Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2010
10/13/2010CN101207107B Semiconductor device and method of manufacturing the same
10/13/2010CN101207101B Pattern shielding structure for dry etching and method thereof
10/13/2010CN101192601B Illumination device with semiconductor light-emitting elements
10/13/2010CN101192544B Semiconductor component buried loading plate splicing structure and its manufacture method
10/13/2010CN101150126B ESD protection apparatus and circuit thereof
10/13/2010CN101136413B Thin film transistor array panel and method of manufacturing the same
10/13/2010CN101101913B Thin film transistor array
10/13/2010CN101101272B Biochemical microsensing integrated chip, its manufacture and mould preparation method
10/13/2010CN101093830B Semiconductor device having symbol pattern utilized as identification sign and its manufacture method
10/13/2010CN101090109B Power semiconductor module with connection elements electrically insulated from one another
10/13/2010CN101086975B Sensing mechanism for crystal orientation indication mark of semiconductor wafer
10/13/2010CN101047063B Capacitor structure
10/13/2010CN101043049B Layer-stacked wiring and semiconductor device using same and method for manufacturing semiconductor device
10/13/2010CN101009272B Cooling apparatus for memory module
10/12/2010US7813616 Semiconductor device with dummy electrode
10/12/2010US7813135 Semiconductor device
10/12/2010US7813131 Modular outdoor LED power supply
10/12/2010US7812465 Semiconductor chip having alignment mark and method of manufacturing the same
10/12/2010US7812464 Semiconductor device and a method of manufacturing for high output MOSFET
10/12/2010US7812463 Packaging integrated circuits for high stress environments
10/12/2010US7812462 Conductive paths for transmitting an electrical signal through an electrical connector
10/12/2010US7812461 Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
10/12/2010US7812460 Packaging substrate and method for fabricating the same
10/12/2010US7812459 Three-dimensional integrated circuits with protection layers
10/12/2010US7812458 Pad invariant FPGA and ASIC devices
10/12/2010US7812457 Semiconductor device and semiconductor wafer and a method for manufacturing the same
10/12/2010US7812456 Semiconductor device and a method of manufacturing the same
10/12/2010US7812455 Interconnect in low-k interlayer dielectrics
10/12/2010US7812454 Semiconductor structure and method of manufacture
10/12/2010US7812453 Semiconductor device
10/12/2010US7812452 Semiconductor device having barrier layer comprised of dissimilar materials, and method for fabricating the same
10/12/2010US7812451 Semiconductor device and method of manufacturing the same
10/12/2010US7812450 Electrode with nano-sized structures
10/12/2010US7812449 Integrated circuit package system with redistribution layer
10/12/2010US7812448 Electronic device including a conductive stud over a bonding pad region
10/12/2010US7812447 Wafer level pre-packaged flip chip
10/12/2010US7812446 Semiconductor device
10/12/2010US7812445 Semiconductor memory module having an oblique memory chip
10/12/2010US7812444 Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein
10/12/2010US7812443 Power semiconductor module for inverter circuit system
10/12/2010US7812442 High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same
10/12/2010US7812441 Schottky diode with improved surge capability
10/12/2010US7812440 Electronic package device, module, and electronic apparatus
10/12/2010US7812439 Semiconductor package with reduced length interconnect and manufacturing method thereof
10/12/2010US7812438 Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging
10/12/2010US7812437 Flip chip MLP with folded heat sink
10/12/2010US7812436 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
10/12/2010US7812435 Integrated circuit package-in-package system with side-by-side and offset stacking
10/12/2010US7812434 Wafer level package with die receiving through-hole and method of the same
10/12/2010US7812433 Package structure and electronic device using the same
10/12/2010US7812432 Chip package with a dam structure on a die pad
