Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/04/2010DE202010011784U1 Von Druckgefälle getriebener schleifenförmiger Niederdruck-Thermosiphonkühler Of pressure gradient driven loop-shaped low-pressure Thermosiphonkühler
11/04/2010DE202010011783U1 Von Druckgefälle getriebener dünner Niederdruck-Thermosiphonkühler Of pressure gradient driven thin low-pressure Thermosiphonkühler
11/04/2010DE202010010983U1 Ventilator-Selbstkühlung mit Wärmerohr Fan cooling with heat pipe
11/04/2010DE112008003510T5 Im Mikro- und/oder Nanobereich liegende Neuromorphe integrierte Hybridschaltung In the micro- and / or nano-scale lying Neuromorphic hybrid integrated circuit
11/04/2010DE112007003652T5 Kühlmantel zum Kühlen eines elektronischen Bauelements auf einer Platte Cooling jacket for cooling an electronic component on a plate
11/04/2010DE102009000883B4 Substrat zur Aufnahme mindestens eines Bauelements und Verfahren zur Herstellung eines Substrats Substrate for receiving at least one device and process for the preparation of a substrate
11/03/2010EP2247172A1 Cooling system, cooling board and assembly with cooling system
11/03/2010EP2246983A1 Supply cell and integrated circuit comprising such supply cells.
11/03/2010EP2246884A1 Wiring board for high frequency, package for containing electronic component, electronic device and communication apparatus
11/03/2010EP2246881A2 Joining structure and a substrate-joining method using the same
11/03/2010EP2246879A1 Method for manufacturing flexible semiconductor device and multilayer film used therein
11/03/2010EP2245913A1 Method for arranging cooling for a component and a cooling element
11/03/2010EP2245677A2 Heat exchanger for a thermoelectric thin layer element
11/03/2010EP2245660A2 Nanoscale metal paste for interconnect and method of use
11/03/2010EP1733424B1 A semiconductor apparatus
11/03/2010EP1672685B1 Substrate for device bonding, device bonded substrate, and method for producing same
11/03/2010EP1399269B1 Waveform generator for microdeposition control system
11/03/2010EP1399267B1 Microdeposition apparatus
11/03/2010EP1371092B2 Method for structuring a flat substrate consisting of a glass-type material
11/03/2010EP1223613B1 Electrode structure for semiconductor device, manufacturing method and apparatus for the same
11/03/2010EP0985007B2 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same
11/03/2010CN201623625U Integrated power component simultaneously press-connected with two elements
11/03/2010CN201623176U High-power LED structure
11/03/2010CN201623159U Ultra-fast switch-recovering module
11/03/2010CN201623158U Lead frame used for packaging semi-conductors and capable of increasing wire welding precision and speed
11/03/2010CN201623157U Lead bonding reinforcing structure
11/03/2010CN201623156U QFN/DFN chip encapsulating structure without paddles
11/03/2010CN201623155U Veneer SMA diode
11/03/2010CN201623154U Printed circuit board chip positive mounting encapsulation structure with rectangular heat radiation block
11/03/2010CN201623153U Combination radiator stand fit for a plurality of controllable silicon in serial connection
11/03/2010CN201623152U Heat radiator
11/03/2010CN201623151U Resin wiring board chip mounted heat sink packaging structure externally connected with locking hole and heat dissipation block and protruding column
11/03/2010CN201623150U Package structure for rectangular radiating block externally connected with radiator, inversed on chip with exposed inner lead and provided with locking hole
11/03/2010CN201623149U Packaging structure of printed circuit board chip flip inverted T-shaped locking hole radiating block with external radiator
11/03/2010CN201623148U Packaging structure of printed circuit board with flip chip and radiating block with protruding surface
11/03/2010CN201623147U Normal chip packaging structure with exposed substrate and heat sink having locking hole and external heat-dissipating cap connected with heat sink through boss
11/03/2010CN201623146U Packaging structure for a vertically-mounted rectangle radiating block externally connected with a radiating cover and having a chip embedded on a base
11/03/2010CN201623145U Normal chip packaging structure with embedded substrate and rectangular heat sink having locking hole and connected with external radiator
11/03/2010CN201623144U Package structure of heat dissipation part with locking hole of resin circuit board chip flip
11/03/2010CN201623143U Normal chip packaging structure with exposed substrate and heat sink having locking hole and external radiator connected with heat sink through boss
11/03/2010CN201623142U Normal chip packaging structure with embedded substrate and inverted-T-shaped heat sink connected with external radiator
11/03/2010CN201623141U Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external heat-dissipating plate
11/03/2010CN201623140U Normal chip packaging structure with embedded substrate and heat sink connected with external heat-dissipating plate
11/03/2010CN201623139U Surface protruded package structure of heat dissipation part with locking hole of resin circuit board chip flip
11/03/2010CN201623138U Totally-coated package structure of inversed T-shaped heat dissipation part of resin circuit board chip flip
11/03/2010CN201623137U Packaging structure for printed circuit board chip upside-down mounting rectangle heat radiation block
11/03/2010CN201623136U Packaging structure of printed circuit board chip flip inverted T-shaped radiating block
11/03/2010CN201623135U Normal chip packaging structure with exposed substrate and rectangular heat sink connected with external radiator
11/03/2010CN201623134U Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiator via boss
11/03/2010CN201623133U Packaging structure of printed circuit board with flip chip and rectangular radiating block with locking hole
11/03/2010CN201623132U Package structure of rectangular heat dissipation part with locking hole of resin circuit board chip flip
11/03/2010CN201623131U Normal chip packaging structure with embedded substrate and heat sink connected with external radiating cap
11/03/2010CN201623130U Normal chip packaging structure with exposed substrate and heat sink having locking hole and connected with external heat-dissipating plate
11/03/2010CN201623129U Normal chip packaging structure with exposed substrate and heat sink having locking hole and connected with external radiator
