| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/23/2010 | WO2010106484A1 Bond frame integrated in electronic circuit |
| 09/23/2010 | WO2010106473A1 Packaged semiconductor product and method for manufacture thereof |
| 09/23/2010 | WO2010105945A1 A method for the removal of hydrogen from a hydrogen sensitive device by means of a non-evaporable yttrium based getter alloy |
| 09/23/2010 | WO2010105853A1 Vertically contacted electronic component and method for producing same |
| 09/23/2010 | WO2010105492A1 Method for encapsulating multiple led chips with vertical structure on base to fabricate led lihgt source |
| 09/23/2010 | WO2010105346A1 Multi-die semiconductor package with heat spreader |
| 09/23/2010 | WO2010041968A3 Nanocomposites for optoelectronic devices |
| 09/23/2010 | US20100241388 Analyte Monitoring Device And Methods Of Use |
| 09/23/2010 | US20100240974 Analyte Monitoring Device and Methods of Use |
| 09/23/2010 | US20100240211 Semiconductor device, method of manufacturing the same, and phase shift mask |
| 09/23/2010 | US20100240192 Alignment mark, method of manufacturing semiconductor device, and mask set |
| 09/23/2010 | US20100240176 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 09/23/2010 | US20100240163 Substrate with multiple encapsulated pressures |
| 09/23/2010 | US20100238696 Multi-chip packages including extra memory chips to define additional logical packages and related devices |
| 09/23/2010 | US20100238334 Solid-state imaging device, method of manufacturing the same, method of driving the same, and electronic apparatus |
| 09/23/2010 | US20100237884 Integrated switchless programmable attenuator and low noise amplifier |
| 09/23/2010 | US20100237514 Ingot marking for solar cell determination |
| 09/23/2010 | US20100237513 Applications of smart polymer composites to integrated circuit packaging |
| 09/23/2010 | US20100237512 Semiconductor memory device |
| 09/23/2010 | US20100237511 Structure and Method for Thin Single or Multichip Semiconductor QFN Packages |
| 09/23/2010 | US20100237510 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
| 09/23/2010 | US20100237509 Io cell with multiple io ports and related techniques for layout area saving |
| 09/23/2010 | US20100237508 Power-supply wiring structure for multilayer wiring and method of manufacturing multilayer wiring |
| 09/23/2010 | US20100237507 Power module |
| 09/23/2010 | US20100237506 Semiconductor device and manufacturing method thereof |
| 09/23/2010 | US20100237505 Metal-metal bonding of compliant interconnect |
| 09/23/2010 | US20100237504 Methods of Fabricating Semiconductor Devices Having Conductive Wirings and Related Flash Memory Devices |
| 09/23/2010 | US20100237503 Electromigration resistant aluminum-based metal interconnect structure |
| 09/23/2010 | US20100237502 Barrier for Through-Silicon Via |
| 09/23/2010 | US20100237501 Semiconductor device and method for manufacturing the same |
| 09/23/2010 | US20100237500 Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site |
| 09/23/2010 | US20100237499 Semiconductor device, and stacked structure, package, module, and electronic apparatus including the same, and method of fabricating the same |
| 09/23/2010 | US20100237498 Package for semiconductor device and packaging method thereof |
| 09/23/2010 | US20100237497 Semiconductor device and method of manufacturing the same |
| 09/23/2010 | US20100237496 Thermal Interface Material with Support Structure |
| 09/23/2010 | US20100237495 Semiconductor Device and Method of Providing Z-Interconnect Conductive Pillars with Inner Polymer Core |
| 09/23/2010 | US20100237494 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
| 09/23/2010 | US20100237493 Printed circuit board and electronic apparatus having a printed circuit board |
| 09/23/2010 | US20100237492 Semiconductor device and method for designing the same |
| 09/23/2010 | US20100237491 Semiconductor package with reduced internal stress |
| 09/23/2010 | US20100237490 Package structure and manufacturing method thereof |
| 09/23/2010 | US20100237489 Structure and Method for Sealing Cavity of Micro-Electro-Mechanical Device |
| 09/23/2010 | US20100237488 Integrated circuit package system including honeycomb molding |
| 09/23/2010 | US20100237487 Methods and systems for packaging integrated circuits |
| 09/23/2010 | US20100237486 Semiconductor device |
| 09/23/2010 | US20100237484 Semiconductor package |
| 09/23/2010 | US20100237483 Integrated circuit packaging system with an interposer and method of manufacture thereof |
| 09/23/2010 | US20100237482 Integrated circuit packaging system with layered packaging and method of manufacture thereof |
| 09/23/2010 | US20100237481 Integrated circuit packaging system with dual sided connection and method of manufacture thereof |
| 09/23/2010 | US20100237480 Semiconductor device and wire bonding method |
| 09/23/2010 | US20100237479 Lead Frame Based, Over-Molded Semiconductor Package with Integrated Through Hole Technology (THT) Heat Spreader Pin(s) and Associated Method of Manufacturing |
| 09/23/2010 | US20100237478 Lead frame and semiconductor package having the same |
| 09/23/2010 | US20100237477 Semiconductor Device and Method of Mounting Pre-Fabricated Shielding Frame over Semiconductor Die |
| 09/23/2010 | US20100237473 Semiconductor device and semiconductor package having the same |
| 09/23/2010 | US20100237472 Chip Guard Ring Including a Through-Substrate Via |
| 09/23/2010 | US20100237471 Semiconductor Die and Method of Forming Through Organic Vias Having Varying Width in Peripheral Region of the Die |
