Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2010
10/14/2010WO2010115296A1 Radiation substrate for power led and power led production and manufacturing method thereof
10/14/2010WO2010094511A3 Component arrangement and method for production thereof
10/14/2010WO2010082781A3 Trimming device and a wafer on which the trimming device is formed
10/14/2010WO2010073226A3 Production of high alignment marks and such alignment marks on a semiconductor wafer
10/14/2010WO2010013194A3 Orientation of an electronic cmos structure with respect to a buried structure in the case of a bonded and thinned-back stack of semiconductor wafers
10/14/2010US20100261316 Semiconductor device with surface mounting terminals
10/14/2010US20100260992 Multi cap layer
10/14/2010US20100259965 High speed otp sensing scheme
10/14/2010US20100259908 Exposed die pad package with power ring
10/14/2010US20100259734 Cooling Device, Cooling Arrangement and Lithographic Apparatus Comprising a Cooling Arrangement
10/14/2010US20100258957 Semiconductor package structure and encapsulating module for molding the same
10/14/2010US20100258956 Microelectronic packages and methods therefor
10/14/2010US20100258955 Semiconductor device and method of manufacturing the same
10/14/2010US20100258954 Electrode structure and its manufacturing method, and semiconductor module
10/14/2010US20100258953 Substrate and semiconductor device
10/14/2010US20100258952 Interconnection of IC Chips by Flex Circuit Superstructure
10/14/2010US20100258950 Package with semiconductor device and integrated circuit mounted therein and method for manufacturing such package
10/14/2010US20100258949 Reduced Susceptibility To Electrostatic Discharge During 3D Semiconductor Device Bonding and Assembly
10/14/2010US20100258948 Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device
10/14/2010US20100258947 Nonvolatile memory devices
10/14/2010US20100258946 Semiconductor device, manufacturing method thereof, and electronic device
10/14/2010US20100258945 Semiconductor device and method for manufacturing the same
10/14/2010US20100258944 Electronic apparatus and fabrication method of the same
10/14/2010US20100258943 Semiconductor device
10/14/2010US20100258942 Semiconductor device and method for forming using the same
10/14/2010US20100258941 Damascene interconnection structure and dual damascene process thereof
10/14/2010US20100258940 Ball-limiting-metallurgy layers in solder ball structures
10/14/2010US20100258939 Stacked microfeature devices and associated methods
10/14/2010US20100258938 Substrate and semiconductor device
10/14/2010US20100258937 Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
10/14/2010US20100258936 Stacked semiconductor package
10/14/2010US20100258935 Power Semiconductor Module Comprising A Connection Device With Internal Contact Spring Connection Elements
10/14/2010US20100258934 Advanced quad flat non-leaded package structure and manufacturing method thereof
10/14/2010US20100258933 Semiconductor device, method of forming the same, and electronic device
10/14/2010US20100258932 Supporting substrate before cutting, semiconductor device, and method of forming semiconductor device
10/14/2010US20100258931 Semiconductor device and method of forming the same
10/14/2010US20100258930 Stacked semiconductor package and method of manufacturing thereof
10/14/2010US20100258928 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
10/14/2010US20100258927 Package-on-package interconnect stiffener
10/14/2010US20100258926 Relay board and semiconductor device having the relay board
10/14/2010US20100258925 Semiconductor die package and method for making the same
10/14/2010US20100258924 Pre-molded clip structure
10/14/2010US20100258923 Pre-molded clip structure
10/14/2010US20100258922 Semiconductor device and manufacturing method thereof
10/14/2010US20100258921 Advanced quad flat-leaded package structure and manufacturing method thereof
10/14/2010US20100258920 Manufacturing method of advanced quad flat non-leaded package
10/14/2010US20100258918 Semiconductor device and semiconductor module employing thereof
10/14/2010US20100258917 Conductive through connection and forming method thereof
10/14/2010US20100258916 Thermal stress reduction
10/14/2010US20100258902 Method for forming fuse in semiconductor device
10/14/2010US20100258901 Semiconductor device, ink cartridge, and electronic device
10/14/2010US20100258900 On-chip embedded thermal antenna for chip cooling
10/14/2010US20100258883 Metal-Ceramic Multilayer Structure
10/14/2010US20100258876 Semiconductor device and a method of manufacturing the same
10/14/2010US20100258844 BUMPED, SELF-ISOLATED GaN TRANSISTOR CHIP WITH ELECTRICALLY ISOLATED BACK SURFACE
10/14/2010US20100258819 Substrate for an led submount, and led submount
10/14/2010US20100258346 Package of environmentally sensitive electronic device and fabricating method thereof
10/14/2010US20100258283 Electronic device