11/03/2010CN201623128U Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiator
11/03/2010CN201623127U Normal chip packaging structure with exposed substrate and heat sink having locking hole and external heat-dissipating plate connected with heat sink through boss
11/03/2010CN201623126U Package structure of inversed T-shaped heat dissipation part of resin circuit board chip flip
11/03/2010CN201623125U Normal chip packaging structure with embedded substrate and heat sink connected with external radiator
11/03/2010CN201623124U Surface protruded package structure of heat dissipation part of resin circuit board chip flip
11/03/2010CN201623123U Package structure of rectangular heat dissipation part of resin circuit board chip flip
11/03/2010CN201623122U Packaging structure of printed circuit board chip flip belt locking hole radiating block
11/03/2010CN201623121U Normal chip packaging structure with embedded substrate and inverted-T-shaped heat sink having locking hole and connected with external radiator
11/03/2010CN201623120U Packaging structure of printed circuit board chip flip belt radiating block
11/03/2010CN201623119U Packaging structure for a vertically-mounted rectangle radiating block externally connected with a radiator and having a chip embedded in a base
11/03/2010CN201623118U Totally-coated package structure of heat dissipation part of resin circuit board chip flip
11/03/2010CN201623117U Fully-enclosed Packaging structure of printed circuit board chip flip inverted T-shaped radiating block
11/03/2010CN201623116U Package structure of inversed T-shaped heat dissipation part with locking hole of resin circuit board chip flip
11/03/2010CN201623115U Normal chip packaging structure with exposed substrate and heat sink having locking hole and connected with external heat-dissipating cap
11/03/2010CN201623114U Normal chip packaging structure with exposed substrate and heat plug connected with external heat-dissipating plate
11/03/2010CN201623113U Package structure for radiating block externally connected with radiator and inversed on chip with embedded inner lead
11/03/2010CN201623112U Package structure for radiating block externally connected with radiating plate and inversed on chip with exposed inner lead
11/03/2010CN201623111U Package structure of external radiator of rectangular heat dissipation part with locking hole of resin circuit board chip normal
11/03/2010CN201623110U Packaging structure of printed circuit board with flip chip, rectangular radiating block with locking hole and external radiator
11/03/2010CN201623109U Packaging structure of printed circuit board with flip chip and radiating block with locking hole connected with external radiating board
11/03/2010CN201623108U Resin wiring board chip mounted heat sink packaging structure externally connected with locking hole and heat dissipation block
11/03/2010CN201623107U Packaging structure of printed circuit board with flip chip and radiating block connected with external radiating board
11/03/2010CN201623106U Package structure of convex column external-radiator of heat dissipation part with locking hole of resin circuit board chip normal
11/03/2010CN201623105U Package structure of external heat-dissipating cap of heat dissipation part with locking hole of resin circuit board chip flip
11/03/2010CN201623104U External connection heat radiator encapsulation structure of resin circuit board chip positive mounting reverse T-shaped lock hole heat radiation block
11/03/2010CN201623103U Package structure for rectangular radiating block externally connected with radiator and inversed on chip with embedded inner lead
11/03/2010CN201623102U Printed substrate chip inverted heat dissipation cap packaging structure externally connected with locking hole and heat dissipation block and protruding column
11/03/2010CN201623101U Packaging structure of printed circuit board with chip and radiating block with locking hole connected with external radiating board
11/03/2010CN201623100U Packaging structure of printed circuit board with flip chip and radiating block with locking hole connected with external radiator
11/03/2010CN201623099U Packaging structure of printed circuit board with flip chip, radiating block with locking hole and convex column connected with external radiator
11/03/2010CN201623098U Packaging structure of printed circuit board with flip chip connected with external radiator
11/03/2010CN201623097U Inner foot-imbedded chip-inverted heat sink packaging structure externally connected with locking hole and heat dissipation block and protruding column
11/03/2010CN201623096U Package structure of external radiator of inversed T-shaped heat dissipation part of resin circuit board chip normal
11/03/2010CN201623095U Package structure of external radiator of rectangular heat dissipation part of resin circuit board chip flip
11/03/2010CN201623094U Package structure for radiating block externally connected with radiating cap and inversed on chip with exposed inner lead
11/03/2010CN201623093U Package structure for radiating block with convex surface inversed on chip with embedded inner lead and provided with locking hole
11/03/2010CN201623092U Completely-coated package structure for radiating block inversed on chip with exposed inner lead
11/03/2010CN201623091U Package structure for inverted T radiating block inversed on chip with exposed inner lead
11/03/2010CN201623090U Packaging structure with exposed inner pin, flip chip and heat dissipating block with rectangular locking hole
11/03/2010CN201623089U Package structure for rectangular radiating block inversed on chip with exposed inner lead
11/03/2010CN201623088U Package structure for inverted T radiating block inversed on chip with embedded inner lead
11/03/2010CN201623087U Normal chip packaging structure with exposed substrate and heat sink having locking hole
11/03/2010CN201623086U Normal chip packaging structure with exposed substrate and inverted T-shaped heat sink having locking hole
11/03/2010CN201623085U Normal chip packaging structure with exposed substrate and heat sink having projecting surface
11/03/2010CN201623084U Normal chip packaging structure with exposed substrate and heat sink
11/03/2010CN201623083U Normal chip packaging structure with exposed substrate and rectangular heat sink having locking hole
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