Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2014
10/07/2014US8852970 Method for mounting luminescent device
10/07/2014US8852961 Semiconductor device and method for manufacturing the same
10/07/2014US8852674 Method for segregating the alloying elements and reducing the residue resistivity of copper alloy layers
10/07/2014US8852467 Method of manufacturing a printable composition of a liquid or gel suspension of diodes
10/07/2014US8852378 Tailorable titanium-tungsten alloy material thermally matched to semiconductor substrates and devices
10/07/2014US8851154 Cooling module and system for lamp device
10/07/2014US8850704 Heat sink
10/07/2014US8850700 Wiring board and method for making the same
10/07/2014US8850698 Method for the sealed assembly of an electronic housing
10/07/2014US8850697 Method for manufacturing a radiation imaging panel comprising imaging tiles
10/07/2014US8850694 Systems and methods for forming micro-object assemblies
10/02/2014WO2014160675A1 Semiconductor devices and packages including conductive underfill material and related methods
10/02/2014WO2014160545A1 Semiconductor-on-insulator integrated circuit with interconnect below the insulator
10/02/2014WO2014159980A2 Methods of forming under device interconnect structures
10/02/2014WO2014159957A1 Methods of forming buried microelectricomechanical structures coupled with device substrates and structures formed thereby
10/02/2014WO2014159946A1 Mems device having a getter
10/02/2014WO2014159471A1 Stack die package
10/02/2014WO2014159469A1 Method for fabricating stack die package
10/02/2014WO2014158752A1 Monolithic integrated circuit (mmic) structure and method for forming such structure
10/02/2014WO2014158481A1 System for cooling an integrated circuit within a computing device
10/02/2014WO2014158388A1 Package-on-package structures
10/02/2014WO2014158339A1 Thermal dissipation system
10/02/2014WO2014158308A1 Encapsulation of semiconductor device with multilayer barrier using pecvd or atomic layer deposition
10/02/2014WO2014158250A1 Stacked wafer with coolant channels
10/02/2014WO2014157581A1 Laminate and circuit board
10/02/2014WO2014157520A1 Protective film formation composite sheet, protective film-equipped chip, and method for fabricating protective film-equipped chip
10/02/2014WO2014157378A1 Thermally conductive sheet
10/02/2014WO2014157178A1 Power module
10/02/2014WO2014157147A1 Cooling apparatus
10/02/2014WO2014157112A1 Substrate for power modules, substrate with heat sink for power modules, and power module
10/02/2014WO2014156927A1 Resin sheet for electronic device sealing and production method for electronic device package
10/02/2014WO2014156926A1 Resin sheet for electronic device sealing and production method for electronic device package
10/02/2014WO2014156925A1 Resin sheet for electronic device sealing and production method for electronic device package
10/02/2014WO2014156923A1 Manufacturing method for semiconductor device
10/02/2014WO2014156883A1 Sealing sheet, method for producing semiconductor device, and substrate provided with sealing sheet
10/02/2014WO2014156882A1 Underfill material, sealing sheet, and method for producing semiconductor device
10/02/2014WO2014156837A1 Hollow sealing resin sheet and production method for hollow package
10/02/2014WO2014156835A1 Apparatus and method for producing (metallic plate)-(ceramic plate) laminate, and apparatus and method for producing substrate for power modules
10/02/2014WO2014156834A1 Hollow sealing resin sheet and production method for hollow package
10/02/2014WO2014156833A1 Hollow sealing resin sheet and production method for hollow package
10/02/2014WO2014156779A1 Thermosetting sealing sheet and thermosetting sealing sheet with separator
10/02/2014WO2014156777A1 Hollow electronic device sealing sheet and production method for hollow electronic device package
10/02/2014WO2014156775A1 Sealing sheet, production method for sealing sheet, and production method for electronic component package
10/02/2014WO2014156393A1 Insulating ceramic paste, ceramic electronic component and method for producing same
10/02/2014WO2014156223A1 High-frequency circuit device
10/02/2014WO2014156171A1 Circuit substrate reliably operating when controlling plurality of electron beams
10/02/2014WO2014156029A1 Semiconductor package and semiconductor device
10/02/2014WO2014156025A1 Semiconductor device and heat-dissipating mechanism
10/02/2014WO2014155977A1 Heat dissipating sheet and heat dissipating structural body using same
10/02/2014WO2014155974A1 Semiconductor device
