Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/29/2010EP2232551A2 Semiconductor switching device with gate connection
09/29/2010EP2232550A1 Semiconductor device thermal connection
09/29/2010EP2232549A2 3-d semiconductor die structure with containing feature and method
09/29/2010EP2232547A2 Integrated circuit system with contact integration
09/29/2010EP2232540A2 Method of forming a thermo pyrolytic graphite-embedded heatsink
09/29/2010EP2054150B1 Hydrophobically coated molecular sieve
09/29/2010EP2013906B1 A microwave chip supporting structure
09/29/2010CN201594973U Composite structure of fan and frame body and multi-fan radiating device therewith
09/29/2010CN201594969U Needle type phase-change electronic heat radiator
09/29/2010CN201594549U Surface-mount encapsulation for three-dimensional vertical semiconductor epitaxial film
09/29/2010CN201594539U Complementary oxidized metal layer semi-conductor sensing packaging structure
09/29/2010CN201594538U Three-dimensional assembling structure for hybrid integrated circuit
09/29/2010CN201594537U Vehicle circuit module and substrate structure thereof
09/29/2010CN201594536U Chip stack circuit structure
09/29/2010CN201594535U High-efficiency air cooled radiator
09/29/2010CN201593771U Light fitting and extruded heat dissipation structure thereof
09/29/2010CN1978580B Heat-conductive cream and electronic device using same
09/29/2010CN1976032B 半导体器件 Semiconductor devices
09/29/2010CN1958663B 液状环氧树脂组成物 A liquid epoxy resin composition
09/29/2010CN1943023B Wiring structure for integrated circuit with reduced intralevel capacitance and method
09/29/2010CN1917224B Coated wafer level camera modules and associated methods
09/29/2010CN1906751B System and method for stress free conductor removal
09/29/2010CN1905132B Silicon carbon germanium (SiCGe) substrate for a group III nitride-based device and forming method thereof
09/29/2010CN1877834B Semiconductor integrated circuit device and method for fabricating the same
09/29/2010CN1813505B Integrated socket and cable connector
09/29/2010CN1716603B Electronic device, thin film transistor structure and flat panel display having the same
09/29/2010CN1666335B Integrated circuit package, thermal interface layer, coupling method and method for providing heat conduction path
09/29/2010CN1645560B A suspension for filling via holes in silicon and method for making the same
09/29/2010CN1300180B Chip mounting, circuit board, data carrier and manufacture method thereof and electronic element assembly
09/29/2010CN101849445A Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module
09/29/2010CN101849286A Semiconductor chip having power supply line with minimized voltage drop
09/29/2010CN101849284A Structure for reducing warp of substrate
09/29/2010CN101849276A Device and device manufacturing method
09/29/2010CN101848624A Liquid cooling heat radiator
09/29/2010CN101848623A Heat abstractor
09/29/2010CN101848622A Radiator and electronic device
09/29/2010CN101848621A Radiator
09/29/2010CN101848618A Radiator and buckling device thereof
09/29/2010CN101848602A Multi-layer printed board
09/29/2010CN101848597A Multilayer printed wiring board
09/29/2010CN101848326A Imaging apparatus
09/29/2010CN101847660A Transistor and display panel including the same
09/29/2010CN101847651A Organic EL apparatus, method of manufacturing organic EL apparatus, electronic apparatus
09/29/2010CN101847650A Organic light emitting display device
09/29/2010CN101847648A Active matrix organic light-emitting diode pixel structure and manufacturing method thereof
09/29/2010CN101847644A Semiconductor device
09/29/2010CN101847642A Pixel unit and array base plate
09/29/2010CN101847641A Array substrate, manufacturing method thereof and wide-viewing angle liquid crystal display
09/29/2010CN101847640A Array substrate, manufacturing method thereof and liquid crystal display panel
09/29/2010CN101847639A Array substrate and manufacturing method thereof
09/29/2010CN101847638A Active component array substrate and liquid crystal display panel
09/29/2010CN101847632A Laminated inductance structure with hollow substrate and implementation method thereof
09/29/2010CN101847628A Display device
09/29/2010CN101847627A Semiconductor chip of integrated passive element and power amplifier element
09/29/2010CN101847623A Power module
09/29/2010CN101847622A Power chip with multi-stack package preformed vertical structure and manufacturing method thereof
09/29/2010CN101847621A Three-dimensional electronics package
09/29/2010CN101847620A 功率模块 Power Modules
09/29/2010CN101847619A Internal shield of infrared receiver
09/29/2010CN101847618A Semiconductor device
09/29/2010CN101847617A Packaging substrate and chip packaging structure
09/29/2010CN101847616A Barrier for through-silicon via
09/29/2010CN101847615A Integrated circuit chip package
09/29/2010CN101847614A QFN/DFN (Quad Flat No-lead /Dual Flat No-lead) no-die chip packaging structure
09/29/2010CN101847613A Water circulation heat radiation device of semiconductor chilling plate
09/29/2010CN101847612A Semiconductor device and manufacturing method thereof
09/29/2010CN101847611A 半导体装置及半导体装置集合体 A semiconductor device and a semiconductor device assembly
09/29/2010CN101847610A Semiconductor device and manufacturing method thereof
09/29/2010CN101847608A Array substrate and manufacturing method
09/29/2010CN101847606A Nonvolatile memory and manufacture method thereof
09/29/2010CN101847599A Method of forming sensing circuit and structure therefor
09/29/2010CN101847597A Integrated circuit structure
09/29/2010CN101847590A Method for packaging multi-laminated multi-chip on flexible circuit board and packaging chipset
09/29/2010CN101847589A Method for manufacturing a rigid power module suited for high-voltage applications
09/29/2010CN101847586A Circuit substrate process and circuit substrate
09/29/2010CN101847436A Magnetic multilayer film random memorizer based on vertical transistor
09/29/2010CN101846858A Array substrate and manufacturing method thereof
09/29/2010CN101846828A Active component array substrate and liquid crystal display panel
09/29/2010CN101846298A Lamp heat-radiating device
09/29/2010CN101846297A Convective heat-dissipating LED lamp
09/29/2010CN101846296A LED lamp of multiple radiating device
09/29/2010CN101846245A Light source and method of controlling light spectrum of led light engine
09/29/2010CN101619824B LED street lamp
09/29/2010CN101556032B 发光二极管灯具 LED lamp
09/29/2010CN101552246B Radiator with radiation-type radiation fins
09/29/2010CN101533817B Semiconductor encapsulation structure with pins on bearing seat
09/29/2010CN101533791B Method for manufacturing luminescence module and luminescence module
09/29/2010CN101494217B Conductor frame
09/29/2010CN101487583B Illuminating apparatus
09/29/2010CN101483172B Semiconductor structure and its production method
09/29/2010CN101477973B Conductive wire frame strip, glue sealing method and glue sealing structure
09/29/2010CN101470449B Cooling control system and cooling control method
09/29/2010CN101465352B Semiconductor device for reducing interference between adjoining gates and method for manufacturing the same
09/29/2010CN101461060B Improved metal-insulator-metal capacitors and capacitor array
09/29/2010CN101449371B Resin-coated semiconductor device and electronic devices using the semiconductor device
09/29/2010CN101420168B Water cooling device used for current transformator power module
09/29/2010CN101416305B Over-molded semiconductor package with integrated through hole technology(THT) heat spreader pin(s)
09/29/2010CN101414601B Semiconductor encapsulation stacking combined construct for protecting welding spot between external pins
09/29/2010CN101373756B Test structure and method for sunken phenomena of metal procedure technique
09/29/2010CN101365317B Fixing construction and heat radiating device
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