Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2014
10/09/2014DE102013206225A1 Optoelektronisches Bauelement und Verfahren zu seiner Herstellung Optoelectronic component and process for its preparation
10/09/2014DE102013206032A1 Elektronische Komponente für ein Kraftfahrzeug Electronic component for a motor vehicle
10/09/2014DE102013204874A1 Elektrisch betriebenes Kraftfahrzeug mit einer Motorsteuerungseinrichtung Electrically driven vehicle with an engine control device
10/09/2014DE102013110812B3 Verfahren zur Herstellung eines weitergebildeten Metallformkörpers und Verfahren zur Herstellung einer Leistungshalbleitereinrichtung mit einer Lotverbindung diesen weitergebildeten Metallformkörper verwendend. A method for producing a metal shaped article and further developed method of manufacturing a power semiconductor device with a solder joint that further formed using metal molding.
10/09/2014DE102013103370A1 Verfahren zum Einbringen von Durchbrechungen in ein Glassubstrat sowie ein derart hergestelltes Glassubstrat A method for introducing perforations into a glass substrate and a glass substrate thus produced
10/09/2014DE102010016696B4 Halbleiter-Bauelement Semiconductor component
10/09/2014DE102010000518B4 Verfahren zur Herstellung einer Halbleiteranordnung A process for producing a semiconductor device
10/08/2014EP2787530A1 High-frequency semiconductor package and high-frequency semiconductor device
10/08/2014EP2787529A1 Semiconductor device, and on-board power conversion device
10/08/2014EP2787526A1 Semiconductor device fabrication method
10/08/2014EP2786835A1 Device for and method of welding by means of ultrasound with a movable limiting surface
10/08/2014EP2786408A1 Tag forgery protection
10/08/2014EP2785476A1 Method of fabricating a heat sink
10/07/2014US8856722 System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
10/07/2014US8856569 Microarchitecture controller for thin-film thermoelectric cooling
10/07/2014US8855581 Integrated circuit package with transformer
10/07/2014US8854830 Semiconductor package substrate in particular for MEMS devices
10/07/2014US8854820 Power module
10/07/2014US8854807 Converter arrangement with an air cooling system
10/07/2014US8854784 Integrated FET and reflowable thermal fuse switch device
10/07/2014US8854590 Display device
10/07/2014US8854494 Portable hand-held device having stereoscopic image camera
10/07/2014US8854492 Portable device with image sensors and multi-core processor
10/07/2014US8854277 Millimetre-wave radio antenna module
10/07/2014US8854152 High-frequency module including a conductor with a slot therein and a conductive wire crossing over the slot and physically contacting the conductor
10/07/2014US8853868 Semiconductor structures including sub-resolution alignment marks
10/07/2014US8853867 Encapsulant for a semiconductor device
10/07/2014US8853866 Semiconductor device and stacked-type semiconductor device
10/07/2014US8853865 Semiconductor device with overlapped lead terminals
10/07/2014US8853864 Semiconductor device and a method of manufacturing the same
10/07/2014US8853863 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
10/07/2014US8853862 Contact structures for semiconductor transistors
10/07/2014US8853861 Semiconductor device having groove-shaped via-hole
10/07/2014US8853860 Method and apparatus for reduced parasitics and improved multi-finger transistor thermal impedance
10/07/2014US8853859 Passivation for wafer level—chip-scale package devices
10/07/2014US8853858 Curing low-k dielectrics for improving mechanical strength
10/07/2014US8853857 3-D integration using multi stage vias
10/07/2014US8853856 Methodology for evaluation of electrical characteristics of carbon nanotubes
10/07/2014US8853854 Semiconductor package and method of manufacturing the same
10/07/2014US8853853 Bump structures
10/07/2014US8853851 Semiconductor device and method of manufacturing the same
10/07/2014US8853850 MEMS packaging scheme using dielectric fence
10/07/2014US8853848 Interconnection structure, apparatus therewith, circuit structure therewith
10/07/2014US8853846 Semiconductor device and a manufacturing method of the same
10/07/2014US8853845 Component with encapsulated active element and implantable medical advice incorporating such a component
10/07/2014US8853844 Multifunction semiconductor package structure and method of manufacturing the same