10/14/2010DE202010009891U1 Kühlkörper und Kühlmodul mit diesem Kühlkörper Heat sink and cooling module with this heatsink
10/14/2010DE112008002620T5 Höcker-E/A-Kontakt für eine Halbleitervorrichtung Bump I / O pad for a semiconductor device
10/14/2010DE102009056787A1 Power Quad Flat No-Lead-Halbleiter-Chip-Packages mit isolierter Wärmesenke für Hochspannungs-, Hochleistungsanwendungen, Systeme zum Verwenden dieser und Verfahren zum Herstellen dieser Power Quad Flat No-Lead semiconductor chip package with insulated heat sink for high-voltage, high-performance applications, systems, and how to use these methods for making these
10/14/2010DE102009044863A1 Halbleiter-Bauelement Semiconductor component
10/14/2010DE102009042399A1 Leistungshalbleitervorrichtung und Herstellungsverfahren dafür Power semiconductor device and manufacturing method thereof
10/14/2010DE102009023113A1 Kühlvorrichtung und Verfahren zu deren Herstellung Cooling device and process for their preparation
10/14/2010DE102009016594A1 Kontaktanordnung zur Substratkontaktierung Contact arrangement for substrate contacting
10/14/2010DE102009016112A1 Device for wire bonding, has electrical components and electrical cable for electrical connection of electrical contact of one component with another component
10/14/2010DE102009015839A1 Integrierte ESD-Schutzschaltung und Verwendung eines Bipolartransistors Integrated ESD protection circuit using a bipolar transistor and
10/14/2010DE102009015757A1 Druckunterstützung für eine elektronische Schaltung Pressure Support for an electronic circuit
10/14/2010DE102009015259A1 Surface-mountable component, has solderable connection pads arranged on side of carrier for surface-mounting of component, where side of carrier faces chip and connection pads are connected to chip via connecting lines
10/14/2010DE102009002255A1 Method for manufacturing conductive vias in e.g. semiconductor component, involves depositing protective layer on portion of insulation layer, and partially fixing functional layer at bottom of trenches
10/14/2010DE102006008807B4 Anordnung mit einem Leistungshalbleitermodul und einem Kühlbauteil Arrangement with a power semiconductor module and a cooling component
10/14/2010CA2757760A1 Liquid encapsulating resin composition, semiconductor device using liquid encapsulating resin composition, and method of manufacturing the same
10/13/2010EP2239818A1 Holding member, mounting structure having the holding member mounted in electric circuit board, and electronic part having the holding member
10/13/2010EP2239778A1 Unit Pixel of Image Sensor having three-dimensional structure and method for manufacturing the same
10/13/2010EP2239775A2 Heat sinks with distributed and integrated jet cooling
10/13/2010EP2239774A1 High-power semiconductor element with edge passivation and method for producing same
10/13/2010EP2239773A1 Semiconductor chip package and manufacturing method thereof
10/13/2010EP2239769A1 Self-aligned metal mask assembly for selectively depositing thin films on microelectronic substrates and devices, and method of use
10/13/2010EP2239767A1 Package for a semiconductor die and method of making the same
10/13/2010EP2239765A1 Substrate and method for manufacturing the same
10/13/2010EP2239619A1 Optical device, sealing board and method for manufacturing optical device
10/13/2010EP2238620A1 Embedded constrainer discs for reliable stacked vias in electronic substrates
10/13/2010EP2238619A2 Methods and devices for wireless chip-to-chip communications
10/13/2010EP2238618A2 Method for reversibly mounting a device wafer to a carrier substrate
10/13/2010EP2238617A2 Methods and apparatus for heat transfer for a component
10/13/2010EP2238613A2 Integrated circuits on a wafer and method of producing integrated circuits
10/13/2010EP2238198A1 Silsesquioxane resins
10/13/2010EP1412978B1 Electronic component with a plastic housing and method for production thereof
10/13/2010EP1408863B1 Hermetic feedthrough for an implantable device
10/13/2010CN201609005U 翅片状相变电子散热器 Electronic radiator fin-shaped phase change
10/13/2010CN201608970U 电路板组合 Circuit board assembly
10/13/2010CN201608178U 整流桥组件 Rectifier bridge assembly
10/13/2010CN201608177U 发光二极管引线架结构 Light-emitting diode lead frame structure
10/13/2010CN201608176U 表面粘着型发光二极管线架结构 Surface mount light-emitting diode wire frame structure
10/13/2010CN201608175U 一种新型led光源 A new kind of led light
10/13/2010CN201608173U 晶体管固定结构 Transistor fixed structure
10/13/2010CN201608172U 封装载板结构 Package substrate structure
10/13/2010CN201605343U 引线框架传输钢带支撑定位装置 Leadframe strip transmission support positioning device
10/13/2010CN1998081B Carrier for multilayer semiconductor device and method for manufacturing multilayer semiconductor device
10/13/2010CN1996589B Structure of the Damascus using the gas filling to reduce the dielectric constant and its making method
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