| 09/23/2010 | US20100237469 Photomask, semiconductor device, and charged beam writing apparatus |
| 09/23/2010 | US20100237462 Package Level Tuning Techniques for Propagation Channels of High-Speed Signals |
| 09/23/2010 | US20100237461 Semiconductor package substrate including fuses, semiconductor device package, semiconductor module and electronic apparatus including the same |
| 09/23/2010 | US20100237386 Electrostatic discharge structure for 3-dimensional integrated circuit through-silicon via device |
| 09/23/2010 | US20100237345 Wafer and manufacturing method of electronic component |
| 09/23/2010 | DE202009017866U1 Schaltungsanordnung mit einem Leistungshalbleiterbauelement und einem Verbindungspartner Circuit arrangement with a power semiconductor device and a link partner |
| 09/23/2010 | DE10218767B4 Elektronischer Baustein für die Oberflächenmontage Electronic component for surface mount |
| 09/23/2010 | DE102010015957A1 Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device |
| 09/23/2010 | DE102010015930A1 Integrierte Schaltung mit Feldeffekttransistoren und Herstellungsverfahren hierfür An integrated circuit comprising field effect transistors and methods of manufacture therefor |
| 09/23/2010 | DE102010015886A1 Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement and method of manufacturing a sensor arrangement |
| 09/23/2010 | DE102010000537A1 Halbleiteranordnung mit einem Abstandshalterelement A semiconductor device with a spacer element |
| 09/23/2010 | DE102009033063A1 Heat sink for cooling insulated gate bipolar transistor of e.g. converter, has heat dissipation devices formed from material e.g. copper, with heat conductance value that is higher than heat conductance value of material of base |
| 09/23/2010 | DE102009012546A1 Mono anti-reflection silicon nitride layer for use on switching circuits with e.g. photodiodes, by single-step plasma enhanced chemical vapor deposition method, is designed as protective layer against data degradation of elements |
| 09/23/2010 | DE102009012516A1 Multilayer substrate for receiving circuit components of highly integrated module, comprises lower layer made of dielectric material with dielectric constant, and upper layer made of dielectric material with dielectric constant |
| 09/23/2010 | DE102009001722A1 Method of applying heat transfer medium, involves providing thermal contact surface having object, and applying phase change material having thermal compound to thermal contact surface |
| 09/23/2010 | DE102009001642A1 Electrostatic discharge protection device has two connections, where electrostatic discharge transistor is controlled by activation-transistor |
| 09/23/2010 | DE102009001632A1 Measurement arrangement i.e. pH-sensor, for measuring ion concentration of measuring medium, has vibration exciter arranged in housing and mechanically coupled with chip for oscillating chip, where vibration exciter comprises transducer |
| 09/23/2010 | DE102006014733B4 Chip mit einer Mehrzahl extern gespeister Stromversorgungsnetze Chip having a plurality of externally-powered power supply networks |
| 09/23/2010 | DE102006004192B4 Wärmeaustauschrohr und Verfahren zu dessen Herstellung Heat exchange tube and method for its production |
| 09/23/2010 | DE102005049872B4 IC-Bauelement mit Kühlanordnung IC device with cooling arrangement |
| 09/23/2010 | DE102004062135B4 Verstärkerschaltung Amplifier circuit |
| 09/23/2010 | CA2754797A1 A method for the removal of hydrogen from a hydrogen sensitive device by means of a non-evaporable yttrium based getter alloy |
| 09/22/2010 | EP2230889A1 Method for producing wiring board and wiring board |
| 09/22/2010 | EP2230712A2 Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system |
| 09/22/2010 | EP2230690A2 Solid-state imaging device, method of manufacturing the same, method of driving the same, and electronic apparatus |
| 09/22/2010 | EP2230689A1 Short-circuit-proof semi-conductor module |
| 09/22/2010 | EP2230688A1 Fan out semiconductor package and manufacturing method |
| 09/22/2010 | EP2230687A2 Switching assembly, method for electric and/or mechanical connection and device for applying connection elements |
| 09/22/2010 | EP2229695A2 Monolithically integrated antenna- and receiver circuit for the detection of terahertz waves |
| 09/22/2010 | EP2229691A1 A method for attaching a semiconductor die to a leadframe, and a semiconductor device |
| 09/22/2010 | EP1508261B1 Electronic assembly and method of making an electronic assembly |
| 09/22/2010 | EP1273045B1 Diode and method for producing the same |
| 09/22/2010 | CN201590754U Surface mounted bending type rectifying bridge |
| 09/22/2010 | CN201590753U Bridge rectifier with heat radiating fins |
| 09/22/2010 | CN201590432U Single-color LED encapsulation structure with high light-emitting rate and projection optical engine using same |
| 09/22/2010 | CN201590415U High stability rectifier bridge |
| 09/22/2010 | CN201590414U Encapsulating structure with multiple LED chips and optical projection engine using encapsulating structure |
| 09/22/2010 | CN201590413U Radiating structure of flip chip |
| 09/22/2010 | CN201590079U 集成电路 IC |
| 09/22/2010 | CN201589134U Led路灯 Led lights |
| 09/22/2010 | CN201589132U LED street lamp with hollow structure |
| 09/22/2010 | CN201589080U LED illumination device and radiating structure thereof |
| 09/22/2010 | CN1979205B Methods for variability measurement of integrated circuit components and integrated circuit components |
| 09/22/2010 | CN1905178B Circuit assembly structure and method for making the same |