Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2010
10/06/2010CN101854791A Heat sink assembly
10/06/2010CN101854790A Cooling device
10/06/2010CN101854771A Printed wiring board
10/06/2010CN101853876A Active matrix/organic light emitting diode (AMOLED) panel structure
10/06/2010CN101853863A Image module and manufacturing method thereof
10/06/2010CN101853859A Display substrate and production method thereof
10/06/2010CN101853855A Silicon wafer with perforating holes and manufacturing method thereof
10/06/2010CN101853852A Groove MOS (Metal Oxide Semiconductor) device integrating Schottky diodes in unit cell and manufacture method
10/06/2010CN101853846A Semiconductor module and camera module mounting said semiconductor module
10/06/2010CN101853845A Multichip stacking encapsulation
10/06/2010CN101853844A High-voltage-resistant electrostatic discharge (ESD) protection device and system and corresponding production method thereof
10/06/2010CN101853843A Structure for testing integrality of gate oxide of semiconductor part
10/06/2010CN101853842A Package structure for chip and method for forming the same
10/06/2010CN101853841A Device mounting board and method of manufacturing the board, semiconductor module and method of manufacturing the module
10/06/2010CN101853840A Structure of embedded line substrate and manufacturing method thereof
10/06/2010CN101853839A Substrate with windowing ball grid array packaging structure
10/06/2010CN101853838A Substrate with window ballgrid array packaging structure
10/06/2010CN101853837A Circuit substrate
10/06/2010CN101853836A Silicon wafer with internally connecting metals
10/06/2010CN101853835A Flip chip package and manufacturing method thereof
10/06/2010CN101853834A Submerged basic island, embedded basic island lead frame structure and first-etching last-plating method thereof
10/06/2010CN101853833A Embedded basic island and multi-convex point basic island lead framework and first-etching last-plating method thereof
10/06/2010CN101853832A Base island exposed type and embedded type base island lead frame structure and first-engraving last-plating method thereof
10/06/2010CN101853831A Semiconductor device and manufacturing method therefor
10/06/2010CN101853830A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/06/2010CN101853829A Semiconductor structure and manufacturing method thereof
10/06/2010CN101853828A Chip with convex block and packaging structure of chip with convex block
10/06/2010CN101853827A Multilayer wiring substrate, stack structure sensor package, and method of manufacturing stack structure sensor package
10/06/2010CN101853826A Connection member and printed circuit board unit
10/06/2010CN101853825A Multi-load topology framework
10/06/2010CN101853824A Array substrate and manufacturing method thereof
10/06/2010CN101853823A Heat sink and manufacturing method thereof
10/06/2010CN101853822A Novel heat sink and production method thereof
10/06/2010CN101853821A Cooling method of power-type diode and special cooling fin
10/06/2010CN101853820A Electronic device
10/06/2010CN101853819A Chip structure, wafer structure and chip fabrication technique
10/06/2010CN101853818A Packaging substrate structure with recess and manufacturing method thereof
10/06/2010CN101853817A 封装结构及其制造方法 Package structure and method for manufacturing
10/06/2010CN101853816A Group III nitride semiconductor composite substrate, group III nitride semiconductor substrate, and group III nitride semiconductor composite substrate manufacturing method
10/06/2010CN101853810A Electronic device with polymer light-emitting diode and manufacturing method thereof
10/06/2010CN101853806A Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced by method
10/06/2010CN101853805A Method of reducing W loss effect and semiconductor structure
10/06/2010CN101853802A Method of measurement in semiconductor fabrication
10/06/2010CN101853798A High voltage sensor device and method therefor
10/06/2010CN101853792A Manufacturing method of semiconductor device and semiconductor device
10/06/2010CN101853791A Manufacturing method and structure of flip chip package as well as structure of wafer coating
10/06/2010CN101853782A Copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same
10/06/2010CN101853058A Radiator of main board
10/06/2010CN101853057A Main board
10/06/2010CN101852976A Projection apparatus
10/06/2010CN101852957A Active element array substrate
10/06/2010CN101852564A Cooling device
10/06/2010CN101852347A Illumination device
10/06/2010CN101851411A Curable resin composition
10/06/2010CN101851386A Epoxy resin compound
10/06/2010CN101532656B High-power LED street lamp
10/06/2010CN101466856B Copper alloy sheets for electrical/electronic part
10/06/2010CN101459159B 半导体器件 Semiconductor devices
10/06/2010CN101431079B Nonvolatile semiconductor memory device
10/06/2010CN101378066B Nand type nonvolatile semiconductor memory device
10/06/2010CN101360386B Circuit board binding glue layer and circuit board comprising the glue layer
10/06/2010CN101336475B Electronic device and method for constituting electronic device
10/06/2010CN101335292B Luminous element panel
10/06/2010CN101315926B Semiconductor device and method of manufacturing the same
10/06/2010CN101304649B Radiating device and fan fixing rack thereof
10/06/2010CN101252089B Method for hot cooling microelectron chip using micro vapor bubble spray
10/06/2010CN101236953B Thin film transistor array base plate and its making method
10/06/2010CN101203956B Power supply unit of integrated circuit
10/06/2010CN101188235B Layered integrated circuit memory
10/06/2010CN101179055B Semi-conductor power module and dissipating heat method thereof
10/06/2010CN101174607B Fuse structures and integrated circuit devices
10/06/2010CN101091246B Microelectronic assembly with built-in thermoelectric cooler and method of fabricating same
10/06/2010CN101090620B Heat sink module
10/06/2010CN101060112B Baseplate alignment system and its alignment method
10/06/2010CN101015050B Method for manufacturing semiconductor device and semiconductor device manufactured by such method
10/06/2010CN101009263B Printed circuit board for semiconductor package and method of manufacturing the same
10/05/2010US7808791 Fastener and heat sink assembly having the same
10/05/2010US7808789 Structure and method to form a heat sink
10/05/2010US7808788 Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
10/05/2010US7808599 Flat display module
10/05/2010US7808264 Isolated conductive leads extending across to opposite sides of IC
10/05/2010US7808248 Radio frequency test key structure
10/05/2010US7808117 Integrated circuit having pads and input/output (I/O) cells
10/05/2010US7808116 Semiconductor device and wire bonding method
10/05/2010US7808115 Test circuit under pad
10/05/2010US7808114 Circuit device and method of manufacturing thereof
10/05/2010US7808112 Wafer level pre-packaged flip chip system
10/05/2010US7808111 Processed wafer via
10/05/2010US7808109 Fretting and whisker resistant coating system and method
10/05/2010US7808107 Semiconductor integrated circuit device
10/05/2010US7808106 Nano-laminate difussion barrier for direct electrochemical deposition copper
10/05/2010US7808105 Semiconductor package and fabricating method thereof
10/05/2010US7808104 Substrate for mounting electronic component and electronic apparatus including the substrate
10/05/2010US7808103 Leadless package
10/05/2010US7808101 3D smart power module
10/05/2010US7808100 Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element
10/05/2010US7808099 Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method
10/05/2010US7808098 Semiconductor device and manufacturing method thereof
10/05/2010US7808097 Low temperature co-fired ceramic (LTCC) tape compositions, light-emitting diode (LED) modules, lighting devices and methods of forming thereof
10/05/2010US7808096 Semiconductor package and production method thereof, and semiconductor device
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