10/07/2014US8853843 Modular low stress package technology
10/07/2014US8853842 Semiconductor device sealed with a resin molding
10/07/2014US8853841 Lead frame which includes terminal portion having through groove covered by lid portion, semiconductor package, and manufacturing method of the same
10/07/2014US8853840 Semiconductor package with inner and outer leads
10/07/2014US8853839 Air-release features in cavity packages
10/07/2014US8853838 Lead frame and flip packaging device thereof
10/07/2014US8853837 Optoisolator leadframe assembly
10/07/2014US8853836 Integrated circuit package and method of making the same
10/07/2014US8853835 Chip arrangements, a chip package and a method for manufacturing a chip arrangement
10/07/2014US8853834 Leadframe-type semiconductor package having EMI shielding layer connected to ground
10/07/2014US8853833 Electromagnetic shield and associated methods
10/07/2014US8853832 Methods and apparatus for reducing coupling in a MOS device
10/07/2014US8853831 Interconnect structure and method for forming the same
10/07/2014US8853830 System, structure, and method of manufacturing a semiconductor substrate stack
10/07/2014US8853820 Crosslinkable dielectrics and methods of preparation and use thereof
10/07/2014US8853819 Semiconductor structure with passive element network and manufacturing method thereof
10/07/2014US8853818 3D NAND flash memory
10/07/2014US8853799 Vertically integrated systems
10/07/2014US8853795 Semiconductor device with appraisal circuitry
10/07/2014US8853784 ESD protection circuit
10/07/2014US8853783 ESD protection circuit
10/07/2014US8853778 Devices for shielding a signal line over an active region
10/07/2014US8853760 Integrated circuit with protection from copper extrusion
10/07/2014US8853757 Forming thick metal interconnect structures for integrated circuits
10/07/2014US8853734 Curable epoxy resin composition
10/07/2014US8853733 Light emitting diode package and method for manufacturing the same
10/07/2014US8853722 Semiconductor light-emitting device and method for forming the same
10/07/2014US8853721 Light-emitting diode with wire-piercing lead frame
10/07/2014US8853708 Stacked multi-die packages with impedance control
10/07/2014US8853707 High voltage cascoded III-nitride rectifier package with etched leadframe
10/07/2014US8853706 High voltage cascoded III-nitride rectifier package with stamped leadframe
10/07/2014US8853695 Thin film transistor substrate including source-drain electrodes formed from a nitrogen-containing layer or an oxygen/nitrogen-containing layer
10/07/2014US8853694 Chip on film package including test pads and semiconductor devices including the same
10/07/2014US8853692 Test structure and method for bond pad quality monitoring
10/07/2014US8853564 Air cavity package configured to electrically couple to a printed circuit board and method of providing same
10/07/2014US8853559 Insulation circuit board, and power semiconductor device or inverter module using the same
10/07/2014US8853558 Interconnect structure
10/07/2014US8853552 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
10/07/2014US8853312 Resin composition and semiconductor device produced by using the same
10/07/2014US8853079 Fuse device
10/07/2014US8853077 Through silicon via packaging structures and fabrication method
10/07/2014US8853072 Methods of forming through-substrate interconnects
10/07/2014US8853071 Electrical connectors and methods for forming the same
10/07/2014US8853057 Method for fabricating semiconductor devices
10/07/2014US8853007 In-plane silicon heat spreader and method therefor
10/07/2014US8853006 Method of manufacturing semiconductor device and semiconductor device
10/07/2014US8853005 Method for manufacturing semiconductor device
10/07/2014US8853004 Method of manufacturing semiconductor device
10/07/2014US8853003 Wafer level chip scale package with thick bottom metal exposed and preparation method thereof
10/07/2014US8853002 Methods for metal bump die assembly
10/07/2014US8853001 Semiconductor device and method of forming pad layout for flipchip semiconductor die
10/07/2014US8853000 Package on package structrue and method for manufacturing same
10/07/2014US8852999 System-in-a-package based flash memory card
10/07/2014US8852986 Integrated circuit package system employing resilient member mold system technology
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