/09/2010US20100224990 Semiconductor package having an internal cooling system
09/09/2010US20100224989 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
09/09/2010US20100224988 Semiconductor package substrate, semiconductor package using the substrate, and method of manufacturing semiconductor package substrate
09/09/2010US20100224987 Stress buffering package for a semiconductor component
09/09/2010US20100224986 Mounted body and method for manufacturing the same
09/09/2010US20100224985 Chip-Scale Packaging with Protective Heat Spreader
09/09/2010US20100224984 Semiconductor device and stacked semiconductor device in which circuit board and semiconductor chip are connected by leads
09/09/2010US20100224983 Semiconductor package structure and manufacturing method thereof
09/09/2010US20100224982 Lead and lead frame for power package
09/09/2010US20100224981 Routable array metal integrated circuit package
09/09/2010US20100224980 Hermetic packaging of integrated circuit components
09/09/2010US20100224979 Stacked integrated circuit package system and method for manufacturing thereof
09/09/2010US20100224978 Integrated circuit packaging system with flex tape and method of manufacture thereof
09/09/2010US20100224977 Semiconductor device and method for fabricating the same
09/09/2010US20100224976 Method for embedding silicon die into a stacked package
09/09/2010US20100224975 Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof
09/09/2010US20100224974 Integrated circuit packaging system with patterned substrate and method of manufacture thereof
09/09/2010US20100224973 Semiconductor memory device and method of fabricating the same
09/09/2010US20100224972 Leadless integrated circuit package having standoff contacts and die attach pad
09/09/2010US20100224971 Leadless integrated circuit package having high density contacts
09/09/2010US20100224970 Leadless integrated circuit package having standoff contacts and die attach pad
09/09/2010US20100224969 Electronic device and method of packaging an electronic device
09/09/2010US20100224966 Stress Barrier Structures for Semiconductor Chips
09/09/2010US20100224965 Through-silicon via structure and method for making the same
09/09/2010US20100224959 Semiconductor Chip, Transponder and Method of Manufacturing a Transponder
09/09/2010US20100224958 Rf-ic packaging method and circuits obtained thereby
09/09/2010US20100224956 E-fuse structure of semiconductor device
09/09/2010US20100224955 Fuses of semiconductor device and method of forming the same
09/09/2010US20100224951 Solid-state imaging device, method for producing the same, and electronic apparatus
09/09/2010US20100224948 Solid-state imaging element, method for fabricating the same, and solid-state imaging device
09/09/2010US20100224876 Two-Sided Semiconductor Structure
09/09/2010US20100224875 Substrate with test circuit
09/09/2010US20100224874 TCP-type semiconductor device
09/09/2010US20100224501 Plating methods for low aspect ratio cavities
09/09/2010DE202010009536U1 Gehaustes zylinderförmiges Leistungshalbleiterbauelement und Druckkontaktanordnung hiermit Gehaustes cylindrical power semiconductor component and pressure contact assembly hereby
09/09/2010DE102010000402A1 Halbleiteranordnung Semiconductor device
09/09/2010DE102009044641A1 Einrichtung mit einem Halbleiterchip und Metallfolie Device having a semiconductor chip and metal foil
09/09/2010DE102009012255A1 Schaltungsanordnung Circuitry
09/09/2010DE102009010816A1 Verfahren zur Herstellung eines Halbleiter-Bauelements A process for producing a semiconductor device
09/09/2010DE102009010642A1 Module for lighting applications, particularly light emitting diode driver module, for video projectors and projection device, has heat sink and electrically insulating film attached to heat sink
09/09/2010DE102007050405B4 Elektrische Leistungskomponente, insbesondere Leistungshalbleiter-Modul, mit einer Kühlvorrichtung und Verfahren zum flächigen und wärmeleitenden Anbinden einer Kühlvorrichtung an eine elektrische Leistungskomponente Electric power component, in particular a power semiconductor module with a cooling device and method for two-dimensional and heat conductive bonding of a cooling device of an electric power component
09/09/2010DE102007001191B4 Halbleitervorrichtung mit einem Widerstand zum Abgleichen der Stromverteilung A semiconductor device with a resistor for adjusting the current distribution
09/09/2010DE102005056892B4 Elektronikmodul für eine Systemplatine mit Durchgangslöchern und Verfahren zur Herstellung und Kühlung eines derartigen Elektronikmoduls Electronic module for a system board with through holes and methods for producing and cooling of such electronic module
09/08/2010EP2227078A1 Clamp component for pressing high performance components to a cooling surface
09/08/2010EP2226862A2 Heat dissipation module for a light emitting diode device and LED device having the same
09/08/2010EP2226842A1 Thermal conduction structure for heat generating components
09/08/2010EP2226841A1 Interposer and manufacturing method of the interposer
09/08/2010EP2226819A1 Plane coil, and non-contact power transmission device using the same
09/08/2010EP2226361A1 Composition for thermosetting silicone resin
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