Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2010
10/13/2010CN1953157B Electron interconnection and its making method
10/13/2010CN1812088B Multi-level semiconductor module and method for fabricating the same
10/13/2010CN1795368B Device for sensor and method for manufacturing device for sensor
10/13/2010CN1732291B Lead free bump and method of forming the same
10/13/2010CN1720610B Thin CaAs die with copper back-metal structure
10/13/2010CN1716595B Semiconductor device manufacturing method
10/13/2010CN1711639B Folded-flex bondwire-less multichip power package
10/13/2010CN1701613B Packaged RF power transistor having RF bypassing/output matching network
10/13/2010CN101861648A Semiconductor power device package having a lead frame-based integrated inductor
10/13/2010CN101861647A Process for producing substrate for power module, substrate for power module, and power module
10/13/2010CN101861646A Stack packages using reconstituted wafers
10/13/2010CN101861645A Integrated circuit system with contact integration
10/13/2010CN101861083A Heat radiating device
10/13/2010CN101861082A Heat radiating device
10/13/2010CN101861081A Heat radiating device
10/13/2010CN101861080A Heat radiating device
10/13/2010CN101861079A Heat radiating device
10/13/2010CN101861078A Heat sink and manufacturing method thereof
10/13/2010CN101861076A Heat radiating device
10/13/2010CN101861075A Heat radiating device
10/13/2010CN101861074A Heat radiating device
10/13/2010CN101861073A Radiator and manufacturing method thereof
10/13/2010CN101861072A Heat radiating device
10/13/2010CN101859832A Anti-surge and electrostatic protection flip chip light-emitting diode sealing structure
10/13/2010CN101859831A Surge-resisting and anti-static light-emitting diode and manufacturing method thereof
10/13/2010CN101859790A Solid crystal illuminating device having insulating layer and manufacturing method thereof
10/13/2010CN101859786A 图像传感器模块 The image sensor module
10/13/2010CN101859784A Photosensitive element, driving method thereof and liquid crystal display using photosensitive element
10/13/2010CN101859778A Nonvolatile memory devices
10/13/2010CN101859768A High-voltage resistant electrostatic discharge protection device suitable for sub-deep nanometer process and application thereof
10/13/2010CN101859767A High-voltage electrostatic protection device for full silicon metallizing process and corresponding production method thereof
10/13/2010CN101859766A Novel NMOS (N-channel Metal Oxide Semiconductor) clamping between power VDD (Voltage Drain Drain) and IO (Input/Output) pin and application method thereof
10/13/2010CN101859765A Protective device for integrated circuit
10/13/2010CN101859762A Three-dimensional semiconductor architecture
10/13/2010CN101859760A Packaging structure of surface-mount device infrared receiver
10/13/2010CN101859755A Power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) package body and package method thereof
10/13/2010CN101859754A Electronic control unit and method of manufacturing the same
10/13/2010CN101859753A High-performance semiconductor with connection device and internal auxiliary connection elements designed as contact springs
10/13/2010CN101859752A Stacking package structure with chip embedded inside and die having through silicon via and method of the same
10/13/2010CN101859751A Ceramic composite substrate
10/13/2010CN101859750A Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates
10/13/2010CN101859749A Function conversion template welding structure of ball grid array device and preparation method thereof
10/13/2010CN101859748A Solder pad and packaging structure applying same
10/13/2010CN101859747A Baseplate structure
10/13/2010CN101859746A Conductive substrate structure for forming conductive channel by two-sided cutting and manufacturing method thereof
10/13/2010CN101859745A Stacked semiconductor package
10/13/2010CN101859744A Exposed die pad package with power ring
10/13/2010CN101859743A Device mounting structure, method of mounting device, liquid-jet head, connector, and semiconductor device
10/13/2010CN101859742A Device mounting structure, method of mounting device, liquid-jet head, connector, and semiconductor device
