Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/21/2010US7800215 Semiconductor device
09/21/2010US7800214 Semiconductor device
09/21/2010US7800213 Power semiconductor circuit with busbar system
09/21/2010US7800212 Mountable integrated circuit package system with stacking interposer
09/21/2010US7800211 Stackable package by using internal stacking modules
09/21/2010US7800210 Semiconductor device
09/21/2010US7800209 Wiring board with conductive wirings and protrusion electrodes
09/21/2010US7800208 Device with a plurality of semiconductor chips
09/21/2010US7800207 Method for connecting a die attach pad to a lead frame and product thereof
09/21/2010US7800206 Semiconductor device
09/21/2010US7800205 Quad flat pack (QFP) package and flexible power distribution method therefor
09/21/2010US7800194 Thin film photodetector, method and system
09/21/2010US7800182 Semiconductor devices having pFET with SiGe gate electrode and embedded SiGe source/drain regions and methods of making the same
09/21/2010US7800180 Semiconductor electrostatic protection device
09/21/2010US7800174 Power semiconductor switching-device and semiconductor power module using the device
09/21/2010US7800144 Solid state imaging apparatus and method for fabricating the same
09/21/2010US7800138 Semiconductor device including thermally dissipating dummy pads
09/21/2010US7800127 ESD protection device with controllable triggering characteristics using driver circuit related to power supply
09/21/2010US7800108 Semiconductor device and method of manufacturing semiconductor device including optical test pattern above a light shielding film
09/21/2010US7800107 Test module for semiconductor device
09/21/2010US7800106 Test structure for OPC-related shorts between lines in a semiconductor device
09/21/2010US7800105 Ga2O3 semiconductor device
09/21/2010US7800001 Probe sheet and electrical connecting apparatus
09/21/2010US7799883 copolymerizing norbornene monomers containing ester groups, sulonamide groups, ethers, alcohols in presence of (Acetonitrile) bis(triisopropylphosphine)palladium(acetate) tetrakis (pentafluorophenyl)borate catalyst and an optional cocatalyst lithium tetrakis(pentafluorophenyl)borate diethyl etherate
09/21/2010US7799852 semiconductor encapsulating resin; polyepoxide of biphenyl-4,4'-diglycidyl ether and 3,3',5,5'-tetramethylbiphenyl-4,4'-diglycidyl ether, phenolic resin, low amount of filler, curing accelerator; inherently fire resistant without added flame retardant; forms foamed layer at ignition for fire retardancy
09/21/2010US7799679 Liquid phase molecular self-assembly for barrier deposition and structures formed thereby
09/21/2010US7799674 Ruthenium alloy film for copper interconnects
09/21/2010US7799673 Semiconductor device manufacturing method
09/21/2010US7799615 Power converter package and thermal management
09/21/2010US7799614 Method of fabricating a power electronic device
09/21/2010US7799610 Method of fabricating a stacked die having a recess in a die BGA package
09/21/2010US7799605 Integrated circuit module and method of forming the same
09/21/2010US7798703 Apparatus and method for measuring local surface temperature of semiconductor device
09/21/2010CA2582186C Three level power converting apparatus
09/21/2010CA2441347C Heat radiating fin and heat radiating method using the same
09/16/2010WO2010105178A2 Gated diode having at least one lightly-doped drain (ldd) implant blocked and circuits and methods employing same
09/16/2010WO2010105157A2 Microelectronic assembly with impedance controlled wirebond and conductive reference element
09/16/2010WO2010105152A2 Microelectronic assembly with impedance controlled wirebond and reference wirebond
09/16/2010WO2010105125A2 Cooling device and electronic device
09/16/2010WO2010104758A2 Methods for forming three-dimensional memory devices, and related structures
09/16/2010WO2010104693A2 Weld terminal, switch assembly and methods of attachment
09/16/2010WO2010104274A2 Lead frame and method for manufacturing the same
09/16/2010WO2010104080A1 Ebullient cooling device
09/16/2010WO2010104001A1 Method for manufacturing electronic device and apparatus for manufacturing electronic device
09/16/2010WO2010103935A1 Method for manufacturing semiconductor device
09/16/2010WO2010103930A1 Method for forming cvd-ru film and method for manufacturing semiconductor devices
09/16/2010WO2010103903A1 Film for spacer formation, semiconductor wafer, and semiconductor device
