Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2010
10/21/2010US20100264538 Method for producing electrical interconnects and devices made thereof
10/21/2010US20100264537 Semiconductor Arrangement
10/21/2010US20100264536 Self-healing thermal interface materials for semiconductor packages
10/21/2010US20100264535 Integrated circuit package assembly and substrate processing method
10/21/2010US20100264534 Chip package structure and manufacturing method thereof
10/21/2010US20100264533 Semiconductor chip package
10/21/2010US20100264532 Electronic device package
10/21/2010US20100264531 Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
10/21/2010US20100264530 Stacked Chip Package Structure with Leadframe Having Bus Bar
10/21/2010US20100264529 Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof
10/21/2010US20100264528 Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof
10/21/2010US20100264527 Stacked Chip Package Structure with Leadframe Having Bus Bar
10/21/2010US20100264526 Semiconductor package and manufacturing method thereof
10/21/2010US20100264525 Integrated circuit package system with leaded package and method for manufacturing thereof
10/21/2010US20100264524 Substrate for semiconductor package
10/21/2010US20100264523 Panel, Semiconductor Device and Method for the Production Thereof
10/21/2010US20100264522 Semiconductor device having at least one bump without overlapping specific pad or directly contacting specific pad
10/21/2010US20100264521 Semiconductor Component Having Through Wire Interconnect (TWI) With Compressed Wire
10/21/2010US20100264520 Semiconductor module
10/21/2010US20100264515 Semiconductor device
10/21/2010US20100264514 Semiconductor device and a method of increasing a resistance value of an electric fuse
10/21/2010US20100264513 Integrated circuit devices including passive device shielding structures
10/21/2010US20100264512 Semiconductor Device and Method of Forming High-Frequency Circuit Structure and Method Thereof
10/21/2010US20100264423 Thinned Semiconductor Components Having Lasered Features And Methods For Fabricating Semiconductor Components Using Back Side Laser Processing
10/21/2010US20100264415 Interconnecting structure production method, and interconnecting structure
10/21/2010US20100264414 Semiconductor integrated circuit device and method of manufacturing same
10/21/2010US20100264413 Replacement of Scribeline Padframe with Saw-Friendly Design
10/21/2010US20100263838 Synthetic Jet Ejector for Augmentation of Pumped Liquid Loop Cooling and Enhancement of Pool and Flow Boiling
10/21/2010DE202010010393U1 Kühlvorrichtung Cooler
10/21/2010DE202010009897U1 Leitungsführung eines elektrischen Moduls Wiring an electrical module
10/21/2010DE102010011155A1 Schreibverfahren mit geladenem Partikelstrahl, Verfahren zum Erfassen der Position einer Referenzmarkierung für ein Beschreiben mit geladenem Partikelstrahl, und eine Schreibvorrichtung mit geladenem Partikelstrahl The writing method with a charged particle beam method for detecting the position of a reference mark for describing a charged particle beam, and a writing device with a charged particle beam
10/21/2010DE102010000531A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
10/21/2010DE102009017733A1 Leistungshalbleitermodul mit einer Verbindungseinrichtung und mit als Kontaktfeder ausgebildeten internen Anschlusselementen Power semiconductor module with a connection device and designed as a contact spring with internal connection elements
10/21/2010DE102009017732A1 Leistungshalbleiterbauelement mit einer Randpassivierung und Verfahren zu dessen Herstellung Power semiconductor component having an edge passivation and process for its preparation
10/21/2010DE102009017368A1 Heating- and cooling unit for component, particularly motor vehicle, has conducting element for conducting heat- and cooling energy to area of component of motor vehicle to be heated and cooled
10/21/2010DE102009016842A1 Leitungsgitter für Elektronikgehäuse und Herstellungsverfahren Grid of wires for electronics housing and manufacturing processes
10/21/2010DE102009016354A1 Fastening mechanism for attaching CPU radiator to printed circuit board, has base body consisting of multiple individual base body components that are connected by radiator, and connected with carrier over fasteners
10/21/2010DE102009002376A1 Multichip-Sensormodul und Verfahren dessen Herstellung Multi-chip sensor module and method of manufacturing
10/21/2010DE102009000882B4 Substrat zur Aufnahme mindestens eines Bauelements und Verfahren zur Herstellung eines Substrats Substrate for receiving at least one device and process for the preparation of a substrate
10/21/2010DE102004058915B4 Thermometrischer Digital-Analog-Umsetzer Thermometric Digital-to-analog converter
