Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/29/2010CN101345243B Semiconductor device
09/29/2010CN101340796B Heat radiating device
09/29/2010CN101340795B Heat radiating device
09/29/2010CN101335264B Chip stacked structure and method of fabricating the same
09/29/2010CN101335256B NOR flash device and method for fabricating the device
09/29/2010CN101325191B Square flat non-pin encapsulation method with pattern on chip
09/29/2010CN101315931B Semiconductor device in peripheral circuit region using a dummy gate
09/29/2010CN101308865B Organic electroluminescence display device
09/29/2010CN101308845B Semiconductor device and method for manufacturing the same
09/29/2010CN101295656B Semiconductor device and manufacturing method thereof
09/29/2010CN101290930B Semiconductor device comprising a semiconductor chip stack and method for producing the same
09/29/2010CN101286501B Image sensor package and image pickup device applying image sensor
09/29/2010CN101278392B 多层印刷线路板 Multilayer printed circuit boards
09/29/2010CN101267724B Heat radiation device
09/29/2010CN101253626B Circuit device and method for manufacturing same
09/29/2010CN101252116B Interconnection structure and method of manufacturing the same
09/29/2010CN101226915B Package substrate and manufacturing method thereof
09/29/2010CN101207134B Disposable programmable non-volatile memory unit, array and method of manufacture
09/29/2010CN101199247B Printed wiring board
09/29/2010CN101197372B Semiconductor device and resin sealing type semiconductor device
09/29/2010CN101197272B Method for forming metal front medium layer and its structure
09/29/2010CN101188921B Heat radiator
09/29/2010CN101170889B Heat radiator
09/29/2010CN101170888B Heat radiator
09/29/2010CN101166406B Fin group and heat radiation device with fin group
09/29/2010CN101154643B Substrate structure and its manufacturing method
09/29/2010CN101150944B Heat radiator
09/29/2010CN101150115B Conductive resistance blocking layer material for copper interconnection and making method
09/29/2010CN101145592B High heat dispersion light emitting diode device
09/29/2010CN101136424B CMOS image sensor and method for manufacturing thereof
09/29/2010CN101136402B Semiconductor device and manufacturing method thereof
09/29/2010CN101127358B Thin-film transistor substrate, method of manufacturing the same and display apparatus having the same
09/29/2010CN101127336B Semiconductor device, manufacturing method thereof, circuit substrate and electric device
09/29/2010CN101123860B Heat radiator
09/29/2010CN101123859B Heat dispersion device combination and its assembly method
09/29/2010CN101123255B Semiconductor integrated circuit device
09/29/2010CN101106887B Radiator
09/29/2010CN101090098B Semiconductor device and method for manufacturing the same
09/29/2010CN101083268B Metal line layout in a memory cell
09/29/2010CN101083233B Semiconductor device encapsulated with resin composition and resin composition for encapsulating semiconductor device
09/29/2010CN101026146B Power semiconductor module and its manufacturing method
09/29/2010CN101021680B Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor device
09/29/2010CN101010260B Single-layer carbon nanotube and aligned single-layer carbon nanotube bulk structure, and their production process, production apparatus and use
09/29/2010CN101005017B Method of forming a semiconductor thin film
09/28/2010US7804687 Liquid-cooled rack with pre-cooler and post-cooler heat exchangers used for EMI shielding
09/28/2010US7804671 Electrostatic discharge protection circuit
09/28/2010US7804573 Liquid crystal display device, method for fabricating the same, and portable telephone using the same
09/28/2010US7804205 Electret device and electrostatic operating apparatus
09/28/2010US7804178 Semiconductor component with surface mountable devices and method for producing the same
09/28/2010US7804177 Silicon-based thin substrate and packaging schemes
09/28/2010US7804176 Semiconductor device
09/28/2010US7804175 Semiconductor structures including conductive vias continuously extending therethrough and methods of making the same
09/28/2010US7804174 TFT wiring comprising copper layer coated by metal and metal oxide
09/28/2010US7804173 Semiconductor device having conductive bumps and deviated solder pad
