| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/16/2010 | US20100230794 Method For Fabricating Semiconductor Components Using Maskless Back Side Alignment To Conductive Vias |
| 09/16/2010 | US20100230793 Semiconductor apparatus packaging structure, semiconductor apparatus packaging method, and embossed tape |
| 09/16/2010 | US20100230792 Premolded Substrates with Apertures for Semiconductor Die Packages with Stacked Dice, Said Packages, and Methods of Making the Same |
| 09/16/2010 | US20100230791 Leadframe package for light emitting diode device |
| 09/16/2010 | US20100230790 Semiconductor Carrier for Multi-Chip Packaging |
| 09/16/2010 | US20100230789 Semiconductor device and manufacturing method thereof |
| 09/16/2010 | US20100230788 Chip structure, wafer structure and process of faabricating chip |
| 09/16/2010 | US20100230786 Production of integrated circuits comprising semiconductor incompatible materials |
| 09/16/2010 | US20100230784 Semiconductor Packaging with Integrated Passive Componentry |
| 09/16/2010 | US20100230783 Semiconductor device |
| 09/16/2010 | US20100230782 Semiconductor device |
| 09/16/2010 | US20100230781 Trench anti-fuse structures for a programmable integrated circuit |
| 09/16/2010 | US20100230780 Semiconductor device |
| 09/16/2010 | US20100230760 Silicon Wafer Having Interconnection Metal |
| 09/16/2010 | US20100230759 Silicon Chip Having Through Via and Method for Making the Same |
| 09/16/2010 | US20100230727 Electric Circuit with Vertical Contacts |
| 09/16/2010 | US20100230725 Semiconductor integrated circuit |
| 09/16/2010 | US20100230719 Esd protection element |
| 09/16/2010 | US20100230708 Leadframe package for light emitting diode device |
| 09/16/2010 | US20100230696 Wiring member, metal component with resin and resin sealed semiconductor device, and processes for producing them |
| 09/16/2010 | US20100230673 Semiconductor Fuse Structure and a Method of Manufacturing a Semiconductor Fuse Structure |
| 09/16/2010 | US20100230672 Production of integrated circuits comprising different components |
| 09/16/2010 | US20100230473 Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF Al/AlN JOINT MATERIAL |
| 09/16/2010 | US20100230155 Apparatus comprising an electronics module and method of assembling apparatus |
| 09/16/2010 | DE202009013278U1 Gehäustes LED-Modul mit integrierter Elektronik A housed LED module with integrated electronics |
| 09/16/2010 | DE10317580B4 Elektrische Wechselrichtervorrichtung mit einem Flüssigkeitskanal sowie Elektrofahrzeug mit einer derartigen Wechselrichtervorrichtung Electric inverter device having a liquid channel and electric vehicle with such inverter device |
| 09/16/2010 | DE102010002697A1 Ein paralleles optisches Transceiver-Modul mit einem Wärmedissipationssystem, das Wärme dissipiert und Komponenten des Moduls vor Partikeln und Handhabungen schützt Protects a parallel optical transceiver module with a heat dissipation system, which dissipates heat and components of the module against particles and handling |
| 09/16/2010 | DE102010002540A1 Platine, IC-Karte mit der Platine und Herstellungsverfahren hierfür Board, IC card with the printed circuit board and manufacturing method thereof |
| 09/16/2010 | DE102010002398A1 Organische lichtemittierende Diodenanzeige Organic light emitting diode display |
| 09/16/2010 | DE102009022660B3 Befestigung eines Bauelements an einem Substrat und/oder eines Anschlusselementes an dem Bauelement und/oder an dem Substrat durch Drucksinterung Fastening a component to a substrate and / or a connecting element to the component and / or to the substrate by pressure sintering |
| 09/16/2010 | DE102009013114A1 Oberflächenmontierbarer Magnetfeldsensor mit einem Halbleiterchip, Magnetfeldmessvorrichtung und Verfahren zur Herstellung einer Schaltungsplatine mit einem Magnetfeldsensor Surface mount magnetic field sensor comprising a semiconductor chip, magnetic field measuring device and method of manufacturing a circuit board having a magnetic field sensor |
| 09/16/2010 | DE102009013085A1 Method for arranging and connecting electronic component on substrate, involves producing electrical contact of electronic component following from front end of substrate on front-side metallization or openings |
| 09/16/2010 | DE102009012319A1 Power module comprises electronic power component, bearing mounting plate and cooling system which is formed with mounting plate that is directly connected with cooling fins |
| 09/16/2010 | DE102009012139A1 Modulsubstrat und Verfahren zur Herstellung Module substrate and methods for preparing |
| 09/16/2010 | DE102009012042A1 Cooling device for cooling electrical or electronic component, has recess that is completely locked at plate surface by cooling body so that component stays in heat conducting contact with coolant by defined surface using cooling body |
| 09/16/2010 | DE102009006822A1 Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem Microstructure, to processes for their preparation, to apparatus for bonding a micro-structure and micro-system |
| 09/16/2010 | DE102008057831B4 Anordnung mit Leistungshalbleitermodul und Treibereinrichtung Arrangement with power semiconductor module and driver device |
| 09/16/2010 | DE102007043832B4 Elektronische Packages mit benetzbaren und nichtbenetzbaren Feinpartikelbereichen und Verfahren zur Herstellung desselben The same electronic packages with wettable and nonwettable regions fine particles and methods for preparing |
