Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2010
10/05/2010US7808095 Ultra slim semiconductor package and method of fabricating the same
10/05/2010US7808094 Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips
10/05/2010US7808093 Stacked semiconductor device
10/05/2010US7808092 Semiconductor device with a plurality of ground planes
10/05/2010US7808091 Wafer structure with discrete gettering material
10/05/2010US7808090 Wireless chip
10/05/2010US7808089 Leadframe having die attach pad with delamination and crack-arresting features
10/05/2010US7808088 Semiconductor device with improved high current performance
10/05/2010US7808087 Leadframe IC packages having top and bottom integrated heat spreaders
10/05/2010US7808086 Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof
10/05/2010US7808085 Semiconductor device and mold for resin-molding semiconductor device
10/05/2010US7808084 Semiconductor package with half-etched locking features
10/05/2010US7808083 Semiconductor device
10/05/2010US7808079 Circuit arrangement and integrated circuit
10/05/2010US7808077 Semiconductor device and method for fabricating the same
10/05/2010US7808075 Integrated circuit devices with ESD and I/O protection
10/05/2010US7808074 Advanced leadframe having predefined bases for attaching passive components
10/05/2010US7808073 Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
10/05/2010US7808072 Circuit board having conductive shield member and semiconductor package using the same
10/05/2010US7808064 Semiconductor package including through-hole electrode and light-transmitting substrate
10/05/2010US7808048 System and method for providing a buried thin film resistor having end caps defined by a dielectric mask
10/05/2010US7808047 I/O ESD protection device for high performance circuits
10/05/2010US7808046 Electrostatic protection device for semiconductor circuit
10/05/2010US7808045 Semiconductor device and semiconductor integrated circuit using the same
10/05/2010US7808013 Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
10/05/2010US7807998 Evaluation pattern suitable for evaluation of lateral hillock formation
10/05/2010US7807997 Test element group (TEG) system for measurement of SOI-MOSFET without a body contact comprising first and second TEGs of unequal gate electrode areas
10/05/2010US7807996 Test pattern of CMOS image sensor and method of measuring process management using the same
10/05/2010US7807934 Printed circuit board having protection means and a method of use thereof
10/05/2010US7807931 Electrical component on a substrate and method for production thereof
10/05/2010US7807575 Methods to reduce the critical dimension of semiconductor devices
10/05/2010US7807571 Semiconductor device and methods of forming the same
10/05/2010US7807569 Method of manufacturing a contact structure for a semiconductor device
10/05/2010US7807567 Semiconductor device with interconnection structure for reducing stress migration
10/05/2010US7807565 Method of forming bit line of flash memory device
10/05/2010US7807563 Method for manufacturing a layer arrangement and layer arrangement
10/05/2010US7807547 Wafer bonding material with embedded rigid particles
10/05/2010US7807510 Method of manufacturing chip integrated substrate
10/05/2010US7807503 Die-wafer package and method of fabricating same
10/05/2010US7807481 Method of semiconductor device protection, package of semiconductor device
10/05/2010US7807337 Forming mold layer comprising hole arrays exposing seed layer;forming conductive patterns from seed layer to fill hole arrays; forming conductive line by growing; system-on-a-chip; electrolytic or electroless plating; adjusting height of conductive lines; helices; diffusion prevention layer
10/05/2010US7807073 Wiring parts are formed by utilizing such a conductor formulation, ensure the conductivity at the same level as an Ag bulk by a low temperature treatment
10/05/2010US7806994 bonding an electronic device to a substrate; forming high-strength joints by soldering; low temperature melting
10/05/2010US7806168 Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
09/2010
09/30/2010WO2010111265A1 Slip chip device and methods
09/30/2010WO2010111081A1 Interconnect structure for a semiconductor device with a resilient stress absorber and related method of manufacture
09/30/2010WO2010110790A1 Grid heat sink
09/30/2010WO2010110572A2 Light-emitting diode package
09/30/2010WO2010110445A1 Semiconductor device, and apparatus and method for manufacturing semiconductor device