10/21/2010CA2755284A1 Robust esd protection circuit, method and design structure for tolerant and failsafe designs
10/20/2010EP2242346A1 Liquid crystal display device with a heat spreader
10/20/2010EP2242345A2 Method and apparatus for cooling electronic components
10/20/2010EP2242256A1 Solid-state imaging device and method for manufacturing the same
10/20/2010EP2242103A1 Chip with field-effect transistors and contact bumps for flip-chip connection
10/20/2010EP2242102A1 Device for reducing the noise emission in a power electronics system
10/20/2010EP2242101A2 Receive circuit for connectors with variable complex impedance
10/20/2010EP2242100A1 Cooling device and electric vehicle using the cooling device
10/20/2010EP2242099A2 Signal conversion device for connection with a SIM card
10/20/2010EP2242098A1 Single side rail substrate
10/20/2010EP2242095A1 Semiconductor device and its manufacturing method
10/20/2010EP2242094A1 Foil and method for foil-based bonding and resulting package
10/20/2010EP2242092A1 Plasma processing method and plasma processing system
10/20/2010EP2241390A1 Radiator manufacturing method and aligning-and-moving mechanism thereof
10/20/2010EP2240962A2 Electrostatic discharge protection
10/20/2010EP2240961A1 Semiconductor device
10/20/2010EP2168156B1 Integrated circuits on a wafer and methods for manufacturing integrated circuits
10/20/2010EP1540727B1 Method for sealing a microcavity and package comprising at least one microcavity
10/20/2010EP1436893B1 Electronic device and method of manufacturing
10/20/2010EP1171798B1 Method and apparatus for monitoring electrostatic discharge effects
10/20/2010CN201611659U 主动元件阵列基板 Active device array substrate
10/20/2010CN201611654U 一种防水增强型引线框架 A waterproof Enhanced leadframe
10/20/2010CN201611081U Led照明灯散热模组及由该散热模组组成的散热装置 Led lighting lamp cooling module and heat sink thermal module composed by the
10/20/2010CN201611029U 大功率led筒灯 High power led down light
10/20/2010CN201611023U 一种具有散热装置的led灯具 A cooling device has led lamps
10/20/2010CN1941348B Relay board and semiconductor device having the relay board
10/20/2010CN1905177B Circuit assembly structure and method for making the same
10/20/2010CN1905176B Circuit assembly structure and method for making the same
10/20/2010CN101869008A Semiconductor device and multilayer wiring board
10/20/2010CN101868854A Liquid-cooled cooling device
10/20/2010CN101868116A Circuit board and manufacturing method thereof
10/20/2010CN101866950A N-type metal oxide semiconductor element and fabricating method thereof
10/20/2010CN101866935A Image sensor and lens module
10/20/2010CN101866919A Integrated circuit structure
10/20/2010CN101866917A Active element array substrate and repair method thereof
10/20/2010CN101866916A ESD protection circuit of wide-voltage-swing interface circuit device and realization method thereof
10/20/2010CN101866915A Integrated circuit device and operation method thereof, memory storage device and electronic system
10/20/2010CN101866913A Chip encapsulation structure with shielding cover body
10/20/2010CN101866909A Bidirectional switch module
10/20/2010CN101866908A Inductive loop formed by interconnecting silicon through holes
10/20/2010CN101866907A Receive circuit for connectors with variable complex impedance
10/20/2010CN101866906A Device for reducing the interference emission in a power electronic system
10/20/2010CN101866905A Substrate structure and manufacturing method thereof
10/20/2010CN101866904A Semiconductor chip package
10/20/2010CN101866903A Window type ball gird array packaging structure
10/20/2010CN101866902A Semiconductor packaging structure, lead frame and chip holder thereof
10/20/2010CN101866901A Semiconductor device and manufacturing method thereof
10/20/2010CN101866900A Copper bonding wire, bonding wire joint structure and bonding wire processing and jointing method
10/20/2010CN101866899A Semiconductor device
10/20/2010CN101866898A Metal wiring structures for uniform current density in C4 balls
10/20/2010CN101866897A Solid-state imaging device comprising through-electrode
10/20/2010CN101866896A Alpha shielding techniques and configurations
10/20/2010CN101866895A 芯片结构及其形成方法 Chip structure and method of forming
10/20/2010CN101866894A Electrode structure and light emitting element thereof
10/20/2010CN101866893A Packaging structure for array type flat leadless chips
10/20/2010CN101866892A Chip layout structure and method
10/20/2010CN101866891A Semiconductor circuit
10/20/2010CN101866890A Circuit carrier plate and semiconductor packaging structure applying same
10/20/2010CN101866889A Substrate-free chip packaging and manufacturing method thereof
10/20/2010CN101866888A Heat radiation device
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