Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2010
10/27/2010EP2244297A1 Silicon carbide semiconductor device
10/27/2010EP2244291A1 Multilevel interconnection system
10/27/2010EP2244290A2 Heat-dissipating component having stair-stepped coolant channels
10/27/2010EP2244289A2 Coolant cooled type semiconductor device
10/27/2010EP2244288A1 Semiconductor element module and method for manufacturing the same
10/27/2010EP2244287A2 A pre-treatment method to increase copper island density and to improve adhesion for Cu on barrier layers
10/27/2010EP2243847A1 Copper alloy material for electric and electronic components
10/27/2010EP2243163A1 Igbt and method of producing the same
10/27/2010EP2243162A1 On-chip integrated voltage-controlled variable inductor
10/27/2010EP2243161A2 Semiconductor package
10/27/2010EP2243160A2 Contactless object with integrated circuit connected to circuit terminals by capacitive coupling
10/27/2010EP2243159A2 Method for low-temperature pressure sintering
10/27/2010EP2243155A1 Noble metal cap for interconnect structures
10/27/2010EP1784864B1 Electric sub-assembly
10/27/2010EP1579499B1 Method of self-assembling electronic circuitry and circuits formed thereby
10/27/2010EP1356513B1 Molding of protective caps
10/27/2010EP1160860B1 Heat sink material and manufacturing method thereof
10/27/2010CN201616864U 成像元件的温控密封结构 Temperature of the imaging element sealing structure
10/27/2010CN201616667U Esd保护电路 Esd protection circuit
10/27/2010CN201616434U 一种有机发光器件的薄膜封装结构 An organic thin film light-emitting device package structure of
10/27/2010CN201616433U U盘结构 U disk structure
10/27/2010CN201616430U 一种集成电路的封装结构 An integrated circuit packaging structure of
10/27/2010CN201616429U 阵列式环岛镀引线框架版件 Array island plated leadframe edition pieces
10/27/2010CN201616428U 散热器接头 Radiator fittings
10/27/2010CN201616427U 一种半导体断齿型散热器 A semiconductor broken teeth radiator
10/27/2010CN201616065U 一种水冷cpu散热器 One kind of water-cooling cpu heatsink
10/27/2010CN1971901B Semiconductor device and its production method
10/27/2010CN1938847B Heat sink manufacturing method
10/27/2010CN1901161B Method for fabricating a circuitry component by continuous electroplating and circuitry component structure
10/27/2010CN1789110B Wafer bonding of micro-electro mechanical systems to active circuitry
10/27/2010CN1717802B Semiconductor device having a bond pad and method for its fabrication
10/27/2010CN1606155B Pipe core with pillar structures and manufacturing method thereof
10/27/2010CN101874301A Contact structure for an electronic circuit substrate and electronic circuit comprising said contact structure
10/27/2010CN101874300A Ebullient cooling unit
10/27/2010CN101874299A Ceramic substrate having thermal via
10/27/2010CN101874295A Method for manufacturing flexible semiconductor device and multilayer film used therein
10/27/2010CN101873787A Fan fixing device
10/27/2010CN101873786A Heat sink
10/27/2010CN101873784A Heat dispersion module of electronic element and assembling method thereof
10/27/2010CN101873783A Heat sink and fastener thereof
10/27/2010CN101872817A Light-emitting diode packaging structure and manufacturing method thereof
10/27/2010CN101872780A Display panel and image display system using the same
10/27/2010CN101872778A Integrated circuit 3d phase change memory array and manufacturing method
10/27/2010CN101872774A Solid-state imaging device and imaging apparatus
10/27/2010CN101872770A Pixel unit, coplane conversion type liquid crystal display device and manufacturing method
10/27/2010CN101872762A Method for manufacturing wafer and chip and welding line connecting structure
10/27/2010CN101872759A Alternated current light-emitting diode having constant current diode
10/27/2010CN101872757A Recess chip packaging structure and laminated packaging structure using same
10/27/2010CN101872756A Semiconductor device and manufacturing method of semiconductor device
10/27/2010CN101872755A Window type semiconductor encapsulation structure with jumper connecting structure and substrate thereof