09/30/2010WO2010110281A1 Heatsink-combined package and method for manufacturing same
09/30/2010WO2010110233A1 Semiconductor wafer and semiconductor device manufacturing method
09/30/2010WO2010110179A1 Active element substrate and manufacturing method thereof, and display apparatus using active element substrate manufactured by this manufacturing method
09/30/2010WO2010109985A1 Method for manufacturing electronic component
09/30/2010WO2010109960A1 Aluminum nitride substrate, aluminum nitride circuit board, semiconductor device, and method for manufacturing aluminum nitride substrate
09/30/2010WO2010109824A1 Method of producing semiconductor device
09/30/2010WO2010109801A1 Light emitting diode, method for manufacturing same, and lamp
09/30/2010WO2010109799A1 Heat sink
09/30/2010WO2010109788A1 Semiconductor element substrate, method for manufacturing same, and semiconductor device
09/30/2010WO2010109746A1 Semiconductor device and method for manufacturing same
09/30/2010WO2010109703A1 Electronic device, substrate, and method for manufacturing electronic device
09/30/2010WO2010108812A1 Esd network circuit with a through wafer via structure and a method of manufacture
09/30/2010WO2010108362A1 Heat dissipating structure with heat conducting and heat dissipating ink layer
09/30/2010WO2010090827A3 Semiconductor die package and method for making the same
09/30/2010WO2010083268A3 Heat sink with helical fins and electrostatic augmentation
09/30/2010US20100249160 Cancer Treatment Method
09/30/2010US20100246153 Flip-chip fet cell
09/30/2010US20100246140 Circuit Board and Method for Manufacturing Semiconductor Modules and Circuit Boards
09/30/2010US20100246133 Method and apparatus for distributing a thermal interface material
09/30/2010US20100245012 Integrated Spiral Inductor
09/30/2010US20100244288 Method and apparatus for fabricating semiconductor chips using varying areas of precision
09/30/2010US20100244287 Method of measurement in semiconductor fabrication
09/30/2010US20100244286 Nanocomposites for optoelectronic devices
09/30/2010US20100244285 Semiconductor device and method of manufacturing the same
09/30/2010US20100244284 Method for ultra thin wafer handling and processing
09/30/2010US20100244283 Method of joining electronic component and the electronic component
09/30/2010US20100244282 Assembly of electronic components
09/30/2010US20100244281 Flexible printed wiring board and semiconductor device employing the same
09/30/2010US20100244280 Method of manufacturing semiconductor package and semiconductor package
09/30/2010US20100244279 Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same
09/30/2010US20100244278 Stacked multichip package
09/30/2010US20100244277 Integrated circuit packaging system with package underfill and method of manufacture thereof
09/30/2010US20100244276 Three-dimensional electronics package
09/30/2010US20100244275 Contact structure for an electronic circuit substrate and electronic circuit comprising said contact structure
09/30/2010US20100244274 Wiring board
09/30/2010US20100244273 Integrated circuit package system with multiple device units and method for manufacturing thereof
09/30/2010US20100244272 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
09/30/2010US20100244271 Semiconductor device and manufacturing method thereof
09/30/2010US20100244270 Manufacturing method of semiconductor device and semiconductor device
09/30/2010US20100244269 Semiconductor device having integral structure of contact pad and conductive line
09/30/2010US20100244268 Apparatus, system, and method for wireless connection in integrated circuit packages
09/30/2010US20100244267 Interconnect structure for a semiconductor device and related method of manufacture
09/30/2010US20100244266 Metallic bonding structure for copper and solder
09/30/2010US20100244265 Semiconductor device and method for manufacturing the same
09/30/2010US20100244264 Semiconductor device
09/30/2010US20100244263 Chip packages
09/30/2010US20100244262 Deposition method and a deposition apparatus of fine particles, a forming method and a forming apparatus of carbon nanotubes, and a semiconductor device and a manufacturing method of the same
09/30/2010US20100244261 Through-hole contacts in a semiconductor device
09/30/2010US20100244260 Semiconductor device and method for fabricating the same
09/30/2010US20100244259 Substrate and manufacturing method therefor
09/30/2010US20100244258 Substrate and manufacturing method therefor
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