Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/02/2010US7825403 Circuit board including a substrate with a recessed portion and manufacturing method thereof, electro-optical device and electronic apparatus
11/02/2010US7825197 Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator
11/02/2010US7825042 Very low dielectric constant plasma-enhanced CVD films
11/02/2010US7825029 Method for the production of structured layers on substrates
11/02/2010US7824963 Inkjet printed leadframe
11/02/2010US7824959 Wafer level stack structure for system-in-package and method thereof
11/02/2010US7823279 Method for using an in package power supply to supply power to an integrated circuit and to a component
11/02/2010US7823278 Method for fabricating electrical contact buttons
11/02/2010CA2525372C Compact refrigeration system and power supply including dynamic insulation
11/02/2010CA2455794C A high solids hbn slurry, hbn paste, spherical hbn powder, and methods of making and using them
11/02/2010CA2452531C Insulating and functionalizing fine metal-containing particles with conformal ultra-thin films
10/2010
10/28/2010WO2010124083A1 Floating metal elements in a package substrate
10/28/2010WO2010123765A2 Thin bond line semiconductor packages
10/28/2010WO2010123691A1 Three dimensional integrated circuit integration using dielectric bonding first and through via formation last
10/28/2010WO2010123676A1 Semiconductor chip package with undermount passive devices
10/28/2010WO2010123557A1 Silicone coated light-emitting diode
10/28/2010WO2010123185A1 Semiconductor chip and method for generating digital value using process variation
10/28/2010WO2010122795A1 Semiconductor device
10/28/2010WO2010122757A1 Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein
10/28/2010WO2010122754A1 Semiconductor integrated circuit
10/28/2010WO2010122689A1 Display device
10/28/2010WO2010122437A2 Multilevel interconnection system
10/28/2010WO2010121860A1 Encapsulated circuit device for substrates with absorption layer and method for producing the same
10/28/2010WO2010121428A1 Method of manufacturing heatsink with angled fins
10/28/2010WO2010101858A3 Hermetic packaging of integrated circuit components
10/28/2010WO2010088140A3 Method and apparatus for performing rlc modeling and extraction for three-dimensional integrated circuit (3d-ic) designs
10/28/2010WO2010088124A3 Semiconductor device having a diamond substrate heat spreader
10/28/2010WO2010015678A3 Improving solder bump connections in semiconductor devices
10/28/2010US20100274111 Analyte Monitoring Device and Methods of Use
10/28/2010US20100273386 Liquid crystal display device, method for fabricating the same, and portable telephone using the same
10/28/2010US20100273324 Methods of manufacturing metal-silicide features
10/28/2010US20100273311 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
10/28/2010US20100271831 Light-emitting diode device for voltage switchable dielectric material having high aspect ratio particles
10/28/2010US20100271787 Sensor module
10/28/2010US20100270992 Semiconductor device
10/28/2010US20100270910 Light emitting device and fabrication method thereof
10/28/2010US20100270866 Magnetic coupling type isolator
10/28/2010US20100270865 Magnetic coupling type isolator
10/28/2010US20100270689 Semiconductor packages and electronic systems including the same
10/28/2010US20100270688 Multi-chip stacked package
10/28/2010US20100270687 Semiconductor device and manufacturing method of the same
10/28/2010US20100270685 Die bonding utilizing a patterned adhesion layer
10/28/2010US20100270684 Chip identification using top metal layer
10/28/2010US20100270683 Semiconductor device and method of manufacturing semiconductor device
10/28/2010US20100270682 Implementing Vertical Airgap Structures Between Chip Metal Layers
10/28/2010US20100270681 Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards
10/28/2010US20100270680 Integrated circuit package system with offset stacking and anti-flash structure
10/28/2010US20100270679 Microelectronic packages fabricated at the wafer level and methods therefor
10/28/2010US20100270678 Semiconductor device
10/28/2010US20100270677 Semiconductor device and method of manufacturing semiconductor device
10/28/2010US20100270676 Adaptive interconnect structure
10/28/2010US20100270675 Semiconductor device having damascene interconnection structure that prevents void formation between interconnections having transparent dielectric substrate
10/28/2010US20100270674 High quality electrical contacts between integrated circuit chips
10/28/2010US20100270673 Method for connecting two joining surfaces
10/28/2010US20100270672 Semiconductor device
10/28/2010US20100270671 Manipulating fill patterns during routing
10/28/2010US20100270670 Integrated circuit packaging system and method of manufacture thereof