10/27/2010CN101872754A Welding wire joint structure, method for strengthening welding wire joint and manufacturing method of semiconductor encapsulation construction
10/27/2010CN101872753A Restoration of electrical and mechanical connectability to an electrical device with a face equipped with contact studs
10/27/2010CN101872752A Electronic label package and manufacturing method thereof
10/27/2010CN101872751A Reducing cluster air flow device of chip radiator
10/27/2010CN101872750A Chip structure, stack chip packaging structure and manufacturing method of chip structure
10/27/2010CN101872749A Recess chip packaging structure and laminated packaging structure using same
10/27/2010CN101872748A Semiconductor device and method of manufacturing semiconductor device
10/27/2010CN101872747A Electronic component module
10/27/2010CN101872742A Semiconductor device and manufacturing method
10/27/2010CN101872728A Manufacturing method of solder pad layer
10/27/2010CN101872727A Chip welding method and structure
10/27/2010CN101872654A Grout silver paste applied to thick film circuit
10/27/2010CN101872054A Lens module and camera module applying same
10/27/2010CN101871627A High-efficiency heat radiating LED (light emitting diode) lamp and manufacture method thereof
10/27/2010CN101871610A LED combined chip light emitter of automobile headlamp
10/27/2010CN101871584A 照明装置 Lighting device
10/27/2010CN101871583A Light-emitting diode lamp
10/27/2010CN101871581A Led light source device
10/27/2010CN101870445A Circuit lead structure and micro-electromechanical system
10/27/2010CN101870444A Micro electro mechanical system chip with functional connecting lead
10/27/2010CN101499444B Cooling type multi-punch semiconductor packaging construction
10/27/2010CN101483184B Image sensor and method for manufacturing the same
10/27/2010CN101467240B Semiconductor device and touch sensor device
10/27/2010CN101452911B Test construction for detecting W plug chemical mechanical polishing process
10/27/2010CN101442038B Capacitor and display device
10/27/2010CN101442012B Model sealing and cutting method for small window and formed encapsulation conformation
10/27/2010CN101421833B Land grid array packaging method
10/27/2010CN101395724B Solar cell marking method, and solar cell
10/27/2010CN101378085B Metal-insulator-metal capacitor and method for manufacturing the same
10/27/2010CN101351884B Compliant terminal mountings with vented spaces and methods
10/27/2010CN101300911B Circuit module and method for manufacturing circuit module
10/27/2010CN101246877B Poly-crystal face-to-face stacking and packaging construction
10/27/2010CN101226932B Pixel structure and manufacturing method thereof
10/27/2010CN101226904B Silicon slice with asymmetry edge contour and manufacturing method thereof
10/27/2010CN101197378B Non-volatile ROM and method of fabricating the same
10/27/2010CN101140943B Array substrate and display apparatus having the same
10/27/2010CN101114656B Distortion resistant touch-sensitive display panel
10/27/2010CN101038931B Organic electroluminescent device and electronic apparatus
10/26/2010USRE41869 Semiconductor device
10/26/2010USRE41866 Semiconductor device and method of fabricating same
10/26/2010US7823114 Method of designing wiring structure of semiconductor device and wiring structure designed accordingly
10/26/2010US7823096 Inductance analysis system and method and program therefor
10/26/2010US7823038 Connecting analog response to separate strobed comparator input on IC
10/26/2010US7822394 Electrostatic protection circuit with impedance matching for radio frequency integrated circuits
10/26/2010US7822302 Circuit board and method for manufacturing the same
10/26/2010US7821849 Configurable embedded processor
10/26/2010US7821696 Electrochromic rearview mirror assembly incorporating a display/signal light
10/26/2010US7821581 Fully integrated tuner architecture
10/26/2010US7821554 Image sensor with cooling element
10/26/2010US7821142 Intermediate semiconductor device structures
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