Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/22/2010CN101843184A Cooling member
09/22/2010CN101843181A Part built-in wiring board, and manufacturing method for the part built-in wiring board
09/22/2010CN101842896A Method for stacking serially-connected integrated circuits and multi-chip device made from same
09/22/2010CN101842895A RF-IC packaging method and circuits obtained thereby
09/22/2010CN101842894A Module housing and method for producing a module housing
09/22/2010CN101842893A Semiconductor assembly and packaging for high current and low inductance
09/22/2010CN101842892A A heat transfer device
09/22/2010CN101842891A Wiring member, metal component with resin and resin sealed semiconductor device, and processes for producing them
09/22/2010CN101842887A Method for the production and contacting of electronic components by means of a substrate plate, particularly a DCB ceramic substrate plate
09/22/2010CN101842871A Semiconductor device manufacturing method and semiconductor device
09/22/2010CN101842827A Active matrix substrate, method for manufacturing same, and liquid crystal display apparatus
09/22/2010CN101841994A Portable electronic device and pluggable cooling device thereof
09/22/2010CN101841993A Dissipation device
09/22/2010CN101841992A Assembly fixture for heat dissipation module
09/22/2010CN101841991A Heat dissipation module
09/22/2010CN101841988A Fastener
09/22/2010CN101841987A Heat sink and fastener thereof
09/22/2010CN101841975A Method for manufacturing high-thermal conductivity circuit board by hot-pressing method and high-thermal conductivity circuit board
09/22/2010CN101841973A High-thermal conductivity circuit board preparation method based on metal base and circuit board
09/22/2010CN101840926A Solid-state imaging device, method of manufacturing the same, method of driving the same, and electronic apparatus
09/22/2010CN101840924A Semiconductor device and backside illumination solid-state imaging device
09/22/2010CN101840922A Array substrate and manufacturing method thereof
09/22/2010CN101840917A Integrate circuit and packaging device thereof, and method and assembly for packaging a plurality of integrate circuits
09/22/2010CN101840915A Pin sharing device and method
09/22/2010CN101840914A Double side cooled power module with power overlay
09/22/2010CN101840912A Semiconductor device and manufacturing method thereof
09/22/2010CN101840910A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/22/2010CN101840909A Integrated circuit device
09/22/2010CN101840908A Wide-input voltage range zero-leakage current input pull-up circuit
09/22/2010CN101840907A Substrate packaging structure with multiple switches
09/22/2010CN101840906A High Q-value chip integrated inductor
09/22/2010CN101840905A Metal interconnect of semiconductor device and method for fabricating the same
09/22/2010CN101840904A Chip on film and manufacturing method thereof
09/22/2010CN101840903A Packaging substrate and chip packaging structure
09/22/2010CN101840902A Direct chip placing lead frame structure and production method thereof
09/22/2010CN101840901A Lead frame structure of static release ring without paddle and production method thereof
09/22/2010CN101840900A Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
09/22/2010CN101840899A Grounding structure
09/22/2010CN101840898A Multilayer printed wiring board
09/22/2010CN101840897A Circuit board and chip packaging structure
09/22/2010CN101840896A Flip-chip high-heat-radiation spheroidal array encapsulation structure
09/22/2010CN101840895A High heat dissipation spherical array package structure
09/22/2010CN101840894A 半导体器件 Semiconductor devices
09/22/2010CN101840893A Packaging structure of up-right type chip
09/22/2010CN101840886A Manufacturing method of semiconductor device
09/22/2010CN101840869A Method for improving heat dissipation of chip suspension semiconductor package
09/22/2010CN101840868A Improved method for semi-conductor flip-chip bonding package cooling
09/22/2010CN101840867A Method for producing an electronic module
09/22/2010CN101840866A Chip-scale packaging structure and manufacturing method thereof
09/22/2010CN101840117A TFT-LCD ( Thin Film Transistor-Liquid Crystal Diode) array substrate and manufacture method thereof
09/22/2010CN101840116A TFT-LCD (Thin Film Transistor-Liquid Crystal Diode) array substrate and manufacture method thereof
09/22/2010CN101839459A High-efficiency radiator without power consumption
09/22/2010CN101839421A Sealed outdoor lighting lamp with LED light source module
09/22/2010CN101629682B High-power LED lamp
09/22/2010CN101587824B Registration mark and manufacturing method thereof
09/22/2010CN101577275B Modulation triggering type electrostatic discharge protection component
09/22/2010CN101523595B Heat generator cooling structure and driving apparatus fitted with the same
09/22/2010CN101459186B Image sensor and method for manufacturing the same
09/22/2010CN101449373B Semiconductor device, electronic parts module, and method for manufacturing the semiconductor device
09/22/2010CN101435962B TFT-LCD array substrate structure and manufacturing method thereof
09/22/2010CN101375393B Hollow package made of resin, and manufacturing method thereof
09/22/2010CN101355058B Semiconductor device and method of manufacturing the same
09/22/2010CN101263598B Integrated circuit packaging and a method therefor
09/22/2010CN101241924B Imaging device module and portable electronic apparatus utilizing the same
09/22/2010CN101241844B In-situ dry clean chamber for front end of line fabrication
09/22/2010CN101207170B LED lead frame and method for manufacturing LED using the lead frame
09/22/2010CN101170886B Heat radiation module
09/22/2010CN101098613B Radiating module device
09/22/2010CN101083384B Electronic component, laser device, optical writing device and image forming apparatus
09/21/2010USRE41722 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
09/21/2010USRE41721 Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes
09/21/2010USRE41719 Power MOSFET with integrated drivers in a common package
09/21/2010US7802224 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
09/21/2010US7800908 Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink
09/21/2010US7800900 Cold row encapsulation for server farm cooling system
09/21/2010US7800810 Packaging and testing of multiple MEMS devices on a wafer
09/21/2010US7800718 Electro-optical device and electronic apparatus having a light-shielding film at least partially overlapping with a transistor in plan view and having a plurality of openings overlapping with the transistor
09/21/2010US7800241 organosilicon and organometallic compounds within adhesion promoter layer having nanoscale ceramic grains applied wet-chemically
09/21/2010US7800240 Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure
09/21/2010US7800239 Thick metal interconnect with metal pad caps at selective sites and process for making the same
09/21/2010US7800238 Surface depressions for die-to-die interconnects and associated systems and methods
09/21/2010US7800237 Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device
09/21/2010US7800236 Semiconductor die and method for forming a semiconductor die having power and ground strips that are oriented diagonally
09/21/2010US7800235 Method of fabricating semiconductor device
09/21/2010US7800234 Process for manufacturing deep through vias in a semiconductor device, and semiconductor device made thereby
09/21/2010US7800233 Semiconductor device and method of manufacturing the same
09/21/2010US7800232 Metallic electrode forming method and semiconductor device having metallic electrode
09/21/2010US7800230 Solder preform and electronic component
09/21/2010US7800229 Semiconductor device and method for manufacturing same
09/21/2010US7800228 Reliable via contact interconnect structure
09/21/2010US7800227 Semiconductor device with crack-resistant multilayer copper wiring
09/21/2010US7800224 Power device package
09/21/2010US7800223 Chip-scale monolithic load switch for portable applications
09/21/2010US7800222 Semiconductor module with switching components and driver electronics
09/21/2010US7800221 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer
09/21/2010US7800220 Power electronics assembly with cooling element
09/21/2010US7800219 High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same
09/21/2010US7800218 Package unit
09/21/2010US7800217 Power semiconductor device connected in distinct layers of plastic
09/21/2010US7800216 Multilayer printed wiring board
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