Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2010
09/30/2010US20100244257 Method of fabricating semiconductor device and the semiconductor device
09/30/2010US20100244256 Semiconductor device and manufacturing method thereof
09/30/2010US20100244255 Wiring structures
09/30/2010US20100244254 Semiconductor device
09/30/2010US20100244253 Copper line having self-assembled monolayer for ulsi semiconductor devices, and a method of forming same
09/30/2010US20100244252 Self Forming Metal Fluoride Barriers for Fluorinated Low-K Dielectrics
09/30/2010US20100244251 Semiconductor device and method for fabricating the same
09/30/2010US20100244250 Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit
09/30/2010US20100244249 Semiconductor package
09/30/2010US20100244247 Via structure and via etching process of forming the same
09/30/2010US20100244246 Electronic component with mechanically decoupled ball connections
09/30/2010US20100244245 Filp Chip Interconnection Structure with Bump on Partial Pad and Method Thereof
09/30/2010US20100244244 Chip Having a Bump and Package Having the Same
09/30/2010US20100244243 Semiconductor device
09/30/2010US20100244242 Semiconductor device
09/30/2010US20100244241 Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier
09/30/2010US20100244240 Stackable electronic package and method of making same
09/30/2010US20100244239 Semiconductor Device and Method of Forming Enhanced UBM Structure for Improving Solder Joint Reliability
09/30/2010US20100244238 Semiconductor device
09/30/2010US20100244237 Semiconductor device and method for manufacturing the same
09/30/2010US20100244236 Integrated circuit packaging system with heat spreader and method of manufacture thereof
09/30/2010US20100244235 Integrated circuit package and method of making same
09/30/2010US20100244234 Semiconductor device and method of manufacturing same
09/30/2010US20100244233 Chip stack package and method of fabricating the same
09/30/2010US20100244232 Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof
09/30/2010US20100244231 Semiconductor device
09/30/2010US20100244230 Semiconductor device, electronic device, and manufacturing method of semiconductor device
09/30/2010US20100244229 Semiconductor package fabrication process and semiconductor package
09/30/2010US20100244228 Semiconductor device and method of manufacturing the same
09/30/2010US20100244227 Semiconductor packages and electronic systems including the same
09/30/2010US20100244226 Stackable electronic package and method of fabricating same
09/30/2010US20100244225 Stackable electronic pagkage and method of fabricating same
09/30/2010US20100244224 Semiconductor chip mounting body, method of manufacturing semiconductor chip mounting body and electronic device
09/30/2010US20100244223 Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof
09/30/2010US20100244222 Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof
09/30/2010US20100244221 Integrated circuit packaging system having dual sided connection and method of manufacture thereof
09/30/2010US20100244220 Layout structure and method of die
09/30/2010US20100244219 Integrated circuit packaging system with package stacking and method of manufacture thereof
09/30/2010US20100244218 Integrated circuit packaging system with multi-stacked flip chips and method of manufacture thereof
09/30/2010US20100244217 Integrated circuit packaging system with stacked configuration and method of manufacture thereof
09/30/2010US20100244215 Wireless ic device
09/30/2010US20100244214 Semiconductor device and method of manufacturing same
09/30/2010US20100244213 Semiconductor device and manufacturing method therefor
09/30/2010US20100244212 Integrated circuit packaging system with post type interconnector and method of manufacture thereof
09/30/2010US20100244211 Multichip discrete package
09/30/2010US20100244210 Lead frame and method for manufacturing circuit device using the same
09/30/2010US20100244209 Circuit device and method for manufacturing the same
09/30/2010US20100244208 Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die
09/30/2010US20100244207 Multiple thickness and/or composition high-k gate dielectrics and methods of making thereof
09/30/2010US20100244206 Method and structure for threshold voltage control and drive current improvement for high-k metal gate transistors
09/30/2010US20100244205 Glass Frits
09/30/2010US20100244204 Film forming method, film forming apparatus, storage medium and semiconductor device
09/30/2010US20100244202 Semiconductor device and fabrication method of the semiconductor device
09/30/2010US20100244201 Semiconductor device
09/30/2010US20100244200 Integrated circuit connecting structure having flexible layout