10/02/2014WO2014155898A1 Insulating sheet and manufacturing method for same
10/02/2014WO2014155756A1 Adhesive sheet, composite sheet for forming protective film, and method for manufacturing chip with protective film
10/02/2014WO2014155542A1 Vehicular power conversion device
10/02/2014WO2014155541A1 Power conversion apparatus and cooling apparatus
10/02/2014WO2014155535A1 Electronic circuit component mounting system
10/02/2014WO2014155478A1 Semiconductor device and method for manufacturing same
10/02/2014WO2014155455A1 Wiring board
10/02/2014WO2014154637A1 Process for connecting joining partners by means of an isothermic solidifying reaction in order to form an in-bi-ag connecting layer and corresponding arrangement of joining partners
10/02/2014WO2014048680A9 Isolating conduit for a dielectric fluid
10/02/2014US20140295661 Passivated Copper Chip Pads
10/02/2014US20140295624 Package with Passive Devices and Method of Forming the Same
10/02/2014US20140295622 Novel build-up package for integrated circuit devices, and methods of making same
10/02/2014US20140295621 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
10/02/2014US20140295620 Method of manufacturing semiconductor device having plural semiconductor chips stacked one another
10/02/2014US20140295619 Bump, method for forming the bump, and method for mounting substrate having the bump thereon
10/02/2014US20140295618 Methods of Manufacturing Flip Chip Semiconductor Packages Using Double-Sided Thermal Compression Bonding
10/02/2014US20140293751 Through-wafer via device and method of manufacturing the same
10/02/2014US20140293548 Electric power semiconductor device and method for producing same
10/02/2014US20140293543 Silicon-Based Heat Dissipation Device For Heat-Generating Devices
10/02/2014US20140293542 Thermal mgmt. device for high-heat flux electronics
10/02/2014US20140293541 Heat pipe heat sink for high power density
10/02/2014US20140293529 Method Apparatus and Material for Radio Frequency Passives and Antennas
10/02/2014US20140292430 Electronic device, method for producing the same, and oscillator
10/02/2014US20140292415 Semiconductor device heat dissipation using high thermal conductivity dielectric layer
10/02/2014US20140291872 Gel Having Improved Thermal Stability
10/02/2014US20140291871 Impedance controlled packages with metal sheet or 2-layer rdl
10/02/2014US20140291870 Resin composition, resin composition sheet, semiconductor device and production method therefor
10/02/2014US20140291869 Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same
10/02/2014US20140291868 Stack type semiconductor package
10/02/2014US20140291867 Apparatus and method to attach a wireless communication device into a semiconductor package
10/02/2014US20140291866 Embedded die-down package-on-package device
10/02/2014US20140291864 Semiconductor device having groove-shaped via-hole
10/02/2014US20140291863 Semiconductor device having groove-shaped via-hole
10/02/2014US20140291862 Semiconductor device having groove-shaped via-hole
10/02/2014US20140291861 Semiconductor device having groove-shaped via-hole
10/02/2014US20140291860 Semiconductor-on-insulator integrated circuit with interconnect below the insulator
10/02/2014US20140291859 Electronic component built-in substrate and method of manufacturing the same
10/02/2014US20140291858 Method for making a photolithography mask intended for the formation of contacts, mask and integrated circuit corresponding thereto
10/02/2014US20140291857 Stacked structure and method of manufacturing the stacked structure
10/02/2014US20140291856 Tsv layout structure and tsv interconnect structure, and fabrication methods thereof
10/02/2014US20140291855 Semiconductor device and semiconductor system including the same
10/02/2014US20140291854 Semiconductor packages having tsv and adhesive layer
10/02/2014US20140291853 Package structure of a chip and a substrate
10/02/2014US20140291851 Lead pin for package substrate
10/02/2014US20140291850 Method for manufacturing electronic devices
10/02/2014US20140291849 Multi-Level Semiconductor Package
10/02/2014US20140291848 Semiconductor device
10/02/2014US20140291847 Methods of forming a barrier system containing an alloy of metals introduced into the barrier system, and an integrated circuit product containing such a barrier system
10/02/2014US20140291846 Array substrate and fanout line structure of the array substrate
10/02/2014US20140291845 Semiconductor device and method for manufacturing semiconductor device
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