| 09/16/2010 | DE102006058347B4 Aufbau eines Leistungsmoduls und dieses verwendendes Halbleiterrelais Construction of a power module and this-use solid-state relays |
| 09/16/2010 | DE102004011203B4 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system |
| 09/16/2010 | CA2754866A1 Radiator, in particular for room heating |
| 09/15/2010 | EP2228824A1 Embedded chip package with chips stacked in an interconnecting laminate |
| 09/15/2010 | EP2228823A2 A system for improving flip chip performance |
| 09/15/2010 | EP2228822A2 Flexible Packaging for Chip-on-Chip and Package-on-Package Technologies |
| 09/15/2010 | EP2228821A2 Methods for Making Millichannel Substrate, and Cooling Device and Apparatus using the Substrate |
| 09/15/2010 | EP2228820A2 Double side cooled power module with power overlay |
| 09/15/2010 | EP2228819A1 Wireless chip |
| 09/15/2010 | EP2228407A1 Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor device |
| 09/15/2010 | EP2227822A2 A heat sink and method of forming a heatsink using a wedge-lock system |
| 09/15/2010 | EP1697175B1 Control unit and method for producing the same |
| 09/15/2010 | EP1547142B1 Selective connection in ic packaging |
| 09/15/2010 | CN201585229U Heat radiator support back panel |
| 09/15/2010 | CN201585224U Device with radiating element |
| 09/15/2010 | CN201584930U Circulating water-cooling thermal power generating device |
| 09/15/2010 | CN201584416U High-tension high-power operational amplifier |
| 09/15/2010 | CN201584413U Heat dissipation device of lighting and heating component |
| 09/15/2010 | CN201584411U Power chip with stacking package preformed vertical structure |
| 09/15/2010 | CN201584409U Structure of bearing seat for light emitting diode (LED) chips |
| 09/15/2010 | CN201584408U Power module |
| 09/15/2010 | CN201584407U Dual-diode lead frame piece |
| 09/15/2010 | CN201584406U Densely arranged microelectronic transistor lead frame assembly |
| 09/15/2010 | CN201584405U Lead frame piece of integrated circuit of thansistor |
| 09/15/2010 | CN201584404U Non-polar 485 chip |
| 09/15/2010 | CN201584403U Chip cooling device and chip |
| 09/15/2010 | CN201583885U Heat radiating component |
| 09/15/2010 | CN201583172U Heat pipe and heat dissipation module thereof |
| 09/15/2010 | CN201582649U High-power LED street lamp based on composite heat pipe |
| 09/15/2010 | CN201582595U Internal-radiating LED cylindrical lamp |
| 09/15/2010 | CN101836292A Semiconductor device with improved ESD protection |
| 09/15/2010 | CN101836291A Lead frame and process for producing the same |
| 09/15/2010 | CN101836290A Three-dimensional die stacks with inter-device and intra-device optical interconnect |
| 09/15/2010 | CN101836289A Semiconductor device |
| 09/15/2010 | CN101836288A Tray for epoxy molding compound powder and apparatus for providing epoxy molding compound powder having the tray |
| 09/15/2010 | CN101836282A Mos structures that exhibit lower contact resistance and methods for fabricating the same |
| 09/15/2010 | CN101836268A Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same |
| 09/15/2010 | CN101835369A Thermoelectric refrigeration liquid cooling device |
| 09/15/2010 | CN101835365A Thermally conductive EMI shield |
| 09/15/2010 | CN101835364A Heat-dissipating device |
| 09/15/2010 | CN101835363A Heat-dissipating structure |
| 09/15/2010 | CN101834433A Electrostatic discharge prevention circuit based on complementary SCR (Silicon Controlled Rectifier) |
| 09/15/2010 | CN101834192A Solid-state image pickup device and method of manufacturing the same |
| 09/15/2010 | CN101834190A Thin film semiconductor device, electrooptic device, and electronic equipment |
| 09/15/2010 | CN101834185A Nitride nonvolatile read-only memory |
| 09/15/2010 | CN101834184A Substrate-triggered GGNMOS (Grounded-Grid N-Metal-Oxide-Semiconductor) tube |
| 09/15/2010 | CN101834182A Grid coupling NMOS (Negative-channel Metal-Oxide Semiconductor) tube modulated by dynamic grid resistance |
| 09/15/2010 | CN101834181A SCR (Silicon Controlled Rectifier) circuit with auxiliary triggering of NMOS (N-channel Metal Oxide Semiconductor) |
| 09/15/2010 | CN101834179A 电子装置 Electronic devices |
| 09/15/2010 | CN101834177A SOC (System On a Chip) chip device |
| 09/15/2010 | CN101834176A Half-bridge drive circuit chip |
| 09/15/2010 | CN101834171A Integrated circuit package comprising a magnetic capacitor |
| 09/15/2010 | CN101834170A Chip structure capable of suppressing outside high-frequency noise |
| 09/15/2010 | CN101834169A Measurement structure for substrate resistivity of integrated passive device and forming method thereof |
| 09/15/2010 | CN101834168A Combined type circuit substrate structure |
| 09/15/2010 | CN101834167A Semiconductor device, substrate and semiconductor device manufacturing method |
| 09/15/2010 | CN101834166A Leadless integrated circuit package having standoff contacts and die attach pad |
| 09/15/2010 | CN101834165A Integrated circuit chip package body |
| 09/15/2010 | CN101834164A Power distribution system |
| 09/15/2010 | CN101834163A Semiconductor flip-chip bonding packaging heat radiation improved structure |
| 09/15/2010 | CN101834162A Chip packaging structure and method |
| 09/15/2010 | CN101834153A Method for enhancing pressure resistance capacity of chip in packaging process and chip thereof |