Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2010
10/07/2010US20100255639 Method of manufacturing a semiconductor device including plural semiconductor chips
10/07/2010US20100254099 Silicon-ceramic composite substrate
10/07/2010US20100254095 Microelectronic security coatings
10/07/2010US20100253372 Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization
10/07/2010US20100252940 Polyimide shield and integrated circuit structure having the same
10/07/2010US20100252939 Chip module and method for producing a chip module
10/07/2010US20100252938 Semiconductor package
10/07/2010US20100252937 Electronic device and method of manufacturing same
10/07/2010US20100252936 Semiconductor module and portable devices
10/07/2010US20100252935 Semiconductor device and method for fabricating the same
10/07/2010US20100252934 Three-Dimensional Semiconductor Architecture
10/07/2010US20100252933 Semiconductor device
10/07/2010US20100252932 Sensor device and method of manufacturing the sensor device
10/07/2010US20100252931 Flash memory storage apparatus
10/07/2010US20100252930 Method for Improving Performance of Etch Stop Layer
10/07/2010US20100252929 Group ii element alloys for protecting metal interconnects
10/07/2010US20100252928 Semiconductor device and method for manufacturing semiconductor device
10/07/2010US20100252926 Semiconductor Element, Method for Manufacturing the Same, and Mounting Structure Having the Semiconductor Element Mounted Thereon
10/07/2010US20100252925 Semiconductor device
10/07/2010US20100252924 Semiconductor device and a method of manufacturing the same
10/07/2010US20100252923 Semiconductor device and method of manufacturing same
10/07/2010US20100252922 Power Semiconductor Module, Power Semiconductor Module Assembly and Method for Fabricating a Power Semiconductor Module Assembly
10/07/2010US20100252921 Semiconductor device and manufacturing method of the same
10/07/2010US20100252920 Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates
10/07/2010US20100252919 Electronic device and method of packaging an electronic device
10/07/2010US20100252918 Multi-die package with improved heat dissipation
10/07/2010US20100252917 Carbosilane polymer compositions for anti-reflective coatings
10/07/2010US20100252916 Structure for improving die saw quality
10/07/2010US20100252912 Semiconductor device, and method of manufacturing the same
10/07/2010US20100252908 Electrically alterable circuit for use in an integrated circuit device
10/07/2010US20100252907 Shallow Trench Isolation Dummy Pattern and Layout Method Using the Same
10/07/2010US20100252896 Methods, Structures, and Designs for Self-Aligning Local Interconnects used in Integrated Circuits
10/07/2010US20100252830 Semiconductor device and manufacturing method thereof
10/07/2010US20100252829 Semiconductor device, circuit substrate, electro-optic device and electronic apparatus
10/07/2010US20100252828 Semiconductor device comprising a chip internal electrical test structure allowing electrical measurements during the fabrication process
10/07/2010DE202010009892U1 Miniaturisierter Vapor-Chamber Miniaturized Vapor-Chamber
10/07/2010DE202010007803U1 Kühlkörper Heat Sink
10/07/2010DE19580514B4 Halbleiterbauelement mit einer umgreifenden Flanschverbindung und Verfahren zu dessen Herstellung A semiconductor device with a flange which surrounds and process for its preparation
10/07/2010DE10219346B4 Verfahren zum Abbilden und Zuordnen von Eigenschaften von einer Mehrzahl auf einem Wafer angeordneter Funktionschips und Wafer mit einer Mehrzahl von Funktionschips und Referenzchips A method for imaging and mapping a plurality of features arranged on a wafer function chips and wafers with a plurality of function chips and reference chips
10/07/2010DE102009040444A1 Leistungsmodul Power module
10/07/2010DE102009029281A1 Module, particularly sensor module, is provided with component and connecting element, where component is connected to another component in electrically conductive manner
10/07/2010DE102009015963A1 Optoelektronisches Bauelement Optoelectronic component
10/07/2010DE102009015237A1 Water guiding cooling system for cooling computer, has flowing unit comprising radially aligned outlet within area of end away from inlet, and expansion tank that is connected with line exhausting water by connection
10/07/2010DE102009014993A1 Method for electrically connection of piezoelectric stack in injection valve of engine of motor vehicle, involves providing stack peripheral regions with sacrificial layer and completely removing sacrificial layer
10/07/2010DE102009002191A1 Leistungshalbleitermodul, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung The power semiconductor module, the power semiconductor module assembly and method of manufacturing a power semiconductor module assembly
10/07/2010DE102009002100A1 Electrical component e.g. press-fit diode, for motor vehicle generator system, has stress-reducing material reducing effect of expansion-or upsetting force on semiconductor substrate by compound layer
