Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2010
10/20/2010CN101866887A Heat radiator
10/20/2010CN101866886A Chip packaging structure and substrate processing method thereof
10/20/2010CN101866879A Interconnecting structure production method, and interconnecting structure
10/20/2010CN101866866A Semiconductor integrated circuit device and method of manufacturing same
10/20/2010CN101866850A Structure of salicide area barrier film and preparation method thereof
10/20/2010CN101866829A Method for intellectual property protection for parameterized units of integrated circuit
10/20/2010CN101865371A Illumination device
10/20/2010CN101865370A Light-emitting diode lamp
10/20/2010CN101865369A Light-emitting diode lamp
10/20/2010CN101865366A Reflective light-emitting module with high heat dissipation and high luminous efficacy
10/20/2010CN101865364A Cross-ventilation radiating high-power LED lamp
10/20/2010CN101864280A Thermal interface material for packaging and radiating chip and preparation method thereof
10/20/2010CN101864279A Saturated superfine filler used between LED and heat dissipation device
10/20/2010CN101864268A Thermal conductive adhesive
10/20/2010CN101864147A Underfill with low viscosity and low linear expansion coefficient
10/20/2010CN101540307B Semiconductor encapsulation structure with pins on chip
10/20/2010CN101533811B Structure of semiconductor chip with silicon through hole and stacking assembly thereof
10/20/2010CN101509809B Circuit parameter demarcating method for photodetector for direct coupling and apparatus thereof
10/20/2010CN101437385B Apparatus for cooling electronic device rack
10/20/2010CN101425507B LED row having heat radiating fins and production method
10/20/2010CN101404261B Triode and manufacturing method thereof
10/20/2010CN101256988B Semiconductor device with multi-layered wiring arrangement including reinforcing patterns
10/20/2010CN101236927B Self-aligning contact window and its making method
10/19/2010USRE41826 Semiconductor device
10/19/2010US7818569 Data protection and cryptographic functions using a device-specific value
10/19/2010US7818488 Memory module with registers
10/19/2010US7817426 Heatsink for heat-producing device
10/19/2010US7817425 Dissipating apparatus for integrated circuit chip and display module including the same
10/19/2010US7817424 Heat sink assembly including a heat pipe and a duct
10/19/2010US7817387 MIGFET circuit with ESD protection
10/19/2010US7816795 Semiconductor device and data processor
10/19/2010US7816794 Electronic device and method of fabricating the same
10/19/2010US7816793 Apparatus for facilitating proximity communication between chips
10/19/2010US7816792 Semiconductor device with conductive interconnect
10/19/2010US7816791 Bonding pad for contacting a device
10/19/2010US7816790 Semiconductor device having low dielectric insulating film and manufacturing method of the same
10/19/2010US7816789 semiconductor substrate, dielectric layer over the semiconductor substrate, conductive wiring in the first dielectric layer, and copper germanide nitride layer over conductive wiring; integrated circuits
10/19/2010US7816788 Structure, method and system for assessing bonding of electrodes in FCB packaging
10/19/2010US7816787 Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes
10/19/2010US7816786 Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
10/19/2010US7816785 Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
10/19/2010US7816784 Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same
10/19/2010US7816783 Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same
10/19/2010US7816782 Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
10/19/2010US7816781 Power semiconductor module
10/19/2010US7816780 Semiconductor apparatus and manufacturing method of semiconductor apparatus
10/19/2010US7816779 Multimode signaling on decoupled input/output and power channels
10/19/2010US7816778 Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same
10/19/2010US7816776 Stacked semiconductor device and method of forming serial path thereof
10/19/2010US7816775 Multi-die IC package and manufacturing method
10/19/2010US7816774 Flexible semiconductor device and identification label
10/19/2010US7816773 Package structure and manufacturing method thereof
