Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/03/2010CN201623082U Normal chip packaging structure with exposed substrate and totally-encapsulated heat sink
11/03/2010CN201623081U External connection heat radiator encapsulation structure of printed circuit board chip reverse mounting reverse T-shaped heat radiation block
11/03/2010CN201623080U Packaging structure of printed circuit board with flip chip, radiating block with locking hole and convex column connected with external radiating board
11/03/2010CN201623079U Package structure of convex column external-radiator of heat dissipation part with locking hole of resin circuit board chip flip
11/03/2010CN201623078U Package structure for radiating block convex post externally connected with radiating plate, inversed on chip with exposed inner lead and provided with locking hole
11/03/2010CN201623077U Package structure of external heat-dissipating plate of heat dissipation part of resin circuit board chip flip
11/03/2010CN201623076U Package structure for radiating block convex post externally connected with radiating cap, inversed on chip with exposed inner lead and provided with locking hole
11/03/2010CN201623075U Package structure of external heat-dissipating plate of heat dissipation part with locking hole of resin circuit board chip flip
11/03/2010CN201623074U Package structure of external radiator of heat dissipation part with locking hole of resin circuit board chip flip
11/03/2010CN201623073U External connection heat radiation cap encapsulation structure of resin circuit board chip positive mounting lock hole heat radiation block convex column
11/03/2010CN201623072U Package structure of external heat-dissipating cap of heat dissipation part with locking hole of resin circuit board chip normal
11/03/2010CN201623071U Package structure for radiating block externally connected with radiating plate and inversed on chip with embedded inner lead
11/03/2010CN201623070U Package structure for inverted T radiating block externally connected with radiator, inversed on chip with exposed inner lead and provided with locking hole
11/03/2010CN201623069U Package structure of external heat-dissipating plate of heat dissipation part of resin circuit board chip normal
11/03/2010CN201623068U Packaging structure of printed circuit board with chip and inverted radiating block connected with external radiator
11/03/2010CN201623067U Package structure of external heat-dissipating cap of heat dissipation part of resin circuit board chip normal
11/03/2010CN201623066U Packaging structure of printed circuit board with flip chip and radiating block connected with external radiating cap
11/03/2010CN201623065U Package structure of external radiator of heat dissipation part of resin circuit board chip flip
11/03/2010CN201623064U Package structure for inverted T radiating block externally connected with radiator and inversed on chip with exposed inner lead
11/03/2010CN201623063U Package structure of convex-column external heat-dissipating plate of heat dissipation part with locking hole of resin circuit board chip flip
11/03/2010CN201623062U Package structure of external heat-dissipating cap of heat dissipation part of resin circuit board chip flip
11/03/2010CN201623061U Normal chip packaging structure with embedded substrate and heat sink having locking hole
11/03/2010CN201623060U Normal chip packaging structure with embedded substrate, and heat sink having locking hole and protruded surface
11/03/2010CN201623059U Normal chip packaging structure with embedded substrate and inverted T-shaped heat sink having locking hole
11/03/2010CN201623058U Paddle imbedded chip packaging structure with inverted-T shaped radiating block
11/03/2010CN201623057U Normal chip packaging structure with embedded substrate and rectangular heat sink having locking hole
11/03/2010CN201623056U Paddle imbedded chip packaging structure with rectangular radiating block
11/03/2010CN201623055U Printed circuit board chip positive mounting heat radiation block surface protruding encapsulation structure with locking hole
11/03/2010CN201623054U Normal chip packaging structure with embedded substrate and heat sink having protruded surface
11/03/2010CN201623053U Normal chip packaging structure with embedded substrate and inverted-T-shaped totally-encapsulated heat sink
11/03/2010CN201623052U Normal chip packaging structure with embedded substrate and totally encapsulated heat sink
11/03/2010CN201623051U Packaging structure of printed circuit board with chip and radiating block with locking hole
11/03/2010CN201623050U Normal chip packaging structure with exposed substrate and inverted T-shaped totally-encapsulated heat sink
11/03/2010CN201623049U Normal chip packaging structure with exposed substrate and heat plug having locking hole and projecting surface
11/03/2010CN201623048U Normal chip packaging structure with exposed substrate and inverted T-shaped heat sink
11/03/2010CN201623047U Package structure of heat dissipation part of resin circuit board chip normal
11/03/2010CN201623046U Package structure of rectangular heat dissipation part with locking hole of resin circuit board chip normal
11/03/2010CN201623045U Package structure for inverted T radiating block inversed on chip with embedded inner lead and provided with locking hole
11/03/2010CN201623044U Surface protruded package structure of heat dissipation part of resin circuit board chip normal
11/03/2010CN201623043U Packaging structure with exposed inner pin, a flip chip and a heat dissipating block
11/03/2010CN201623042U Package structure for rectangular radiating block inversed on chip with embedded inner lead
11/03/2010CN201623041U Surface protruded package structure of heat dissipation part with locking hole of resin circuit board chip normal