10/07/2010DE102009000884B3 Halbleitermodul mit Gehäuse aus präkeramischem Polymer Semiconductor module with housing made of preceramic polymer
10/07/2010DE102008034448B4 Verfahren zur Bestimmung der Justagegenauigkeit beim Waferbonden Method for determining the alignment accuracy for wafer bonding
10/07/2010DE102006025365B4 Teststruktur zum Abschätzen von Elektromigrationseffekten, die durch poröse Barrierenmaterialien hervorgerufen werden Test structure for estimating electromigration effects, which are caused by porous barrier materials
10/07/2010DE102005017538B4 Anordnung und Verfahren zur Temperaturkompensation eines Widerstands Apparatus and method for temperature compensation for a resistance
10/07/2010DE10163429B4 HF-Schaltungschip und Herstellungsverfahren davon RF circuit die and production method thereof
10/06/2010EP2237631A1 Mobile station supervision of the forward dedicated control channel when in the discontinuous transmission mode
10/06/2010EP2237319A2 Seminconductor device and power converter using the same
10/06/2010EP2237316A1 Connection terminal, package using the same and electronic device
10/06/2010EP2237313A1 Electronic member wherein barrier-seed layer is formed on base
10/06/2010EP2237312A1 Electronic member wherein barrier-seed layer is formed on base
10/06/2010EP2237005A1 Bolometer pixel having a MIM-type integration capacitor
10/06/2010EP2236560A1 Poly(arylene sulfide) resin composition, process for production thereof, and surface mount electronic component
10/06/2010EP2235751A1 Flexible contactless wire bonding structure anad methodology for semiconductor device
10/06/2010EP2235750A1 Contact structure for an electronic circuit substrate and electronic circuit comprising said contact structure
10/06/2010EP2235749A1 Method of coating fine wires and curable composition therefor
10/06/2010EP2235747A1 In-situ cavity integrated circuit package
10/06/2010EP2235667A1 Manufacture of a smart card
10/06/2010EP2235592A2 Lithography robustness monitor
10/06/2010EP1652198B1 Compact impedance transformation circuit
10/06/2010EP1647051B1 Semiconductor power module with strip conductors which are detached from a substrate as external connections
10/06/2010CN201601937U 散热装置固定座结构及其运算处理模组 The heat sink structure and arithmetic processing module mounts
10/06/2010CN201601889U 电路板组合 Circuit board assembly
10/06/2010CN201601487U 贴片式块状浪涌保护器 SMD massive surge protector
10/06/2010CN201601129U 用于倒装芯片和贴装无源元件的带金属球焊盘的载板芯片 For flip-chip passive components and mounting pads with metal ball carrier board chip
10/06/2010CN201601128U 在载板芯片上倒装芯片的系统及封装结构 On-chip system and carrier board flip-chip package structure
10/06/2010CN201601127U 一种sot26-3l封装的引线框架结构 A lead frame structure for a package sot26-3l
10/06/2010CN201601126U 一种贴片式固体放电管 A patch-type solid discharge
10/06/2010CN201601125U 厚膜集成电路封装件 Thick film integrated circuit packages
10/06/2010CN201601124U 用于倒装芯片和贴装无源元件的带金属凸块焊盘的载板芯片 For flip chip and mount passive components with metal bump chip carrier board pads
10/06/2010CN201601123U 带金属凸块焊盘的载板芯片 Chip carrier board with metal bump pad
10/06/2010CN201601122U 散热装置 Cooling devices
10/06/2010CN201601121U 一种半导体散热装置 A semiconductor cooling devices
10/06/2010CN201601120U 抗高温整流芯片 High-temperature rectification chip
10/06/2010CN201601114U 半导体封装产品打印防反装置 Semiconductor packaging products printing anti-anti device
10/06/2010CN201599740U 灯具模组之散热结构 Thermal structure of the lamp module
10/06/2010CN201599728U 采用二级散热且亮度增强的led照明灯 Using two heat and brightness enhancement of led lighting
10/06/2010CN201599654U 利用均温板散热的led路灯装置 Average temperature plate heat utilization equipment led lights
10/06/2010CN201599644U 道路照明灯 Road lighting
10/06/2010CN201599584U 发光二极管照明装置 LED illumination apparatus
10/06/2010CN1917203B Power semiconductor module with wiring element
10/06/2010CN1914968B Method and system for cooling high power density devices
10/06/2010CN1906462B Angular speed measuring equipment
10/06/2010CN1900725B Lithographic contact elements
10/06/2010CN1885649B Sheet metal frame cabinet for installing frame or cabinet and method for installing frame or cabinet
10/06/2010CN1837284B Epoxy-organosilicon mixed resin composition and method for preparing same, and light-emitting semiconductor device
10/06/2010CN1812087B Battery protection ic chip
10/06/2010CN1689934B Film for protecting mother glass for flat panel display and use thereof
10/06/2010CN1684244B Method of manufacturing a semiconductor device having damascene structures with air gaps
10/06/2010CN1671273B Device with through-hole interconnection and method for manufacturing the same
10/06/2010CN101855723A Power semiconductor module
10/06/2010CN101855722A Heat sink
10/06/2010CN101855596A Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
10/06/2010CN101855074A Polymer-ceramic composites with excellent TCC
10/06/2010CN101854792A Cooling device
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