10/19/2010US7816772 Methods and apparatus for multi-stage molding of integrated circuit package
10/19/2010US7816771 Stacked chip package structure with leadframe having inner leads with transfer pad
10/19/2010US7816770 Device and method for hermetically sealing a cavity in an electronic component
10/19/2010US7816769 Stackable packages for three-dimensional packaging of semiconductor dice
10/19/2010US7816768 Semiconductor device including ground and power-supply planes and a dielectric layer between the ground and power-supply planes
10/19/2010US7816763 BJT and method for fabricating the same
10/19/2010US7816761 Semiconductor device having fuse and protection circuit
10/19/2010US7816754 Ball grid array package construction with raised solder ball pads
10/19/2010US7816750 Thin semiconductor die packages and associated systems and methods
10/19/2010US7816749 Photoelectric conversion device and method of producing the same, and method of producing line image sensor IC
10/19/2010US7816745 Wafer level hermetically sealed MEMS device
10/19/2010US7816737 Semiconductor device with gate dielectric containing mixed rare earth elements
10/19/2010US7816280 Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer
10/19/2010US7816255 Methods of forming a semiconductor device including a diffusion barrier film
10/19/2010US7816251 Formation of circuitry with modification of feature height
10/19/2010US7816247 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations
10/19/2010US7816246 Methods of making semiconductor fuses
10/19/2010US7816242 Semiconductor device and method of manufacturing the same
10/19/2010US7816188 Process for fabricating a dielectric film using plasma oxidation
10/19/2010US7816187 Method for fabricating semiconductor package free of substrate
10/19/2010US7816185 Method of manufacturing a semiconductor device
10/19/2010US7816181 Method of under-filling semiconductor die in a die stack and semiconductor device formed thereby
10/19/2010US7816177 Semiconductor device and method of manufacturing the same
10/19/2010US7816156 Light emitting diode package and fabrication method thereof
10/19/2010US7816006 Non-stoichiometric nanomaterial compositions with distinctive shape and morphology
10/19/2010US7815316 Projector having digital micromirror device with thermoelectric cooling chip attached thereto
10/19/2010US7814651 Method for fabricating a through-hole interconnection substrate
10/19/2010CA2417992C Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
10/14/2010WO2010118350A1 Reduced susceptibility to electrostatic discharge during 3d semiconductor device bonding and assembly
10/14/2010WO2010118297A1 Magnetic film enhanced transformer
10/14/2010WO2010118183A2 Low stress-inducing heat sink
10/14/2010WO2010117987A1 Bumped, self-isolated gan transistor chip with electrically isolated back surface
10/14/2010WO2010117383A1 Bonded hermetic feed through for an active implantable medical device
10/14/2010WO2010117107A1 Method for forming insulating layers for high thermal radiation of metal substrate and metal substrate manufactured thereby
10/14/2010WO2010117081A1 Epoxy resin composite
10/14/2010WO2010117073A1 Semiconductor device
10/14/2010WO2010116993A1 Structure having integrated circuit mounted therein
10/14/2010WO2010116891A1 Heat-conductive massive adhesive agent, heat-conductive adhesive sheet and method for producing same
10/14/2010WO2010116889A1 Method for forming manganese oxide film, method for manufacturing semiconductor device, and semiconductor device
10/14/2010WO2010116861A1 Lens with lens barrel
10/14/2010WO2010116798A1 Patterning method
10/14/2010WO2010116746A1 ELECTRONIC COMPONENT PROVIDED WITH Cu-Al-Co-BASED ALLOY ELECTRODE OR WIRING
10/14/2010WO2010116622A1 Semiconductor device and method of manufacturing substrates for semiconductor elements
10/14/2010WO2010116615A1 Method of producing substrate for semiconductor element, and semiconductor device
10/14/2010WO2010116582A1 Liquid sealing resin composition, semiconductor device using liquid sealing resin composition, and method for producing same
10/14/2010WO2010116325A1 Package for a semiconductor die and method of making the same.
10/14/2010WO2010115746A1 Conductor grid for electronic housings and manufacturing method
10/14/2010WO2010115385A1 Contact array for substrate contacting
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