09/30/2010US20100244199 Semiconductor device and method for manufacturing semiconductor device
09/30/2010US20100244176 Integrated circuit having wiring structure, solid image pickup element having the wiring structure, and imaging device having the solid image pickup element
09/30/2010US20100244166 Multilayer wiring substrate, stack structure sensor package, and method of manufacturing stack structure sensor package
09/30/2010US20100244161 Wafer level packaging using flip chip mounting
09/30/2010US20100244159 Eutectic flow containment in a semiconductor fabrication process
09/30/2010US20100244146 Semiconductor device and method of manufacturing the same
09/30/2010US20100244144 Electrical fuse and related applications
09/30/2010US20100244137 Semiconductor device and a method of manufacturing the same
09/30/2010US20100244115 Anti-fuse memory cell
09/30/2010US20100244105 Transistors having temperature stable schottky contact metals
09/30/2010US20100244102 Integrated circuit device and method for forming the same
09/30/2010US20100244028 Test system and method of reducing damage in seed layers in metallization systems of semiconductor devices
09/30/2010US20100244026 Active device array substrate
09/30/2010US20100244024 Integrated circuit packaging system with interposer and method of manufacture thereof
09/30/2010US20100244023 Programmable resistance memory
09/30/2010US20100243990 Nanosensors
09/30/2010US20100243872 Semiconductor device
09/30/2010US20100243219 Heat dissipation device
09/30/2010US20100242270 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
09/30/2010DE202010005719U1 Chipkarte mit integriertem Schaltkreis Smart card integrated circuit
09/30/2010DE112006004164T5 Integriertes Halbleiter-Outline-Gehäuse Integrated semiconductor Outline housing
09/30/2010DE10228810B4 Mikrowellen-Schaltung mit beleuchteten Feldeffekt-Transistoren Microwave circuit with illuminated field effect transistors
09/30/2010DE102010008618A1 Halbleitervorrichtung Semiconductor device
09/30/2010DE102010001791A1 LED-assembly, has light emission opening unsealed by enclosing unit, and electro static discharging units formed in such manner such that discharging units made up of ceramic material form enclosing unit
09/30/2010DE102010001407A1 Integrierte Antennen auf Wafer-Ebene Built-in antennas at the wafer level
09/30/2010DE102010000539A1 Halbleiteranordnung Semiconductor device
09/30/2010DE102009024411A1 Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement Thin-film encapsulation for an optoelectronic component, to processes for its preparation and optoelectronic component
09/30/2010DE102009015307A1 Anordnung optoelektronischer Bauelemente Arrangement of optoelectronic components
09/30/2010DE102009013921B3 Verfahren zur Herstellung einer Metallisierung für mindestens ein Kontaktpad und Halbleiterwafer mit Metallisierung für mindestens ein Kontaktpad A method of producing a metallization for at least one contact pad and the semiconductor wafer having metallization for at least one contact pad
09/30/2010DE102009005458B4 Halbleiterbauelement mit Durchkontaktierung und Verfahren zu dessen Herstellung A semiconductor device having through-hole plating and process for its preparation
09/30/2010DE102009001932A1 Chipmodul und Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module,
09/30/2010DE102006033319B4 Verfahren zur Herstellung eines Halbleiterbauelements in Halbleiterchipgröße mit einem Halbleiterchip A process for producing a semiconductor device in the semiconductor chip size of a semiconductor chip
09/30/2010DE102006013853B4 Leistungshalbleiterbauelement mit großflächigen Außenkontakten sowie Verfahren zur Herstellung desselben Power semiconductor component thereof with outer contacts, as well as large-scale process for preparing
09/30/2010DE102006002753B4 Verfahren und Anordnung zur Bewertung der Unterätzung von tiefen Grabenstrukturen in SOI-Scheiben Method and apparatus for evaluating the undercutting of deep grave structures in SOI wafers
09/30/2010CA2756463A1 Slip chip device and methods
09/29/2010EP2234157A2 Semiconductor device
09/29/2010EP2234156A2 Power module and method for producing a fixed power module for high voltage applications
09/29/2010EP2234155A2 Method of fabricating a semiconductor device
09/29/2010EP2234154A2 Coolant cooled type semiconductor device
09/29/2010EP2234153A1 Liquid-cooled cooling device
09/29/2010EP2234152A2 Heat-dissipating device including a plating metal layer
09/29/2010EP2234151A1 Semiconductor device
09/29/2010EP2234147A2 Method of fabricating resin-sealed semiconductor devices
09/29/2010EP2233212A1 Electrostatic atomization device
09/29/2010EP2232552A1 Chip identification using top metal layer
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