Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/03/2010CN101877339A Leadframe
11/03/2010CN101877338A Semiconductor package and method for manufacturing the same
11/03/2010CN101877337A Semiconductor device and method of manufacturing the semiconductor device
11/03/2010CN101877336A Integrated circuit structure and method for forming the same
11/03/2010CN101877335A Gradient type anisotropic conductive film and manufacturing method thereof
11/03/2010CN101877334A Semiconductor device with heat radiation and gain
11/03/2010CN101877333A Multilayer packaging substrate, manufacture method thereof, and packaging structure of light-emitting semiconductor
11/03/2010CN101877332A Novel plate pressure welding type multichip packaging ceramic package
11/03/2010CN101877331A Flexible substrate for display panel and manufacturing method thereof
11/03/2010CN101877330A Sapphire substrate with period structure
11/03/2010CN101877318A Frame type direct copper-ceramic bonding plate and manufacturing method thereof
11/03/2010CN101876427A Heat dissipation device of LED lamp
11/03/2010CN101876426A Bridge radiating device for LED street lamp
11/03/2010CN101876410A Modularized LED street lamp
11/03/2010CN101515586B Radio frequency SOI LDMOS device with close body contact
11/03/2010CN101512760B Thermal interface structure and method for manufacturing the same
11/03/2010CN101510535B Output/input unit for implementing chip and method for manufacturing chip
11/03/2010CN101510529B Pixel structure and manufacturing method thereof
11/03/2010CN101496166B Semiconductor interconnect having adjacent reservoir for bonding and method for formation
11/03/2010CN101494201B Thin-film transistor liquid crystal display array substrate structure and method of manufacturing the same
11/03/2010CN101452938B Programmable non-volatile memory chip unit
11/03/2010CN101436632B LED chip component with heat-dissipating substrate and preparation method thereof
11/03/2010CN101431072B Semiconductor integrated circuit
11/03/2010CN101425527B Solid-state imaging device, production method and drive method thereof, and camera
11/03/2010CN101416309B Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
11/03/2010CN101416307B Cooler
11/03/2010CN101410965B Method for eliminating aluminum terminal pad material in semiconductor devices
11/03/2010CN101409264B Package for semiconductor device
11/03/2010CN101369606B Thin-film transistor panel having structure that suppresses characteristic shifts and method for manufacturing the same
11/03/2010CN101345223B Semiconductor devices, semiconductor modules and methods for cooling semiconductor devices
11/03/2010CN101335316B LED encapsulation having cooling pin and manufacturing method therefor
11/03/2010CN101309550B Circuit board and electronic device applying the same
11/03/2010CN101295673B Method for forming bit line contact plug and transistor structure
11/03/2010CN101281735B Gradation voltage selection circuit and display control circuit
11/03/2010CN101279306B Glue solution injector driven by electromagnetic expulsive force
11/03/2010CN101276797B Electric optical device
11/03/2010CN101273452B Semiconductor packages
11/03/2010CN101217141B IC package and method of manufacturing the same
11/03/2010CN101155469B Circuit board and method for manufacturing semiconductor modules and circuit boards
11/03/2010CN101130861B Tin phosphate barrier film, method and apparatus
11/03/2010CN101127357B Passivation layer structure, thin film transistor part and manufacturing method of passivation layer
11/03/2010CN101123231B Encapsulation structure for wafer chip dimension of micro mechanical-electrical system and its making method
11/03/2010CN101071814B Semiconductor memory device having layout area reduced
11/03/2010CN101068009B Power module
11/03/2010CN101014234B Buckle structure for radiating fin
11/02/2010US7827511 Power distribution network of an integrated circuit
11/02/2010US7827413 Extraction of a private datum to authenticate an integrated circuit
11/02/2010US7826229 Component retention with distributed compression
11/02/2010US7826227 Heat dissipation device
11/02/2010US7826226 Electric power converter and mounting structure of semiconductor device
11/02/2010US7826225 Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator
11/02/2010US7826127 MEMS device having a recessed cavity and methods therefor
11/02/2010US7825529 Semiconductor device and display device having alignment mark
11/02/2010US7825528 epoxidized novolak having a biphenyl diphenol in the molecule and a 4,4'-dihydroxy biphenyl; curing agent is methylenediphenol or a phenol-formaldehyde oligomer; silica filler
11/02/2010US7825527 Return loss techniques in wirebond packages for high-speed data communications
11/02/2010US7825526 Fine-pitch routing in a lead frame based system-in-package (SIP) device
11/02/2010US7825525 Layout and process to contact sub-lithographic structures
11/02/2010US7825524 QFN housing having optimized connecting surface geometry
11/02/2010US7825523 Semiconductor chip having bond pads
11/02/2010US7825522 Hybrid bump capacitor
11/02/2010US7825521 Stack die packages
11/02/2010US7825520 Stacked redistribution layer (RDL) die assembly package
11/02/2010US7825519 Method and device for wafer scale packaging of optical devices using a scribe and break process
11/02/2010US7825518 Semiconductor device and method of manufacturing the same
11/02/2010US7825517 Method for packaging semiconductor dies having through-silicon vias
11/02/2010US7825516 Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures
11/02/2010US7825515 Semiconductor device, display device, and method of manufacturing semiconductor device
11/02/2010US7825514 Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
11/02/2010US7825513 Electrode structure in semiconductor device and related technology
11/02/2010US7825512 Electronic package with compliant electrically-conductive ball interconnect
11/02/2010US7825511 Undercut-free BLM process for Pb-free and Pb-reduced C4
11/02/2010US7825510 Method for filling a contact hole and integrated circuit arrangement with contact hole
11/02/2010US7825509 Transducer package with transducer die unsupported by a substrate
11/02/2010US7825508 Multi-die DC-DC buck power converter with efficient packaging
11/02/2010US7825506 Semiconductor module including semiconductor chips in a plastic housing in separate regions
11/02/2010US7825505 Semiconductor package and method therefor
11/02/2010US7825504 Semiconductor package and multi-chip semiconductor package using the same
11/02/2010US7825503 Covered devices in a semiconductor package
11/02/2010US7825502 Semiconductor die packages having overlapping dice, system using the same, and methods of making the same
11/02/2010US7825501 High bond line thickness for semiconductor devices
11/02/2010US7825500 Manufacturing process and structure for embedded semiconductor device
11/02/2010US7825499 Semiconductor package and trenched semiconductor power device using the same
11/02/2010US7825498 Semiconductor device
11/02/2010US7825497 Method of manufacture of contact plug and interconnection layer of semiconductor device
11/02/2010US7825491 Light-emitting device using voltage switchable dielectric material
11/02/2010US7825488 Isolation structures for integrated circuits and modular methods of forming the same
11/02/2010US7825487 Guard ring structures and method of fabricating thereof
11/02/2010US7825477 Semiconductor device with localized stressor
11/02/2010US7825476 Method of fabricating polycrystalline silicon, TFT fabricated using the same, method of fabricating the TFT, and organic light emitting diode display device including the TFT
11/02/2010US7825475 Mixed voltage tolerant input/output electrostatic discharge devices
11/02/2010US7825474 Insulated-gate semiconductor device and PN junction diodes
11/02/2010US7825473 Initial-on SCR device for on-chip ESD protection
11/02/2010US7825468 Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
11/02/2010US7825440 Suspended-membrane/suspended-substrate monolithic microwave integrated circuit modules
11/02/2010US7825431 Reduced mask configuration for power MOSFETs with electrostatic discharge (ESD) circuit protection
11/02/2010US7825429 Tunable voltage isolation ground to ground ESD clamp
11/02/2010US7825421 Semiconductor light emitting device
11/02/2010US7825410 Semiconductor device
11/02/2010US7825409 GaN crystal substrate
11/02/2010US7825408 Semiconductor device
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