Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/15/2010CN101834150A High-heat-dispersion spherical array encapsulation method
09/15/2010CN101834148A Semiconductor apparatus and method for manufacturing same
09/15/2010CN101834146A Electronic element package and formation method thereof
09/15/2010CN101834145A Method for manufacturing novel integrated circuit semiconductor apparatus and finished product thereof
09/15/2010CN101834144A Power module insulating method and power module assembly
09/15/2010CN101834143A Method for manufacturing internal lead of integrated circuit with palladium-copper wires
09/15/2010CN101834121A Method for producing resist pattern
09/15/2010CN101834115A Method of manufacturing solid-state image pickup device and solid-state image pickup device
09/15/2010CN101833915A Display device, method for driving the same, and electronic device using the display device and the method
09/15/2010CN101833204A Array substrate as well as manufacturing method and liquid crystal display panel thereof
09/15/2010CN101832528A Heat radiating module for light-emitting device and LED device
09/15/2010CN101831248A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
09/15/2010CN101831142A Resin composition, method of its composition, and cured formulation
09/15/2010CN101831137A Epoxy resin composition for packaging semiconductors
09/15/2010CN101562167B Device for solving coplanarity of large-scale integrated circuit lead frames
09/15/2010CN101431067B Packaging structure for multi-chip stack
09/15/2010CN101431064B 半导体器件 Semiconductor devices
09/15/2010CN101425481B Pixel construction and manufacturing method thereof
09/15/2010CN101421576B Cooling apparatus and power converter
09/15/2010CN101419952B Wafer stage chip encapsulation method and encapsulation construction
09/15/2010CN101414597B Member for mounting semiconductor element, semiconductor device, and imaging equipment
09/15/2010CN101404271B Audio power amplifier package
09/15/2010CN101363603B LED lamp group
09/15/2010CN101335203B Layered structure and its manufacturing method
09/15/2010CN101315921B Chip stack packaging structure and method of producing the same
09/15/2010CN101310379B 半导体器件 Semiconductor devices
09/15/2010CN101299441B Thin-film transistor, thin-film transistor array substrate, display panel and optoelectronic device
09/15/2010CN101271883B Production method of circuit substrates and inductor wire
09/15/2010CN101271860B Self-aligning contact window and manufacturing method thereof
09/15/2010CN101257007B Semiconductor device having time sequence structure
09/15/2010CN101256996B Semiconductor device and manufacturing method of the semiconductor device
09/15/2010CN101252822B EHD intensification minitype heat radiating device
09/15/2010CN101226888B Heat sinking type chip packaging technology and constitution
09/15/2010CN101184385B System cooling method and apparatus
09/15/2010CN101071652B Heat exchanger, light source apparatus, and projector
09/15/2010CN101026946B Loop heat-conducting device
09/15/2010CN101026184B Organic electroluminescent display device
09/14/2010USRE41670 Sram cell fabrication with interlevel Dielectric planarization
09/14/2010USRE41669 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
09/14/2010USRE41668 Seal ring structure for radio frequency integrated circuits
09/14/2010US7796845 Circuit board and method for manufacturing the same
09/14/2010US7796759 Diversification of a single integrated circuit identifier
09/14/2010US7796399 Thin multi-chip flex module
09/14/2010US7796394 Electrical connector assembly having heat sink
09/14/2010US7796228 Display substrate, method of manufacturing the same and display device having the same
09/14/2010US7795744 Cationically curable epoxy resin composition
09/14/2010US7795743 Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package
09/14/2010US7795742 Semiconductor device having a semiconductor chip, and method for the production thereof
09/14/2010US7795741 Semiconductor device
09/14/2010US7795740 Adhesion enhancement for metal/dielectric interface
09/14/2010US7795736 Interconnects with interlocks
09/14/2010US7795735 Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom
09/14/2010US7795734 Semiconductor device and method of manufacturing the same
09/14/2010US7795732 Ceramic wiring board and process for producing the same, and semiconductor device using the same
09/14/2010US7795730 A first conductive layer of a high-melting point metal is in contact with an insulating layer by droplet discharge; a second conductive layer of silver, gold, copper, or indium tin oxide in contact with the first conductive layer,has improved adhesiveness with the insulating layer; antipeeling agents
09/14/2010US7795729 Transceiver device
09/14/2010US7795728 Electronic component
09/14/2010US7795727 Semiconductor module having discrete components and method for producing the same
09/14/2010US7795726 Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
09/14/2010US7795725 Semiconductor packages
09/14/2010US7795724 Sandwiched organic LGA structure
09/14/2010US7795723 Capped sensor
09/14/2010US7795722 Substrate strip and substrate structure and method for manufacturing the same
09/14/2010US7795721 Semiconductor device and method for manufacturing the same
09/14/2010US7795720 Inversely alternate stacked structure of integrated circuit modules
09/14/2010US7795719 Electro component package
09/14/2010US7795718 Warpage resistant semiconductor package and method for manufacturing the same
09/14/2010US7795717 Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component
09/14/2010US7795716 RF transistor output impedance technique for improved efficiency, output power, and bandwidth
09/14/2010US7795715 Leadframe based flash memory cards
09/14/2010US7795714 Two step molding process secured digital card manufacturing method and apparatus
09/14/2010US7795713 Semiconductor device and method for producing the same
09/14/2010US7795712 Lead frame with non-conductive connective bar
09/14/2010US7795711 Microelectronic cooling apparatus and associated method
09/14/2010US7795710 Lead frame routed chip pads for semiconductor packages
09/14/2010US7795709 Shielding noisy conductors in integrated passive devices
09/14/2010US7795708 Multilayer structures for magnetic shielding
09/14/2010US7795706 Stacked memory without unbalanced temperature distributions
09/14/2010US7795705 Semiconductor device and manufacturing method thereof
09/14/2010US7795704 Die seal ring and wafer having the same
09/14/2010US7795699 Semiconductor device
09/14/2010US7795697 Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe
09/14/2010US7795690 Thin film transistor substrate and method of fabricating the same
09/14/2010US7795685 Method of manufacturing a thin film transistor substrate and stripping composition
09/14/2010US7795681 Isolated lateral MOSFET in epi-less substrate
09/14/2010US7795673 Vertical non-volatile memory
09/14/2010US7795646 Semiconductor device
09/14/2010US7795645 Semiconductor integrated circuit
09/14/2010US7795641 Diode assembly
09/14/2010US7795633 Optoelectronic component
09/14/2010US7795632 Light emitting diode with direct view optic
09/14/2010US7795626 Flip chip type LED lighting device manufacturing method
09/14/2010US7795624 Support body for semiconductor element, method for manufacturing the same and semiconductor device
09/14/2010US7795615 Capacitor integrated in a structure surrounding a die
09/14/2010US7795546 Thermostatic apparatus and cover
09/14/2010US7795545 Hot melt water-resistant structure
09/14/2010US7795542 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/14/2010US7795130 Active area bonding compatible high current structures
09/14/2010US7795129 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
09/14/2010US7795128 Method of manufacturing a semiconductor device having an enhanced electrode pad structure
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