10/28/2010US20100270669 Surface mount package with ceramic sidewalls
10/28/2010US20100270668 Dual Interconnection in Stacked Memory and Controller Module
10/28/2010US20100270667 Semiconductor package with multiple chips and substrate in metal cap
10/28/2010US20100270666 Semiconductor device and method of manufacturing semiconductor device
10/28/2010US20100270665 Leadframe
10/28/2010US20100270664 Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same
10/28/2010US20100270663 Power Lead-on-Chip Ball Grid Array Package
10/28/2010US20100270662 Polysilicon drift fuse
10/28/2010US20100270661 Semiconductor Device Having Electrical Devices Mounted to IPD Structure and Method of Shielding Electromagnetic Interference
10/28/2010US20100270660 Semiconductor device and method for manufacturing metallic shielding plate
10/28/2010US20100270659 Semiconductor device, method of manufacturing the same, and silane coupling agent
10/28/2010US20100270657 Chip-on-board package
10/28/2010US20100270656 Semiconductor Device and Method of Forming Conductive Pillars in Recessed Region of Peripheral Area Around the Device for Electrical Interconnection to Other Devices
10/28/2010US20100270655 Integrated Circuits On A Wafer and Method For Separating Integrated Circuits On A Wafer
10/28/2010US20100270654 Semiconductor device and method for manufacturing the same, dry-etching process, method for making electrical connections, and etching apparatus
10/28/2010US20100270652 Double exposure technology using high etching selectivity
10/28/2010US20100270648 Semiconductor integrated circuit, d-a converter device, and a-d converter device
10/28/2010US20100270645 Thin-film capacitor structures embedded in semiconductor packages and methods of making
10/28/2010US20100270641 Semiconductor Fuse Arrangements
10/28/2010US20100270640 Deformable integrated circuit device
10/28/2010US20100270618 Production method of semiconductor device and semiconductor device
10/28/2010US20100270593 Integrated circuit 3d memory array and manufacturing method
10/28/2010US20100270581 Optical semiconductor package sealing resin material
10/28/2010US20100270549 Semiconductor Device and Method of Providing Electrostatic Discharge Protection for Integrated Passive Devices
10/28/2010US20100270458 Liquid electrical interconnect and devices using same
10/28/2010DE202010011428U1 Kühlstruktur für Leuchtdioden mit polykristallinem Metallsubstrat Cooling structure for light-emitting diodes with polycrystalline metal substrate
10/28/2010DE202010010956U1 Wärmeableitvorrichtung Heat sink
10/28/2010DE202010009895U1 Kühlmodul Cooling module
10/28/2010DE202010009894U1 Kühlmodul Cooling module
10/28/2010DE202010009893U1 Kühlmodul Cooling module
10/28/2010DE202010009846U1 Halter Holder
10/28/2010DE202010000787U1 Kühlkörper mit Kapillarkühleinheit Heatsink with Kapillarkühleinheit
10/28/2010DE112008003425T5 Halbleiterbauelement und Verfahren zum Herstellen desselben Of the same semiconductor device and method of manufacturing
10/28/2010DE10346292B4 Elktronikgehäuse mit anschlußleitungslosem Leitungsrahmen und Sensormodul, das dasselbe umfaßt Elktronikgehäuse with connection cable and Wi-lead frame sensor module comprising the same
10/28/2010DE102010016566A1 Halbleiterbaustein mit mehreren Chips und Substrat in einer Metallkappe A semiconductor device having a plurality of chip and substrate in a metal cap
10/28/2010DE102010016372A1 Integrierte Schaltung mit ESD-Vorrichtung An integrated circuit with ESD device
10/28/2010DE102009019063A1 Component part i.e. sensor e.g. acceleration sensor, for use in motor vehicle, has housing made of plastic and provided for embedding capsulated electronic assembly part together with screen section of conductor grid
10/28/2010DE102009018541A1 Contacting unit for electronic component, is porous metallic layered structure, and contact surface of electronic component and layered structure geometrically fit to each other, where thickness of layer is ten micrometers
10/28/2010DE102009002584A1 Sensor arrangement, has adhesive layer partially embedded into mold housing, where adhesive layer below contact section is thinner than adhesive layer below sensitive section at region of recess in support surface
10/28/2010DE102009002519A1 Gekapselte Schaltungsvorrichtung für Substrate mit Absorptionsschicht sowie Verfahren zu Herstellung derselben Encapsulated circuit device for substrates with absorption layer and process for producing the same
10/28/2010DE102007052097B4 Verfahren zur Herstellung eines SOI-Bauelements mit einer Substratdiode A method for manufacturing an SOI device having a body diode
10/28/2010DE102007003824B4 Verfahren zum Auftragen einer Wärmeleitpaste A method for applying a thermal grease
10/28/2010CA2759638A1 Silicone coated light-emitting diode
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