09/16/2010WO2010103880A1 METHOD FOR FORMING Cu FILM, AND STORAGE MEDIUM
09/16/2010WO2010103879A1 METHOD FOR FORMING Cu FILM, AND STORAGE MEDIUM
09/16/2010WO2010103865A1 Semiconductor module
09/16/2010WO2010103756A1 Module component, method for manufacturing same, and electronic apparatus using the module component
09/16/2010WO2010103745A1 Semiconductor-sealing resin composition and semiconductor device
09/16/2010WO2010103723A1 Board with built-in function element, method of producing same, and electronic equipment
09/16/2010WO2010103597A1 Semiconductor device
09/16/2010WO2010103468A1 Radiator, in particular for room heating
09/16/2010WO2010103346A1 An electrically insulating heat radiator
09/16/2010WO2010102654A1 Power semiconductor module having layered insulating side walls
09/16/2010WO2010078021A3 Removable package underside device attach
09/16/2010WO2010074127A9 Piezoelectric oscillation device, method for manufacturing a piezoelectric oscillation device, and etching method of structural components forming a piezoelectric oscillation device
09/16/2010WO2010047503A9 Resin protected thin sensor element
09/16/2010WO2010020105A8 Led driven by ac power directly
09/16/2010US20100234709 Analyte Monitoring Device and Methods of Use
09/16/2010US20100233857 Fabrication method of semiconductor integrated circuit device
09/16/2010US20100232220 Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices
09/16/2010US20100231638 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
09/16/2010US20100231637 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
09/16/2010US20100231636 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
09/16/2010US20100230841 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
09/16/2010US20100230828 Microelectronic assembly with impedance controlled wirebond and conductive reference element
09/16/2010US20100230827 Semiconductor device and method for manufacturing semiconductor device
09/16/2010US20100230826 Integrated circuit package assembly and packaging method thereof
09/16/2010US20100230825 Flexible Packaging for Chip-on-Chip and Package-on-Package Technologies
09/16/2010US20100230824 Metal Interconnect of Semiconductor Device
09/16/2010US20100230823 Semiconductor device, electronic device and method of manufacturing semiconductor device
09/16/2010US20100230822 Semiconductor Die and Method of Forming Noise Absorbing Regions Between THVS in Peripheral Region of the Die
09/16/2010US20100230820 Method for fabricating semiconductor device and semiconductor device
09/16/2010US20100230819 Semiconductor Constructions
09/16/2010US20100230818 Through Substrate Via Semiconductor Components
09/16/2010US20100230817 Using Unstable Nitrides to Form Semiconductor Structures
09/16/2010US20100230816 Semiconductor device and method for forming the same
09/16/2010US20100230815 Semiconductor device
09/16/2010US20100230814 Nanoscale, spatially-controlled ga doping of undoped transparent conducting oxide films
09/16/2010US20100230813 Semiconductor Constructions and Methods of Forming Layers
09/16/2010US20100230812 Microelectronic Assemblies Having Compliancy and Methods Therefor
09/16/2010US20100230811 Semiconductor device having a conductive bump
09/16/2010US20100230810 Flip chip semiconductor package and fabrication method thereof
09/16/2010US20100230809 Wire loop and method of forming the wire loop
09/16/2010US20100230808 Reducing stress between a substrate and a projecting electrode on the substrate
09/16/2010US20100230807 Method and Apparatus to Repair Defects in Nonvolatile Semiconductor Memory Devices
09/16/2010US20100230805 Multi-die semiconductor package with heat spreader
09/16/2010US20100230804 Thermal resistor, semiconductor device using the same, and electric device
09/16/2010US20100230803 Electronic device package and method for forming the same
09/16/2010US20100230802 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
09/16/2010US20100230801 Semiconductor device
09/16/2010US20100230800 Double side cooled power module with power overlay
09/16/2010US20100230799 Semiconductor device
09/16/2010US20100230798 Semiconductor device including spacer element
09/16/2010US20100230797 Warp-suppressed semiconductor device
09/16/2010US20100230796 Integrated circuit package-in-package system and method for making thereof
09/16/2010US20100230795 Stacked microelectronic assemblies having vias extending through bond pads
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