09/28/2010US7804172 Electrical connections made with dissimilar metals
09/28/2010US7804171 Techniques for packaging a multiple device component
09/28/2010US7804170 Semiconductor device and method of designing the same
09/28/2010US7804169 Integrated circuit package and fabricating method thereof
09/28/2010US7804168 Ball grid array structures having tape-based circuitry
09/28/2010US7804167 Wire bond integrated circuit package for high speed I/O
09/28/2010US7804166 Integrated circuit package system with stacking module
09/28/2010US7804165 Device comprising a sensor module
09/28/2010US7804164 Subminiature electronic device having hermetic cavity and method of manufacturing the same
09/28/2010US7804163 Seamless secured digital card manufacturing methods with male guide and female switch
09/28/2010US7804162 Multi-wavelength white light-emitting structure
09/28/2010US7804161 Semiconductor device and dam for resin
09/28/2010US7804160 Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method
09/28/2010US7804159 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
09/28/2010US7804158 Electronic device with shielding structure and method of manufacturing the same
09/28/2010US7804153 Semiconductor device preventing bridge between fuse pattern and guard ring
09/28/2010US7804151 Integrated circuit structure, design structure, and method having improved isolation and harmonics
09/28/2010US7804148 Opto-thermal mask including aligned thermal dissipative layer, reflective layer and transparent capping layer
09/28/2010US7804138 Buried guard ring and radiation hardened isolation structures and fabrication methods
09/28/2010US7804137 Field effect transistor (FET) devices and methods of manufacturing FET devices
09/28/2010US7804136 Method of forming nitride films with high compressive stress for improved PFET device performance
09/28/2010US7804135 Integrated semiconductor diode arrangement and integrated semiconductor component
09/28/2010US7804118 Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same
09/28/2010US7804094 Process for fabricating a thin film semiconductor device, thin film semiconductor device, and liquid crystal display
09/28/2010US7803719 Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor device
09/28/2010US7803718 BiCMOS performance enhancement by mechanical uniaxial strain and methods of manufacture
09/28/2010US7803665 Method for encapsulating a device in a microcavity
09/28/2010US7803664 Apparatus and methods for cooling semiconductor integrated circuit package structures
09/28/2010US7802464 FET-based gas sensor system
09/28/2010US7802436 Cooling apparatus having low profile extrusion and method of manufacture therefor
09/28/2010CA2553438C Conductive material compositions, apparatus, systems, and methods
09/28/2010CA2313767C Metal material for electronic parts, electronic parts, electronic apparatuses, and method of processing metal materials
09/23/2010WO2010108113A1 Apparatus for dissipating thermal energy generated by current flow in semiconductor circuits
09/23/2010WO2010107851A2 Rapid fabrication of a microelectronic temporary support for inorganic substrates
09/23/2010WO2010107542A1 Thermal interface material with support structure
09/23/2010WO2010107514A1 Chip carrier with inductor for impedance tuning
09/23/2010WO2010107437A1 Closed-loop vapor chamber
09/23/2010WO2010107430A1 Integrated circuit inductors with reduced magnetic coupling
09/23/2010WO2010106839A1 Circuit board and mother laminated body
09/23/2010WO2010106780A1 Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
09/23/2010WO2010106779A1 Method for manufacturing substrate for semiconductor element, and semiconductor device
09/23/2010WO2010106703A1 Semiconductor device, method for manufacturing same, electronic device and electronic component
09/23/2010WO2010106698A1 Process for production of phosphorus-atom-containing phenol, novel phosphorus-atom-containing phenol, curable resin composition, cured product thereof, printed circuit board, and semiconductor sealing material
09/23/2010WO2010106600A1 Semiconductor device and method for manufacturing same
09/23/2010WO2010106599A1 Circuit module and electronic device
09/23/2010WO2010106515A1 Fan out semiconductor package and manufacturing method