10/12/2010US7812431 Leadframe with die pad and leads corresponding thereto
10/12/2010US7812430 Leadframe and semiconductor package having downset baffle paddles
10/12/2010US7812429 Semiconductor device and manufacturing method of the same
10/12/2010US7812428 Secure connector grid array package
10/12/2010US7812400 Gate strip with reduced thickness
10/12/2010US7812399 Semiconductor device comprising multi-layer rectangular gate electrode surrounded on four sides by sidewall spacer and implantation regions
10/12/2010US7812396 Semiconductor device with channel layer comprising different types of impurities
10/12/2010US7812395 Semiconductor-on-diamond devices and methods of forming
10/12/2010US7812393 High-voltage extended drain MOSFET
10/12/2010US7812386 Semiconductor memory device including multi-layer gate structure
10/12/2010US7812367 Two terminal low capacitance multi-channel ESD device
10/12/2010US7812347 Integrated circuit and methods of measurement and preparation of measurement structure
10/12/2010US7812265 Semiconductor package, printed circuit board, and electronic device
10/12/2010US7812264 Functional element-mounted module and a method for producing the same
10/12/2010US7811944 Semiconductor device and a method of manufacture therefor
10/12/2010US7811903 Thin flip-chip method
10/12/2010US7811899 Method for laminating substrate and apparatus using the method
10/12/2010US7811860 Method for producing a device and device
10/12/2010US7811855 Method for producing a matrix for detecting electromagnetic radiation and method for replacing an elementary module of such a detection matrix
10/12/2010CA2408262C Electronic power module
10/07/2010WO2010114944A2 Material for packaging electronic components
10/07/2010WO2010114798A1 Chip packages
10/07/2010WO2010114739A2 Electrically alterable circuit for use in an integrated circuit device
10/07/2010WO2010114166A1 Flame-retardant phosphorus-containing epoxy resin composition and cured product thereof
10/07/2010WO2010114126A1 Sintered ceramic and substrate comprising same for semiconductor device
10/07/2010WO2010114115A1 Package member assembly, method for manufacturing package member assembly, package member, and method for manufacturing piezoelectric vibration device using package member
10/07/2010WO2010114079A1 Circuit board, high frequency module, and radar apparatus
10/07/2010WO2010113892A1 Process for producing metallized substrate and metallized substrate
10/07/2010WO2010113779A1 Semiconductor device
10/07/2010WO2010113759A1 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same
10/07/2010WO2010113687A1 High-frequency module having shield and heat-releasing properties and method for manufacturing same
10/07/2010WO2010113584A1 Semiconductor device and method for manufacturing same
10/07/2010WO2010113539A1 Circuit board
10/07/2010WO2010113448A1 Manufacturing method for circuit board, and circuit board
10/07/2010WO2010113375A1 Semiconductor device and method for manufacturing same
10/07/2010WO2010113369A1 Method for manufacturing semiconductor device
10/07/2010WO2010113120A1 An integrated circuit system with a thermally isolating frame construction and method for producing such integrated circuit system
10/07/2010WO2010112983A1 Wire-bonded semiconductor package with a coated wire
10/07/2010WO2010112676A1 A casing of a sensor measuring oscillations, and a sensor for measuring oscillations
10/07/2010WO2010112654A1 Heat exchanger
10/07/2010WO2010112478A2 Pressure support for an electronic circuit
10/07/2010WO2010112000A1 Metal/ceramic substrate
10/07/2010WO2010111921A1 Epoxy resin composition
10/07/2010WO2010111825A1 Electronic package and method of fabrication thereof
10/07/2010WO2010092042A3 Silicon-based sub-mount for an opto-electronic device
10/07/2010WO2010005592A3 Microelectronic interconnect element with decreased conductor spacing
10/07/2010US20100256472 Analyte Monitoring Device and Methods of Use
10/07/2010US20100256471 Analyte Monitoring Device and Methods of Use
10/07/2010US20100255691 Cww3 connectors with wipe
1 ... 587 588 589 590 591 592 593 594 595 596 597 598 599 600 601 602 603 604 605 606 607 ... 2262