11/03/2010CN201623040U Completely-coated package structure for inverted T radiating block inversed on chip with exposed inner lead
11/03/2010CN201623039U Package structure of inversed T-shaped heat dissipation part with locking hole of resin circuit board chip normal
11/03/2010CN201623038U Package structure for radiating block with convex surface inversed on chip with exposed inner lead
11/03/2010CN201623037U Package structure for T radiating block inversed on chip with embedded inner lead and provided with locking hole
11/03/2010CN201623036U Package structure of inversed T-shaped heat dissipation part of resin circuit board chip normal
11/03/2010CN201623035U Completely-coated package structure for radiating block inversed on chip with embedded inner lead
11/03/2010CN201623034U Totally-coated package structure of heat dissipation part of resin circuit board chip normal
11/03/2010CN201623033U Packaging structure with exposed inner pin, flip chip and heat dissipating block with T-shaped locking hole
11/03/2010CN201623032U Packaging structure with exposed inner pin, flip chip and heat dissipating block with locking hole
11/03/2010CN201623031U Package structure for radiating block inversed on chip with embedded inner lead
11/03/2010CN201623030U Package structure of rectangular heat dissipation part of resin circuit board chip normal
11/03/2010CN201623029U Completely-coated package structure for inverted T radiating block inversed on chip with embedded inner lead
11/03/2010CN201623028U Package structure of heat dissipation part with locking hole of resin circuit board chip normal
11/03/2010CN201623027U Totally-coated package structure of inversed T-shaped heat dissipation part of resin circuit board chip normal
11/03/2010CN201623026U Igbt plate type water cooler
11/03/2010CN201623025U Package structure for radiating block externally connected with radiator, inversed on chip with exposed inner lead and provided with locking hole
11/03/2010CN201623024U Packaging structure of printed circuit board with chip and radiating block connected with external radiating cap
11/03/2010CN201623023U Inner foot-imbedded chip-inverted heat dissipation cap packaging structure externally connected with locking hole and heat dissipation block and protruding column
11/03/2010CN201623022U Packaging structure of printed circuit board with flip chip connected with external radiating board
11/03/2010CN201623021U Inner foot-exposed chip-inverted radiator packaging structure externally connected with locking hole and heat dissipation block and protruding column
11/03/2010CN201623020U Upside-down mounting rectangular type heat radiation block external connecting heat radiator encapsulation structure with inner pin exposing chip
11/03/2010CN201623019U Semiconductor device for novel integrated circuit
11/03/2010CN201623018U Power semiconductor device with deformation compensation face heat dissipation structure
11/03/2010CN201623017U Superhigh-voltage high-power thyristor ignition anode module
11/03/2010CN201622517U Machine frame fan cooling system
11/03/2010CN201617487U Chair capable of adjusting temperature
11/03/2010CN1996610B Thin film transistor array panel and manufacturing thereof
11/03/2010CN1969382B Heat dissipating device with enhanced boiling/condensation structure
11/03/2010CN1953222B Light-emitting element with at least one light-emitting crystal
11/03/2010CN1909238B Light emitting device having protection element and method of manufacturing the light emitting device
11/03/2010CN1875483B Process for forming a dielectric on a copper-containing metallization and capacitor arrangement
11/03/2010CN1809974B Capacitor-related systems for addressing package/motherboard resonance
11/03/2010CN1801391B Memory device and circuit
11/03/2010CN1794443B Package for semiconductor device
11/03/2010CN1776895B Integrated passive devices
11/03/2010CN1551708B Multi-layer wiring board
11/03/2010CN1494106B Method and device used for protecting wiring and integrated circuit device
11/03/2010CN101878528A Electronic circuit composed of sub-circuits and method for producing the same
11/03/2010CN101878527A Wafer level packaging using flip chip mounting
11/03/2010CN101878526A Robust MEMS flow die with integrated protective flow channel
11/03/2010CN101878524A Source driver, source driver manufacturing method, and liquid crystal module
11/03/2010CN101878523A Method and device for cutting substrate
11/03/2010CN101877958A Electronic device having electromagnetic shielding and heat radiation and assembling method thereof
11/03/2010CN101877956A Spray cooling heat dissipation recovery system
11/03/2010CN101877683A Capacitive isolation circuitry
11/03/2010CN101877583A Buffer device and static discharge protection circuit
11/03/2010CN101877356A Semiconductor device and method of manufacturing the same
11/03/2010CN101877353A Semiconductor device and a production method therefor
11/03/2010CN101877349A Semiconductor module and portable device
11/03/2010CN101877348A Embedded chip package with chips stacked in an interconnecting laminate
11/03/2010CN101877347A Flexible and thin image sensing module with electromagnetic interference prevention and circuit board module
11/03/2010CN101877346A Static discharge protection system and static discharge protection circuit
11/03/2010CN101877345A Semiconductor device and method for manufacturing metallic shielding plate
11/03/2010CN101877344A Connection hole test structure and method for preparing transmission electron microscopy
11/03/2010CN101877343A T-connections, methodology for designing T-connections, and compact modeling of T-connections
11/03/2010CN101877342A Circuit arrangement and design method
11/03/2010CN101877341A Reworkable electronic device assembly and method
11/03/2010CN101877340A Conductive matrix for z axle interconnection piece
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