10/13/2010CN101859741A Device mounting structure, method of mounting device, liquid-jet head, connector, and semiconductor device
10/13/2010CN101859740A Advanced quad flat non-leaded package and manufacturing method thereof
10/13/2010CN101859739A Heat radiation module set
10/13/2010CN101859738A Large-area liquid-cooled heat dissipation device
10/13/2010CN101859737A Radiating fin and semiconductor packaging structure
10/13/2010CN101859736A Semiconductor packaging semi-finished product and semiconductor packaging process
10/13/2010CN101859735A Electrical component
10/13/2010CN101859734A Lead frame, manufacturing method thereof, and manufacturing method for package structure
10/13/2010CN101859733A Semiconductor packaging structure, support plate for same, and manufacture method thereof
10/13/2010CN101859727A Interconnect structure
10/13/2010CN101859716A Semiconductor device and method for fabricating the same
10/13/2010CN101859713A Manufacturing method of advanced quad flat non-leaded package
10/13/2010CN101859712A Hybrid loader and manufacturing method thereof
10/13/2010CN101859701A Substrate for semiconductor device, semiconductor device and manufacturing method thereof
10/13/2010CN101859690A Packaging structure, sealing compound module and sealing compound mold for packaging same
10/13/2010CN101858668A Semiconductor cooling device
10/13/2010CN101858505A Light-emitting diode (LED) lamp
10/13/2010CN101858504A Illumination device
10/13/2010CN101858499A Illumination device
10/13/2010CN101857797A Carbon-based composite heat dissipation material and preparation method and application thereof
10/13/2010CN101604680B Lead frame, lead frame type package and lead column.
10/13/2010CN101567383B Manufacturing method of ohmic electrode structure for silicon carbide
10/13/2010CN101562185B Film transistor array base plate
10/13/2010CN101561609B Active array substrate, liquid crystal display panel and method for manufacturing active array substrate
10/13/2010CN101533808B Energy dissipation device
10/13/2010CN101493294B 热管结构 Heat pipe structure
10/13/2010CN101483164B Semi-conductor encapsulation structure
10/13/2010CN101482252B Convection cooling type LED illumination device
10/13/2010CN101440923B Vehicular lamp
10/13/2010CN101436575B Semiconductor package and mounting method thereof
10/13/2010CN101425453B Alpha tantalum layer forming method, mim capacitor and forming method thereof
10/13/2010CN101408298B Upright post type LED heat radiator
10/13/2010CN101395715B Electronic device package, module and electronic device
10/13/2010CN101393865B Dielectric layer of ultra-low dielectric constant and forming method thereof
10/13/2010CN101373737B Method for preparing CMOS image sensing element
10/13/2010CN101364585B Chip packaging construction and manufacturing method therefor
10/13/2010CN101360388B Electricity connection terminal construction of circuit board and preparation thereof
10/13/2010CN101359656B Image sensor package and fabrication method thereof
10/13/2010CN101335240B Semiconductor device and method of fabricating the same
10/13/2010CN101335217B Semiconductor package and manufacturing method thereof
10/13/2010CN101330208B Electrostatic discharge protecting circuit
10/13/2010CN101320724B Multi-phase wiring structure and method
10/13/2010CN101312157B Method for producing protective structure
10/13/2010CN101310381B Semiconductor package, method of producing the same, semiconductor module, and electronic apparatus
10/13/2010CN101271902B Maintaining method of display electrode and its structure
10/13/2010CN101261986B Electronic part encapsulation module, external cover and its making method
10/13/2010CN101252164B Surface mounting type light emitting diode and method for manufacturing the same
10/13/2010CN101252091B Forming method of sliver hole on substrate and substrate structure
10/13/2010CN101226927B Chip module with power amplifier and manufacturing method thereof
10/13/2010CN101221908B Substrate technique and structure with projection
10/13/2010CN101207175B Electronic cooling device, image sensor and fabrication method thereof
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